Overview
Description
The Renesas Flexible Software Package (FSP) is an enhanced software package designed to deliver user-friendly, scalable, high-quality software for embedded system designs using the Renesas RA family of Arm Microcontrollers, ensuring software compatibility across the RA family, from entry-level to high-performance microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.
download Download Latest FSP (v6.5.0):
FSP Platform Installer (Includes e² studio IDE, toolchain, and FSP packs):
RA Smart Configurator (RASC) Installer (FSP packages to use with 3rd party IDEs with IAR Embedded Workbench, Arm Keil MDK):
FSP Standalone Installer (FSP packs for the users who only update the FSP and no e² studio update):
- Download from the Assets section of the GitHub
The installation instructions can be found here. All the FSP Releases and Patches can be found on GitHub.
FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease the implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.
FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, including Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions. FSP and e² studio can be used free of charge on any Renesas device.
Features
- Multi-Core and Single Core support of Arm® Cortex®- M-based RA MCUs
- Small memory footprint HAL drivers
- Intuitive configurator and code generator
- Static and dynamic analysis using industry-standard tools
- Application support using RTOS and non-RTOS environments
- Azure RTOS and its middleware stacks with Flexible Software Package
- Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
- FreeRTOS support – Includes Kernel and set of software libraries
- FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
- Tool configurable RTOS resources (Threads, mutexes, etc.)
- Middleware stacks from Renesas and third parties
- Ethos-U55 support for CM85-based MCUs for efficient AI/ML integration
- TCP/IP and other connectivity protocol stacks including MQTT
- USB middleware support for CDC, HID, and MSC
- Wireless connectivity through Cellular (Cat-M1), Wi-Fi, and Bluetooth Low Energy LE 5.0 (BLE Mesh)
- File System support with FreeRTOS+FAT and LittleFS
- Storage (Block Media) support for SDMMC, SPI, and USB.
- Virtual EEPROM on Flash
- Capacitive touch middleware to implement widgets like Button, Slider, and Wheels.
- Motor control algorithms
- Secure Bootloader through MCUboot
- Sensor Module APIs
- TrustZone support (for applications on CM33-based MCUs)
- TrustZone-enabled drivers and middleware
- Easy-to-use tool support for TrustZone configuration
- PSA Level 2 Certified
- AWS-qualified for FreeRTOS
- Easy connectivity options to major cloud providers
- Secure connections through NetX Duo Secure and Mbed TLS
- Cryptographic APIs and integrated Hardware Acceleration support
- Arm PSA Cryptographic APIs
- Azure RTOS NetX Crypto APIs
- Ultimate security with FSP Crypto APIs (SCE9 protected mode)
- Oberon Ocrypto targeting low end RA2E1 devices
- TinyCrypt targeting constrained devices
- Graphics interface support and tools
- LVGL integration support for RA devices
- Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
- Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
- Secure debugging capabilities
- Extensive tool support from Renesas and leading third-party solutions
- Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, toolchain, and Segger J-Link drivers)
- Complete source code available through GitHub
Release Information
For additional information and links, go to GitHub.
v6.5.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.5.0.
Minimum e2 studio version for FSP 6.5.0 is e2 studio 2026-04.2
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.exe, from here.
Download the FSP with e2 studio Linux installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.xz.run, from here. Refer to the installation steps for information on installing e2 studio and related software components in a Linux PC.
Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.pkg, from here. Refer to the installation steps for information on installing e2 studio and related software components in a macOS PC.
If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.
- For Windows download: FSP RASC Windows Installer
- For Linux download: FSP RASC Linux Installer
- For Mac OS (Apple Silicon) download: FSP RASC macOS Installer
Post - FSP v6.5.0 changes to toolchain support
Future releases of FSP will no longer ship with the GCC toolchain integrated within the combined e2 studio/FSP platform installer. The use of the GCC toolchain with FSP will still be supported, and an option in the platform installer will allow GCC to be downloaded from the internet and installed as part of the overall install process. Alternatively, it is possible to link e2 studio to an installation of the GCC toolchain already on the user's computer.
Note: The LLVM toolchain/Arm Toolchain for Embedded (ATfE) will continue to be integrated within the e2 studio/FSP platform installer.
With FSP 6.3.0 and later, when using the LLVM toolchain, the compiler optimization level is set to -Os by default for RA4/RA6/RA8 MCUs, whereas previous FSPs would use -O2. This has been done as with LLVM, -Os causes a balance of optimizations similar to GCC's -O2 option.
Note that for RA0/RA2 MCUs, where keeping memory size to a minimum is typically of primary importance, the -Oz optimization level is selected by default.
All installers are available in the Assets section of this release.
Refer to the https://github.com/renesas/fsp/blob/master/README.md "README.md" in the FSP root folder for setup instructions, hardware details, and related links.
