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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation) - 6月はプライド月間として、LGBTQ+の権利や文化、コミュニティについて啓発する世界的な活動月間です

特長

  • OE端子として、OE、PD#、PPS、DFCの制御機能の設定が可能
  • PLL帯域幅の設定が可能/ジッタピーキングを最小化
  • PPS:エンドデバイスのパワーダウン・モード時に電力を節約するプロアクティブ省電力機能
  • PPB:電力・性能バランス機能により、必要な性能に応じた最小限の電力消費を実現
  • DFC:動的周波数制御機能により、最大4つの差周波数を動的に切り替え可能
  • 65μA未満の超低消費電力を実現
  • 出力:1MHz~125MHz
  • スペクトラム拡散クロックに対応し、システムEMIの低減を実現
  • I²Cインタフェース
  • ソフトウェアツール Timing Commander™ に対応

説明

5L35023はVersaClock®プログラマブルクロックジェネレータで、低消費電力かつ、一般消費者用の高性能PCI Expressアプリケーション向けに設計されています。 5L35023デバイスは3つのPLLアーキテクチャ設計から成り、各PLLは個別にプログラム可能で、最大5つのユニーク周波数出力を実現します。

5L35023は、PPS(Proactive Power Saving)、PPB(Performance-Power Balancing)、ORT(Overshot Reduction Technology)、超低消費電力DCOなどの独自機能を内蔵しています。 OTPメモリを内蔵しているため、電源を入れた後、プログラミングを行わずにデバイスで設定を保持し、I²Cインタフェースから再度5L35023をプログラミングすることが可能です。

このデバイスはプログラマブルVCOとPLLソースの選択により、アプリケーションの要件に基づいた電力性能の最適化を可能にします。 また、LVCMOSとLPHCSLに準拠した3つのシングルエンド出力と2組の差動出力をサポートしています。 システムRTCの基準クロックとして、消費電流2μA以下をサポートする32.768kHzクロックに対応しています。

本デバイスは、ルネサス事業所でのプログラム書き込みが可能です。
カスタムプログラムユーティリティをお試しください。

パラメータ

属性
App Jitter CompliancePCIe Gen1, PCIe Gen2, PCIe Gen3
Outputs (#)7
Output TypeLVCMOS, LP-HCSL
Output Freq Range (MHz)0.032768 - 125
Input Freq (MHz)1 - 160
Inputs (#)1
Input TypeCrystal, LVCMOS, LVPECL, LVDS, HCSL
Output Banks (#)5
Core Voltage (V)1.8
Output Voltage (V)1.8
Product CategoryVersaClock 3S, General Purpose Clocks, Programmable Clocks

パッケージオプション

Pkg. TypePkg. Dimensions (mm)Lead Count (#)Pitch (mm)
VFQFPN4.0 x 4.0 x 0.9240.5

製品比較

5L350235P350215P350235L35021
Inputs (#)1111
Output TypeLP-HCSL, LVCMOSLP-HCSL, LVCMOS, LVDS, LVPECLLP-HCSL, LVCMOS, LVDS, LVPECLLP-HCSL, LVCMOS
Core Voltage (V)1.83.33.31.8
Output Voltage (V)1.81.8, 2.5, 3.31.8, 2.5, 3.31.8
Pkg. Dimensions (mm)4.0 x 4.0 x 0.93.0 x 3.0 x 1.04.0 x 4.0 x 0.93.0 x 3.0 x 1.0

アプリケーション・ブロック図

Interactive block diagram of the autonomous mobile robot system combines DRP-AI accelerator with Arm Cortex-R8 for real-time vision processing and system control.
自律走行搬送ロボット(AMR)
リアルタイム制御、スケーラブルな電力、コンパクトな設計を備えたAI対応AMRシステム。
Interactive block diagram of AI-powered service robot system features a high-end MPU and high-performance PMIC.
サービスロボット
スマート、安全、効率的なナビゲーションを実現するリアルタイム制御のAI搭載サービスロボットシステム。
AI dash camera interactive block diagram features a high-performance vision AI MPU with a power-efficient AI accelerator and HMI integration support.
AIダッシュボードカメラ
高性能ビジョン処理、ADAS、リアルタイムインテリジェント分析機能を備えたAI搭載ダッシュボードカメラ。
RZ/V2N Based Raspberry Pi Single Board Computer Block Diagram
RZ/V2NベースのRaspberry Pi シングルボードコンピュータ
4Kカメラ対応、効率的なAI処理、コンパクトなSBC設計の高性能ビジョンAIシステム
Wireless electronic gaming table block diagram integrates an MPU main board with an optional plug-in Wi-Fi 6 module and single 3.3V supply.
ワイヤレス接続型アーケードゲーム機
柔軟なWi-Fi 6システムは、3000Mbps、4x4 MIMO、デュアルバンド対応、シームレスな統合機能を提供します。
Scalable HMI SMARC SoM with AI Block Diagram
AI 搭載のスケーラブルな HMI SMARC SoM
マルチコア処理、高度なグラフィックス、スマートHMIのための安定な接続性を備えたスケーラブルなSoM。