New Features
- MCUboot Solution Template Enhancements:
- Single‑Image MCUboot Templates:
- Added MCUboot single image solution template for RA6 CM4 devices (RA6M1, RA6T1, RA6M2, RA6M3) using mbedtls
- Added MCUboot single image solution template for cm33 devices (RA6M4, RA6M5, RA4M2, RA4M3) using mbedtls with crypto accelerator
- Added MCUboot single image solution template for cm33 devices (RA6M4, RA6M5, RA6E1, RA4M2, RA4M3, RA4E1) using mbedtls with crypto accelerator
- Added MCUboot single image solution template for CM85 devices using mbedtls with crypto accelerator
- MCUboot with MMF (Mirrored Memory Flash) Support:
- Added MCUboot single image solution template in MMF mode for RA6 CM4 devices (RA6M1, RA6T1, RA6M2, RA6M3) using mbedtls
- Added the MCUboot single image solution template in MMF mode for RA2A2 using mbedtls
- Multi‑Image MCUboot Templates:
- Added the MCUboot multi-image solution template in Overwrite mode for CM85 devices (RA8P1, RA8D2, RA8M2, RA8T2) using mbedtls
- Single‑Image MCUboot Templates:
- Middleware and Feature Additions:
- Added support for Host USB Video Class (HUVC) driver
- Updated LVGL graphic library to version v9.5.0
- Added support for LwIP SNMP application
- Added link detection support for all RMAC port from r_layer3_switch
- New Board and Package Support:
- Added support for EK-RA8P1, EK-RA8M2, EK-RA8D2 V2 board
- Updated FSP pin configuration support for:
- RA8M1, RA8M2 and RA8T1 (169‑BGA package)
- RA4L1 (72-WLCSP package)
- RA0E1 (20-TSSOP package):
- Removed the sub-clock and its pins from the FSP clock configuration and pin configuration
- Initialized the sub-clock related registers per TU
- Cryptography and Security Updates:
- Added HMAC-SHA3 224/256/384/512 feature for RSIP-E50D
- Added xDLMS InitiateRequest message decryption feature for RSIP-E11A
- Updated to MbedTLS version 3.6.6
Fixes and Improvements
- Added support to disable the TAU_PWM master-channel interrupt
- OFS register ZHUK is placed after PBPS
- Fixed the issue where the IPV settings are not applied to the VLAN and Layer 3 entries
- Support MAC table searches by source MAC address, destination MAC address, or both
- Added support for lwIP PPP configuration
- Updated the CCD setting description in r_ioport to notify users to enable CCD support when using CCD pins
- Improved CTSU2 diagnosis feature in r_ctsu
- Fixed issues in CTSU2 CCO correction for devices with certain characteristics (announced in R20TS1229EJ0100), and CTSU1 CCO correction for RA4M2 and RA4M3
- Fixed MPU region size check to avoid configuring zero size regions when D-Cache is enabled for RA8 devices
- RSIP Protected Mode driver improvements:
- Reduced code size for RSIP-E51A and RSIP-E50D PM drivers
- Updated control procedures for the RSIP-E11A PM driver to code size reduction version
- Updated CAVP certified module for RSIP-E31A PM driver due to re-acquisition of CAVP certification
- Bugs fixed:
- Buffer size of cert info and wrapped secret was not defined correctly when using brainpool curve
- Buffer size of input message was not defined correctly when using KDF-SHA 512
- Updated PQC-Lib V2.00 with stack overflow bug fix
- Fixed incorrect bit length for SCE9 PSA Crypto wrapped keys
- Updated description for RAMP in MDF
- Fixed link bug r_ether with ICS1894 PHY
- Updated IAR toolchain to v9.70.4
- Fixed build error when user custom PHY function is used on ESWM
- Fixed rm_motor_control callback issue when 2 motors are enabled
- rm_motor_pm_foc module:
- Fixed a unit typo where degree values were assigned to variables intended to be in radians
- Optimized the sine and cosine calculations in the transform function within the current control loop of rm_motor_pm_foc_inner
- Fixed typos in rm_motor_pm_foc.h:
- Renamed p_to_outer_active to p_to_inner_active in the outer module
- Renamed p_to_outer_copy to p_to_inner_copy in the outer module
- rm_motor_sensor module:
- Fixed a unit typo where degree values were stored in variables intended for radians
- Fixed an issue where the sign of e_q inverted during deceleration, causing a loss of value continuity and resulting in incorrect angle integration
- Added D-Cache enabled support for RA8 devices for below modules:
- DTC: Review DTC documentation for details
- SPI_B: Review SPI_B documentation for details
- SCI_B_SPI: Review SCI_B_SPI documentation for details
- SCI_B_UART: Review SCI_B_UART documentation for details
- Corrected the copyright notice errors in the CAVP module source files for RSIP-E31A
- Improved rm_psa_crypto SHA-256 code to handle message lengths that are multiples of 128 bytes
- Updated workaround document for e2 studio 2026-04 pin configuration tooling
- Updated the BSP usage notes and Cortex-M85 cache document with information relevant to DTC driver D-Cache support
- Fixed an error in the macro definitions that specify the sizes of the key buffer for SCE9 Key Injection
- Fixed pin output support enable when using the compare match feature
- LVGL updates:
- Enabled runtime control of the GPU (enable/disable)
- Fixed the screen lock issue when using Dave2D
- Set LV_USE_OBJ_NAME to enabled by default
- Fixed D-Cache enable and warmstart post-initialization call sequence in SystemInit()
- Corrected maximum configurable bitrate for R_SPI_B
- Updated procedures for RSIP-E51A
- ThreadX projects no longer globally disable GCC sign conversion warnings
- Fixed WDT security attribution not set in secure project in RA8x2
Known Issues
- Solution Projects (TrustZone, Multicore):
- There are issues related to pin configuration in e2 studio 2026-04.2. Refer to this document for workarounds
- RA0x devices:
- HS400x and ZMOD4xxx sensors cannot be used on RA0E1
- FS3000 sensor does not support SAU-I2C driver
- Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
- PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to a specific Linux OS (USB Host).
- EWARM version 9.70.4 does not contain support for RA0E3. To develop with IAR for these devices, it is necessary to install a support patch file for which can be downloaded by EWARM v9.70.4 users from the IAR MyPages system
- RA0E3 (arm_Renesas_RA0E3_20260106_1.zip)
- When importing projects in e2 studio that were created using a previous toolchain version, be sure that the version specified in the project is integrated (Window->Preferences->Renesas->Renesas Toolchain Integration) or select the appropriate toolchain version if upgrading the project to a later FSP version.
- When upgrading RA6T2 projects to FSP 6.4.0, the GTETRGx pin assignments might be lost; please re-assign the pins manually.
- When upgrading RA0E1/E2/L1 projects to FSP 6.4.0, the SAU_SPI00 pin group might be changed; please restore the pin group manually.
- For known issues in the tools, please refer to the respective tool's release notes e2 studio RN.
- Updated rm_psa_cryto header to allow using the functions in a CPP project
Target Devices
Downloads
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Documentation
Featured Documentation
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| Manual - Software |
PDF
51.49 MB
The Renesas Flexible Software Package (FSP) is an optimized software package designed to provide easy-to-use, scalable, high-quality software for embedded system design. The primary goal is to provide lightweight, efficient drivers that meet common use cases in embedded systems. This manual describes how to use the Renesas Flexible Software Package (FSP) for writing applications for the RA microcontroller series.
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| Manual - Software | ||
| Application Note |
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704 KB
The EK-RA2A1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2A1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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611 KB
The EK-RA2A2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2A2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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662 KB
The EK-RA2E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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641 KB
The EK-RA2E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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683 KB
The EK-RA2L1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2L1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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609 KB
The EK-RA2L2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2L2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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655 KB
The EK-RA4E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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738 KB
The EK-RA4M2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4M2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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736 KB
The EK-RA4M3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4M3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
PDF
681 KB
The EK-RA4W1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4W1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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661 KB
The EK-RA6E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
PDF
729 KB
The EK-RA6M1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
PDF
730 KB
The EK-RA6M2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
PDF
795 KB
The EK-RA6M3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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738 KB
The EK-RA6M3G example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M3G kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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786 KB
The EK-RA6M4 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M4 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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778 KB
The EK-RA6M5 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M5 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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594 KB
The FPB-RA0E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA0E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design. This is the application note for the FPB-RA0E1 example project.
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| Application Note |
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582 KB
The FPB-RA0E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA0E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
PDF
579 KB
The FPB-RA0L1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA0L1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
PDF
602 KB
The FPB-RA2E3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA2E3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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586 KB
The FPB-RA2T1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA2T1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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644 KB
The FPB-RA4E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA4E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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670 KB
The FPB-RA6E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA6E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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638 KB
The MCK-RA4T1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA4T1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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643 KB
The MCK-RA6T2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA6T2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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636 KB
The MCK-RA6T3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA6T3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
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672 KB
The RSSK-RA6T1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the RSSK-RA6T1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Application Note |
PDF
624 KB
The EK-RA4C1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4C1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
PDF
671 KB
The EK-RA4L1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4L1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
PDF
712 KB
The EK-RA4M1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4M1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
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748 KB
The EK-RA8D1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8D1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
PDF
704 KB
The EK-RA8D2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8D2 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
PDF
666 KB
The EK-RA8E2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8E2 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
PDF
736 KB
The EK-RA8M1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8M1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
PDF
693 KB
The EK-RA8M2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8M2 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
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719 KB
The EK-RA8P1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8P1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
PDF
575 KB
The EK-RA8T2 example project shows how to write code using various Flexible Software Package (FSP) modules supported by the EK-RA8T2 kit. The FSP provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design. This is the application note for the EK-RA8T2 example project.
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| Application Note |
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552 KB
Outlines the contents of the example project bundle for the FPB-RA0E3 kit. These example projects demonstrate how to develop code using the Renesas Flexible Software Package (FSP) modules supported by the kit.
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| Application Note |
PDF
632 KB
The FPB-RA8E1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA8E1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
PDF
700 KB
The MCK-RA8T1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA8T1 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
PDF
669 KB
The MCK-RA8T2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA8T2 kit. It includes multiple example projects that highlight peripheral usage and system functionality, while leveraging the optimized, scalable, and high‑quality FSP for embedded system design.
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| Application Note |
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3.01 MB
简体中文
Learn how to define the RA Family MCU debug capability and serial programming capability by the device lifecycle states. Device Lifecycle Management (DLM) is the management of the process by which a product goes from inception to development to production and then eventually end-of-life.
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| Application Note |
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834 KB
The S Cache on the system bus can significantly improve data access performance in Renesas RA Family Arm Cortex‑M33 MCUs when CPU speed exceeds SRAM performance. This application note explains S Cache architecture, configuration, coherency handling, and performance considerations, with example projects demonstrating cache control and optimization using the Renesas Flexible Software Package (FSP).
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| Application Note |
PDF
2.30 MB
Learn more about the guidelines for implementing vision AI applications using Renesas RA8P1 MCUs with Ethos-U NPU support. It can be used as a reference for developing other vision AI applications.
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| Application Note |
PDF
3.85 MB
Learn how Renesas MCU security is built around integrated security engines. The RA family includes various types, which can be identified in each MCU’s hardware manual. These engines operate in two modes: Compatibility and Protected. This application note defines both and outlines their use cases.