このデバイスに組み合わせたい製品

更に設計開発を進めるための製品を探してみましょう

本デバイスは、ルネサス事業所でのプログラム書き込みが可能です。
カスタムプログラムユーティリティをお試しください。
型名状態サンプル長期供給在庫パッケージ参考価格(米ドル)Lead Count (#)Carrier TypeMoisture Sensitivity Level (MSL)Qty. per Reel (#)Qty. per Carrier (#)Pb (Lead) FreePb Free CategoryTemp. Range (°C)Country of AssemblyCountry of Wafer Fabrication
5L35023B-000NLGIActiveAvailable2040 Apr在庫ありVFQFPN1ku | $124#Tray10490#Yese3 Sn-40 to 85°CMALAYSIATAIWAN
5L35023B-000NLGI8ActiveN/A2040 Apr在庫切れVFQFPN1ku | $124#Reel12500#0Yese3 Sn-40 to 85°CMALAYSIATAIWAN
5L35023-000NLGIObsoleteN/A在庫ありVFQFPN24#Tray10490#Yese3 Sn-40 to 85°C
5L35023-000NLGI8ObsoleteN/A在庫切れVFQFPN24#Reel12500#0Yese3 Sn-40 to 85°C

このデバイスに組み合わせたい製品

更に設計開発を進めるための製品を探してみましょう

Renesas Boards & Kits

Partner Boards & Kits

SoM/SBC

Banana PI BPI-AI2H System on Module (SoM)

Developed in collaboration with Renesas, the Banana Pi BPI-AI2H system on module (SoM) is an open-source hardware solution based on the high-performance RZ/V2H Vision AI MPU. Powered by the RZ/V2H chipset, it delivers powerful edge AI performance with advanced DRP-AI acceleration, multi-core Arm® Cortex®-A55 processing, and rich multimedia and high-speed I/O support—ideal for next-generation vision AI and edge computing applications.
Banana Pi
SoM/SBC

Banana Pi BPI-AI2N System on Module (SoM) & BPI-AI2N Carrier

Developed in collaboration with Renesas, the Banana Pi BPI-AI2N SoM module and carrier board provide an open-source hardware platform based on the RZ/V2N Vision AI MPU. Supporting 8GB LPDDR4x, 32GB eMMC, and QSPI flash in a compact SO-DIMM 260-pin form factor, the platform enables open-source development through a complete kit including SOM, carrier board, accessories, and SDK. Hardware and software customization for OEM/ODM is supported, along with Yocto and other open-source operating systems.
Banana Pi
SoM/SBC

E1M-X V2N System on Module (SoM)

A high-performance, cost-effective system on module (SoM) for AI-driven vision applications, the E1M-X V2N SoM is based on the Renesas RZ/V2N. It features a quad Arm® Cortex®-A55 CPU (1.8 GHz) and integrated 4K encode/decode, optimized for vision workloads. Supporting up to eight cameras via 2×4-lane MIPI CSI-2, it offers optional Wi-Fi® 6/Bluetooth® 5, flexible memory, storage, and PHY configurations for broad application development.
RZ/V2N,5L35023,DA9292
Alp Lab AB
SoM/SBC

E1M-X V2N-M1

A high-performance, cost-effective system on module (SoM) for AI vision systems, the E1M-X V2N-M1 SoM is powered by the Renesas RZ/V2N with a quad Arm® Cortex®-A55 (1.8 GHz) CPU and a DeepX-M1 AI accelerator delivering 25 TOPS plus 4K encode/decode. Optimized for vision workloads, it supports up to eight cameras via 2×4-lane MIPI CSI-2 and offers optional Wi-Fi® 6/Bluetooth® 5, flexible memory, storage, and PHY options.
RZ/V2N,5L35023,DA9292
Alp Lab AB
SoM/SBC

HummingBoard RZ/V2N AIOT

Provides advanced edge intelligence for Industrial Internet of Things (IIoT) and Artificial Intelligence of Things (AIoT) applications, powered by the DRP-AI3 Neural Processing Unit (NPU) for high-efficiency, low-latency inferencing. Enables real-time vision and sensor fusion with a quad-core Arm® Cortex®-A55 and Cortex-M33. Supports industrial connectivity including RS232, RS-485, CAN-FD, dual Gigabit Ethernet, and wireless options. Delivers optimized Linux support for secure, long-term industrial deployment.
RZ/V2N,5L35023,RAA215300
SolidRun Ltd.
SoM/SBC

OSM Size M System on Module (SoM) for Industrial Applications

An open standard module compliant system-in-package based on Renesas RZ/G3E family architecture, the MSRZG3E offers high-performance dual/quad Arm® Cortex®-A55 cores combined with a Cortex-M33 core. Featuring compact design and a wide range of functions, it delivers low-power consumption, thermal efficiency, and low-cost for embedded systems. Built around two or four Cortex-A55 CPU cores with a Cortex-M33 CPU core and optional Ethos-U55 NPU.
ARIES Embedded GmbH
SoM/SBC

RZ/G3E DX-M1 System on Module (SoM)