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| Application Note | Reference System Design for Vision AI on EK-RA8D1
Learn how the Renesas RA8 Series MCUs integrate Helium technology which boosts performance when running an Artificial Intelligence (AI) model. There are other supporting hardware features that can be used in an AI application project.
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| Application Note |
PDF
4.55 MB
日本語
Learn how to implement environmental sensor monitoring on the EK‑RA2L2 as a migration example of the RA2L2 MCU USB Type‑C reference design. This application note explains USB Type‑C CC detection and sensor data logging, and describes how to display date and time, temperature, humidity, illuminance, and USB connection status on a Pmod OLED.
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| Quick Start Guide | VK-RA8M1 Voice Application Combo (VAS, VCR) Quick Start Guide
The quick start guide and project file for VK‑RA8M1 guides developers to evaluate the voice AI application example combo of Voice Anti-Spoofing (VAS) and Voice Command Recognition (VCR).
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| Quick Start Guide | VK-RA8M1 Voice Application Combo (VAS, VCR, SID) Quick Start Guide
The quick start guide and project file for VK‑RA8M1 guides developers to evaluate the voice AI application example combo of Voice Anti-Spoofing (VAS), Voice Command Recognition (VCR), and Speaker ID (SID).
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| Quick Start Guide | VK-RA8M1 Voice Application Combo (APF, NLU, VAS, CNSV) Quick Start Guide
The quick start guide and project file for the VK‑RA8M1 guides developers to evaluate the voice AI application example combo of Audio Processing Front (APF), Natural Language Understanding (NLU), Voice Anti-Spoofing (VAS), and Speaker Verification (CNSV).
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| Quick Start Guide | Voice Kit RA6E1 Voice Application Combo (VAS, VCR) Quick Start Guide
The quick start guide and project file for the Voice Kit RA6E1 guides developers to evaluate the voice AI application example combo of Voice Anti-Spoofing (VAS) and Voice Command Recognition (VCR).
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| Quick Start Guide | Voice Kit RA6E1 Voice Application Combo (VAS, VCR, SID) Quick Start Guide
The quick start guide and project file for the Voice Kit RA6E1 guides developers to evaluate the voice AI application example combo of Voice Anti-Spoofing (VAS), Voice Command Recognition (VCR), and Speaker ID (SID).
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| Application Note |
PDF
2.60 MB
Learn how to implement an embedded webcam solution in the Renesas RA8 MCU, featuring an integrated Camera Engine Unit (CEU) and advanced networking capabilities.
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| Application Note |
PDF
2.83 MB
Learn multicore application project creation using the MCUboot module on the Renesas EK-RA8P1 kit using FSP v6.4.0, and recreate the bootloader and link the application projects to work with the bootloader using the FSP solution project. Understand the procedures for configuring an application to work with the bootloader, and for downloading and updating a new application image.
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| Application Note |
PDF
725 KB
Guides you in integrating the RA Family SCE7 module with the FSP Mbed Crypto middleware in your design. Explains how to add, configure, and use these components effectively, providing example code as a practical reference and starting point for secure application development.
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| Manual - Software | PDF 51.09 MB | |
| Quick Start Guide |
PDF
2.70 MB
Provides the fundamental knowledge needed to port example projects from one RA kit to another. It then demonstrates these principles by explaining how to port three example projects of varying levels of complexity from the MCK-RA4T1 to the FPB-RA4T1.
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| Application Note |
PDF
3.49 MB
This application project then walks the user through the updates to the bootloader to add encryption for the QSPI based secondary image storage. The application examples implemented image downloading to the QSPI secondary slot over USB PCDC. MCUboot with encryption also supports internal flash encryption.
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| Application Note |
PDF
4.16 MB
日本語
Featuring a 1GHz Arm Cortex-M85 and 250MHz Arm Cortex-M33, the RA8 dual-core MCU delivers high performance through asymmetric processing. The document explains the architecture, illustrates effective task partitioning, and provides practical use cases, demonstrating how developers can leverage both cores to optimize application throughput and responsiveness.
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| Application Note |
PDF
2.97 MB
Describes the operation of the Analog-to-Digital Converter (ADC) on the RA6T2, with a focus on the conversion methods that enable 16-bit depth resolution. This application note provides a background on oversampling techniques to increase A/D resolution, then dives into the specifics of the oversampling features built into the ADC on the RA6T2, covers the key configurations for capturing data in 16-bit depth mode, and details the important functions for ensuring proper operation.
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| Application Note |
PDF
3.23 MB
This application note walks the user through application project creation using the MCUboot module on Renesas EK-RA4M3 with external QSPI flash as the secondary image storage area. The application examples implemented image downloading to the QSPI secondary slot over USB PCDC. MCUboot with encryption also supports internal flash encryption.
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| Application Note |
PDF
3.87 MB
Presents the development of a graphics application for the RA8D1 MCU using the MIPI display on the EK-RA8D1 evaluation kit. This application note explains GUI design with SEGGER AppWizard and integration with e² studio using RA FSP, emWin, and FreeRTOS. The note also covers touch panel interfacing and discusses key design tradeoffs for optimizing graphics performance on the RA8D1 architecture.
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| Application Note |
PDF
810 KB
Provides an introduction to Virtual EEPROM (VEEPROM) technology, its intended use, and what is required to work through the example project as written.
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| Application Note |
PDF
6.16 MB
Clear, step‑by‑step instructions guide developers in building a secure bootloader using the MCUboot module with TinyCrypt, enhancing security for applications targeting Renesas RA0 and RA2 series MCUs. This application note also outlines project configuration requirements and system startup procedures.
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| Application Note |
PDF
4.46 MB
This thermostat application provides a reference for developing complex dual-core, multi-threaded applications with a touch screen graphical Human Machine Interface (HMI) by using Renesas FSP and Azure RTOS GUIX. It describes steps to create a basic GUIX for FSP, integrates touch driver, handles multiple hardware accesses across cores, manages system updates, and performs event handling.
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| Application Note |
PDF
2.35 MB
Learn how to inject plaintext keys into RA MCUs using various security engines operating in Compatibility Mode. This application note details the protection of the Root of Trust, emphasizing secure key storage through hardware unique keys (HUK) and isolated cryptographic operations within the security engine. The security engines support multiple cryptographic algorithms and key handling methods, enabling secure and efficient key management.
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| Application Note |
PDF
2.98 MB
MCUboot is a secure bootloader for 32-bit MCUs. It defines a common infrastructure for the bootloader, defines system flash layout on microcontroller systems, and provides a secure bootloader that enables easy software update. MCUboot is operating system and hardware independent and relies on hardware porting layers from the operating system it works with. This application note demonstrates secure bootloader design using this dual-bank feature for a non-TrustZone environment based on RA2A2.
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| Application Note |
PDF
5.17 MB
Explore the development of a graphics application built for the RA8D2 MCU, running on a MIPI graphics expansion board with the RA8D2 evaluation kit. This application note provides a comprehensive overview of key concepts and implementation techniques for building high-performance HMI applications using the RA8D2 MCU.
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| Manual - Development Tools |
PDF
2.92 MB
日本語
The Renesas EK-RA8M1 Evaluation Kit empowers developers to unlock the full potential of the RA8M1 MCU with a 480 MHz Arm Cortex-M85 core, advanced connectivity options, and rich ecosystem support. Featuring Ethernet, USB High-Speed, CAN FD, and Octo-SPI Flash, this versatile platform accelerates prototyping and innovation for high-performance embedded applications.
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| Manual - Software | PDF 48.07 MB | |
| Application Note |
PDF
402 KB
AI-generated Summary:
The document explains the two operational modes, highlighting their advantages and disadvantages, and provides practical guidance for selecting and using each mode. It also includes reference links to Renesas RA Family Application Projects that demonstrate these modes with detailed examples of the related FSP module usage.
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| Application Note |
PDF
6.72 MB
日本語
The following Renesas RA8 Series MCUs make available a First Stage Bootloader (FSBL), which is masked in ROM and can execute after reset to verify the OEM firmware programmed in the on-chip flash in the single-chip operating mode.
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| Application Note |
PDF
2.35 MB
AI-generated Summary:
This guide details the implementation of AWS IoT Core connectivity and OTA firmware updates on Renesas RA MCUs using the CK-RA6M5 v2 kit with Ethernet. It covers bootloader creation with MCUboot, MQTT/TLS setup, integration of AWS IoT Device SDK components, and secure authentication with X.509 certificates leveraging RA MCU hardware security. It also includes prerequisites, tools, and step-by-step instructions for building secure, cloud-connected applications with OTA updates.
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| Application Note |
PDF
8.33 MB
This guide details the objectives, architecture, and scope of OTA updates using AWS IoT OTA, and provides step-by-step instructions for preparing, executing, and validating firmware updates on the CK-RA6M5 v2 board. The project integrates three core components: a secure bootloader, a cloud connectivity application with downloader functionality, and AWS OTA cloud-side configurations for image storage and update initiation.
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| Application Note |
PDF
4.90 MB
The RA8 MCU has the Octal Serial Peripheral Interface (OSPI). This is the OSPI_B version of the OSPI peripheral module on the RA8 MCUs. The Decryption On-The-Fly (DOTF) peripheral on the RA8 MCUs enables secure external storage of application code or data on the OSPI memory.
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| Manual - Software | PDF 62.26 MB | |
| Application Note |
PDF
2.32 MB
IoT security relies on a cryptographic unique identity as a Root of Trust. This document introduces Renesas RA Family MCU security features, including the Renesas Secure IP (RSIP) engine, which can generate and securely store a private and public key pair for use with Public Key Infrastructure (PKI), ensuring the private key remains protected and never exists in plaintext outside the MCU.
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| Application Note |
PDF
1.50 MB
AI-generated Summary:
Low Power Modes (LPMs) reduce power consumption in RA2L1/RA2E1 microcontrollers by stopping the CPU while allowing selective peripheral operation. Four LPM types include Sleep, Software Standby, Snooze, and Deep Software Standby modes, each with different power-saving levels and peripheral availability. The document covers configuring LPMs, clock source changes at runtime, peripheral operation during LPM, and user interface control for mode transitions. It also explains power control modes, timer configurations, and debugging techniques to optimize battery life in embedded applications.
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| Application Note |
PDF
2.87 MB
AI-generated Summary:
Low Power Modes (LPM) reduce the effective power consumption of RA microcontrollers by stopping the CPU and selectively operating peripherals and oscillators. Four LPM types are supported: Sleep, Software Standby, Snooze, and Deep Software Standby modes, each offering different power savings and peripheral availability. The document details configuring LPMs, clock source changes at run-time, peripheral operations during LPM, and transitioning between modes. It includes example projects demonstrating LPM usage, FSP configuration steps, and debugging methods across various RA kits, enabling efficient low power application development.