The RZ/G3E DX-M1 system on module (SoM) combines a powerful Renesas RZ/G3E application processor with the DEEPX DX-M1 AI Booster to deliver high-performance edge and AI computing in a compact SOM form factor. Featuring quad Cortex-A55 cores, advanced multimedia support, dual display graphics, and 25 TOPS AI acceleration, it’s ideal for industrial, vision and HMI applications requiring efficient local inference and rich connectivity like PCIe, USB3, Ethernet and high-speed camera interfaces.
Virtium
SoM/SBC

RZ/G3E OSM-L

The RZ/G3E OSM‑L System‑on‑Module packs the Renesas RZ/G3E application processor into a compact OSM‑L form factor, combining quad Cortex‑A55 and Cortex‑M33 cores with a Mali‑G52 GPU and on‑chip Ethos‑U55 NPU for efficient edge and HMI computing. It supports dual‑display graphics, 4K video encode/decode, MIPI/parallel interfaces, Gigabit Ethernet, PCIe Gen3 and USB3.2 connectivity. Designed for industrial and multimedia applications, it delivers responsive performance with rich I/O and industrial temperature options.
Virtium
SoM/SBC

RZ/G3E System on Module (SoM)

The RZ/G3E system on module (SoM) delivers robust edge computing and rich human-machine interface (HMI) capabilities in a compact SOM form factor. Powered by the Renesas RZ/G3E application processor with four Cortex-A55 cores, Mali-G52 graphics and an on-chip Ethos-U55 NPU, it supports dual displays, high-speed video codecs, and versatile I/O including PCIe Gen3, USB3.2 and dual Gigabit Ethernet. Ideal for industrial, multimedia and edge AI applications, it accelerates development with integrated memory, storage and broad connectivity.
Virtium
SoM/SBC

RZ/V2H SMARC Module

SMARC 2.1 system on module (SoM) based on RZ/V2H Renesas SoC revolutionizes industrial automation with its powerful AI-driven vision processing capabilities, enabling faster and more accurate machine vision. The module’s unique combination of real-time processing, integrated AI acceleration, and extensive interfaces empowers manufacturers to develop next-generation autonomous systems reducing development time and complexity.
Tessolve
SoM/SBC

SOMDEVICES uSMARC RZ/V2N

SMARC v2.1 system on module (SoM) based on the Renesas RZ/V2N processor, enabling high-performance image processing and dynamic control using advanced artificial intelligence with excellent power efficiency. Supports high-speed interfaces such as PCIe, USB3.2, and Gigabit Ethernet. Introduces µSMARC®, a smaller form factor that remains fully functionally compatible with the SMARC standard.
SomDevices
SoM/SBC

TIA RZ/V2H

The new Engicam system on module (SoM) is designed for a wide range of applications, including machine vision, autonomous robotics, and factory automation. It is built on the Renesas RZ/V2H processor, which integrates a DRP-AI accelerator delivering 8 TOPS (dense) and up to 80 TOPS (sparse), along with a GE3D 3D GPU. The module also features 1x GbE and 1x RGMII connectivity, as well as quad 4-lane MIPI-CSI interfaces, enabling advanced vision capabilities and efficient data acquisition.
Engicam Srl
SoM/SBC

V2H 4X SBC

A compact single‑board computer (SBC) featuring high‑bandwidth 4‑lane PCIe Gen3 for real‑time edge AI and vision applications. It supports seamless connectivity to FPGAs, NPUs, and storage devices to offload compute‑intensive workloads and reduce latency. With four independent MIPI CSI interfaces, rich I/O, efficient power design, and a developer‑friendly layout, the V2H 4X SBC supports robotics, industrial automation, and autonomous systems, accelerating prototyping and deployment of advanced embedded solutions.
IMDT
SoM/SBC

V2H Single Board Computer (SBC)

Provides a carrier board that converts the system on module (SoM) into a compact, high‑performance single board computer (SBC). The cost‑effective small form factor design supports diverse applications including robotics, drones, and smart city systems. It supports flexible assembly options tailored to specific requirements, along with comprehensive onboard connectivity. The platform delivers an energy‑efficient solution with a minimal footprint, enabling powerful computing in space‑constrained environments.
IMDT
SoM/SBC

V2H System on Module (SoM)

Provides a cost‑effective embedded module powered by the Renesas RZ/V2H processor for AI‑driven vision applications. It supports four four‑lane MIPI CSI‑2 connections, enabling parallel attachment of up to four cameras. Customization options include onboard Wi‑Fi® and Bluetooth®, selectable memory and storage capacities, and flexible physical layer configurations. The module delivers a compact form factor and a complete hardware and software solution, supporting scalable and modular system design.
IMDT
SoM/SBC

V2N SMARC Module

SMARC 2.2 system on module (SoM) based on RZ/V2N Renesas SoC. The RZ/V2N is a high-performance vision AI MPU powered by Renesas’ DRP-AI3 accelerator, delivering up to 15 TOPS of AI performance. It features quad Arm® Cortex®-A55 CPUs with an Arm Cortex- M33, integrated ISP, and dual-channel MIPI® CSI-2® interfaces for efficient dual-camera processing. It is ideal for applications such as driver monitoring systems, surveillance cameras, and mobile robotics.
Tessolve