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| Application Note |
PDF
189 KB
AI-generated Summary:
The Low Power Applications Package provides multiple application projects for Renesas RA family microcontrollers, including EK-RA2L1, EK-RA6M3, FPB-RA6E1, and FPB-RA4E1. It includes code and documentation for clock switching and operable long timer functions in low power modes. Users can access detailed application notes and example projects organized by device group. The package supports efficient low power management and offers links to product information, support forums, and software packages. It emphasizes reading included documents before use and outlines revision history and legal disclaimers related to product use and intellectual property.
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| Application Note |
PDF
1.51 MB
AI-generated Summary:
The document explains how to establish and protect unique device identities in IoT environments using RA Family MCUs with Arm TrustZone and Secure Crypto Engine 9 (SCE9). It details generating ECC key pairs, storing private keys securely, and creating device certificates to enable trusted authentication. The RA Family MCUs provide hardware security features such as TrustZone memory protection, flash block locking, and cryptographic support. The example implementation uses the EK-RA6M4 board and software tools like e2 studio IDE, RA Flexible Software Package, and SEGGER J-Link. The guide targets developers familiar with Renesas tools and cryptography, enabling secure device identity management in IoT applications.
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| Application Note |
PDF
1.38 MB
AI-generated Summary:
ADC interleaved mode doubles the data sampling rate by alternating conversions between two ADC units on the same input pin, synchronized via a General-Purpose Timer (GPT). Precise 180° phase alignment between ADC cores is critical to avoid spurious signals. Gain and offset mismatches between ADC cores can introduce errors but can be compensated digitally. The method enhances signal processing speed by combining outputs from two ADCs using DMA for efficient data transfer. The setup involves configuring ADC, GPT, and DMAC modules on Renesas RA MCUs, demonstrated with the EK-RA6M5 evaluation kit.
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| Application Note |
PDF
900 KB
AI-generated Summary:
Digital filters modify input signals by enhancing or attenuating specific frequency components. Infinite Impulse Response (IIR) filters use feedback to achieve filtering with fewer computations and shorter delays compared to Finite Impulse Response (FIR) filters. IIR filters are often implemented as cascaded biquad sections to maintain stability and achieve sharper frequency roll-offs. Various analog filter designs such as Butterworth, Chebyshev I & II, and Elliptical influence IIR filter characteristics. MATLAB tools assist in designing and extracting coefficients for these filters. The document details configuring and operating the IIR Filter Accelerator on the RA6T2 MCU to implement digital filtering efficiently.
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| Application Note |
PDF
976 KB
AI-generated Summary:
The document explains how to generate and precisely adjust PWM outputs with sub-nanosecond delay using the General PWM Timer Enhanced High-Resolution channels on RA6M3 MCUs. It details configuring the GPT timers, setting up the PWM Output Delay circuit to achieve timing accuracy of 260 picoseconds, and controlling rising and falling edges of PWM signals. The guide covers hardware setup with the EK-RA6M3 kit, software configuration via Renesas Flexible Software Package, and user interaction through push-button interrupts. Typical applications include power supply, motor control, and digital lighting.
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| Application Note |
PDF
4.21 MB
AI-generated Summary:
The document explains how to develop complex multi-threaded graphical applications with touchscreen Human Machine Interfaces (HMI) using the Renesas RA Flexible Software Package (FSP) and SEGGER AppWizard on the EK-RA6M3G kit. It covers setting up the board, integrating AppWizard projects, configuring peripherals like PWM backlight control, and leveraging FreeRTOS features such as threads and semaphores. The development environment is Renesas e2 studio, and the document details step-by-step procedures for building, importing, and running the graphics application. It also lists required software versions and hardware components, including the RA6M3 MCU and a 4.3-inch TFT LCD with capacitive touch.
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| Application Note |
PDF
3.64 MB
AI-generated Summary:
This document guides the development of a multi-threaded thermostat application featuring a touch screen graphical Human Machine Interface (HMI) using Renesas RA Flexible Software Package (FSP) and Azure RTOS GUIX. It covers creating GUIX projects, integrating touch drivers, managing hardware access, system updates, and event handling. It details tool installation, project creation, hardware setup, and controlling LCD backlight via PWM. The development environment includes e2 studio IDE, FSP, and Azure RTOS GUIX Studio. The document assumes familiarity with RTOS concepts and multi-threaded programming.
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| Manual - Software | PDF 46.60 MB | |
| Manual - Software | PDF 43.56 MB | |
| Application Note |
PDF
4.03 MB
AI-generated Summary:
Custom drivers for Renesas RA MCUs enable direct hardware register access, offering flexibility beyond the standard Flexible Software Package (FSP) drivers. This guide explains a three-step workflow: creating an FSP reference project, developing custom driver code, and integrating these drivers into a minimal Board Support Package (BSP) project. It focuses on low-level register programming, especially for RA0 and RA2 MCUs, using the FPB-RA0E1 device as an example. The guide covers project setup, peripheral configuration, clock and interrupt management, and debugging techniques to help advanced embedded developers design tailored, efficient applications.
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| Manual - Software | PDF 42.64 MB | |
| Application Note |
PDF
1.75 MB
AI-generated Summary:
Instructions guide the creation and integration of custom Flexible Software Package (FSP) modules into e2 studio. Key steps include establishing the module file structure, editing the .pdsc path description file, configuring tooling support, and modifying module description files before packaging into a .pack file. The FSP supports scalable embedded system development with modular components such as HAL drivers, middleware, RTOS, and BSPs. The document emphasizes maintaining Renesas programming standards and middleware hierarchy to ensure compatibility and smooth integration.
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| Manual - Software | PDF 41.78 MB | |
| Application Note |
PDF
6.28 MB
AI-generated Summary:
MCUboot provides a secure bootloader framework for 32-bit MCUs, enabling secure booting and fail-safe firmware updates. The RA8 MCU family supports a dual bank code flash feature that simplifies firmware updates by allowing bank swapping. This design leverages MCUboot integrated in Renesas Flexible Software Package (FSP) to create a Root of Trust and manage secure bootloading and application updates. Example projects for RA8M1 demonstrate secure bootloader creation, application signing, debugging, and firmware update processes using dual bank mode. The document also details development tools, hardware requirements, and step-by-step instructions for implementing and evaluating secure bootloaders with MCUboot and dual bank flash.
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| Application Note |
PDF
6.08 MB
AI-generated Summary:
The document details the implementation of Arm TrustZone technology on Renesas RA8 MCUs with Cortex-M85 cores, focusing on hardware and software security features. It guides secure system design using TrustZone, including IP protection use cases and device lifecycle management. It covers development tools like e2 studio, IAR EWARM, and Keil MDK, and provides step-by-step instructions for secure and non-secure project development. The document also explains security attribution units, memory and peripheral security, and best practices for TrustZone-enabled software development.
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| Manual - Software | PDF 41.42 MB | |
| Application Note |
PDF
2.85 MB
AI-generated Summary:
MCUboot provides a secure bootloader infrastructure for 32-bit MCUs, enabling secure booting and fail-safe application updates. It supports multiple update strategies—Overwrite, Swap, and Direct Execute-In-Place (DXIP)—each with distinct advantages and memory requirements. The bootloader authenticates firmware images using RSA or ECDSA signatures and SHA-256 hashing. Integration with Renesas Flexible Software Package (FSP) allows easy MCUboot deployment across RA Family MCUs, supporting TrustZone-based security. Example projects demonstrate multi-image and single-image configurations on EK-RA6M4 and EK-RA6M3 kits. The document guides hardware setup, software configuration, project creation, signing, and debugging to implement secure bootloader solutions.
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| Application Note |
PDF
5.25 MB
AI-generated Summary:
The document guides the development of a multi-threaded thermostat application with a touch screen GUI using Renesas RA MCUs, Azure RTOS GUIX, and the Flexible Software Package (FSP). It covers setting up the parallel LCD display, integrating touch drivers, managing hardware access, and implementing system updates and event handling. The guide includes steps for project creation, enabling SDRAM for GUIX storage, configuring timers for backlight control, and debugging. It supports rapid development of connected IoT devices with secure, production-ready drivers and middleware stacks such as Ethernet and USB. The package includes PCB design files like BOM, schematics, and Gerber files for hardware integration.
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| Application Note |
PDF
2.49 MB
AI-generated Summary:
Steps to add support for new UART-based Wi-Fi modules on Renesas RA MCUs using the Flexible Software Package (FSP) are detailed. It covers Wi-Fi driver architecture, APIs for TCP/IP communication, UART drivers, and FreeRTOS stream buffers. The document explains FSP components including Board Support Package, HAL drivers, libraries, RTOS, and middleware. It guides creating custom FSP user packs and modifying XML files for new modules. Development and testing procedures use Sierra Wireless BX310x and EK-RA6M3 kits as references.
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| Application Note | PDF 4.52 MB 简体中文 | |
| Application Note |
PDF
163 KB
AI-generated Summary:
The FPB-RA4T1 Example Project Bundle provides sample code demonstrating the use of Renesas Flexible Software Package (FSP) modules for embedded system design. It supports multiple toolchains including e2studio with GCC ARM, Keil MDK, and IAR EWARM. The FSP offers scalable, efficient drivers with uniform APIs and detailed documentation, enabling optimized application development across RA family MCUs. The bundle includes example projects compatible with various toolchains and guides for usage and porting. Support resources and product information are accessible via Renesas websites. The document also outlines product quality grades, usage restrictions, and legal disclaimers.
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| Application Note |
PDF
163 KB
AI-generated Summary:
The FPB-RA6T3 Example Project Bundle provides example code for developing applications using Renesas Flexible Software Package (FSP) modules compatible with the FPB-RA6T3 kit. It supports multiple toolchains including e2studio with GCC ARM, Keil MDK, and IAR EWARM. The FSP offers scalable, efficient drivers with uniform APIs and detailed documentation, enabling optimized embedded system designs across RA family MCUs. The bundle includes QuickStart projects and guidance for usage and porting. Support resources and product information are available through Renesas websites. The document also outlines product quality classifications, usage restrictions, and legal disclaimers.
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| Application Note |
PDF
3.78 MB
AI-generated Summary:
The RA2E1 and RA2E2 MCUs enable low-power data logging by using ADC, DTC, ELC, and low-power modes such as Snooze and Software Standby. Sensor data is acquired periodically, compared against thresholds, and stored. If data exceeds thresholds, the MCU exits low-power mode to transmit data via UART. The system minimizes CPU activity to reduce power consumption, making it suitable for applications like fitness trackers and fleet devices. Hardware and software resources include Renesas RA kits, Grove sensors, e2 studio IDE, and FSP. The document details mode transitions, peripheral usage, and data handling for efficient low-power operation.
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| Application Note |
PDF
1.19 MB
日本語
AI-generated Summary:
The document explains how to connect Renesas RA MCUs to AWS IoT Core using MQTT over TLS via cellular networks. It covers configuring AWS IoT Core, using MQTT/TLS modules, and integrating AWS Core MQTT, Mbed TLS, and cellular socket wrappers. The guide includes hardware and software requirements, cloud dashboard monitoring, device management, and security features like X.509 certificates and encryption. It targets developers building secure IoT applications with cellular connectivity on RA6M5 MCUs.
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| Application Note |
PDF
3.28 MB
AI-generated Summary:
The document explains how to calibrate the high-speed on-chip oscillator (HOCO) frequency using the clock frequency accuracy measurement circuit (CAC) on the RA2E3 MCU. It details adjusting the HOCO trimming register (HOCOUTRM[7:0]) to compensate for frequency deviations caused by environmental factors. The calibration process uses CAC's compare-match interrupt to measure HOCO frequency and update the trimming register to maintain accuracy within ±0.1%. The document also covers hardware and software requirements, operation conditions, peripheral functions, and sample code structure for implementing the calibration.
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| Manual - Software | PDF 40.84 MB | |
| Manual - Software | PDF 40.88 MB | |
| Quick Start Guide | PDF 1.01 MB | |
| Tool News - Note | PDF 146 KB 日本語 | |
| Application Note | PDF 797 KB | |
| Application Note |
PDF
2.60 MB
AI-generated Summary:
MCUboot provides a secure bootloader framework for 32-bit MCUs, enabling firmware integrity verification and secure updates. It supports multiple image upgrade methods—Overwrite, Swap, Direct execute-in-place (XIP), and RAM loading—each with distinct advantages and limitations. The RA2 MCU series uses MCUboot integrated with TinyCrypt for optimized cryptographic support, addressing limited memory constraints. The document guides creating and configuring bootloader projects, handling application updates, and running example projects on the EK-RA2E1 evaluation kit. It details development tools, hardware requirements, and best practices for secure bootloader deployment on Renesas RA2 MCUs.
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| Manual - Software | PDF 40.43 MB | |
| Application Note |
PDF
993 KB
AI-generated Summary:
Power management techniques optimize energy consumption and extend battery life in embedded systems using RA8 MCUs. Key methods include low power and CPU sleep modes, power gating, frequency and clock gating, multiple voltage and power domains, and voltage/frequency scaling. Efficient hardware PCB design and firmware optimization further reduce power usage. RA8 peripherals like DMAC, DTC, and ELC support power-saving operations. The document details these features, design considerations, and practical techniques for minimizing power consumption in RA8-based applications.
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| Application Note |
PDF
3.90 MB
AI-generated Summary:
MCUboot provides a secure bootloader framework for 32-bit MCUs, enabling secure booting and fail-safe firmware updates using internal code flash. It supports multiple update strategies including Overwrite, Swap, and Direct Execute-in-Place (DXIP), each with distinct advantages and trade-offs. The bootloader authenticates firmware images using RSA or ECDSA signatures and SHA-256 hashing. Integration with Renesas Flexible Software Package (FSP) simplifies creating a Root of Trust and supports TrustZone-based designs. Example projects demonstrate usage on EK-RA4M3 kits with FSP v5.2.0, covering multi-image and single-image configurations. Development requires e2 studio IDE, FSP, SEGGER J-Link, and Python. The document guides through project setup, bootloader creation, application signing, and update modes, providing a comprehensive framework for secure firmware management on Renesas RA MCUs.
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| Application Note |
PDF
1.37 MB
AI-generated Summary:
The Renesas RA8 MCU with Arm® Cortex®-M85 core and Helium™ technology delivers enhanced performance for DSP and machine learning applications. It leverages Single Instruction Multiple Data (SIMD) via Helium™ vector extensions, supporting both integer and floating-point operations. The MCU runs up to 480 MHz, featuring up to 2 MB flash, 1 MB SRAM with Tightly Coupled Memory (TCM), and advanced peripherals like Ethernet, USB, and security functions. Performance improvements utilize TCM, data caches, and optimized toolchains including LLVM and Renesas Flexible Software Package. The document includes application examples demonstrating vector multiply-accumulate instructions and benchmarking results to highlight performance gains.
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| Application Note |
PDF
1.22 MB
AI-generated Summary:
CAN FD extends the original CAN protocol to support higher data rates (up to 8 MHz) and larger payloads (up to 64 bytes), enabling efficient real-time communication between multiple processors in automotive, industrial, and consumer applications. It maintains compatibility with CAN by performing arbitration at 1 MHz, then switching to higher speeds for data transmission. This example uses Renesas RA4E2 and RA6E2 MCUs with CAN FD peripherals, demonstrating project setup, communication, and enhancements using Renesas' Flexible Software Package (FSP) and e2 studio IDE. The document covers CAN FD fundamentals, example projects, testing, modifications, and API details.
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| Application Note |
PDF
2.54 MB
AI-generated Summary:
Secure Data at Rest protection focuses on safeguarding inactive data stored within embedded systems using RA MCUs. It employs Data Encryption and Data Access Control to protect sensitive information in volatile and non-volatile memory, including internal flash and SRAM. The Security MPU and Flash Access Window (FAW) features enable read, write, read/write, write-once, and combined write-once/read protections. These mechanisms reduce attack surfaces by controlling access permissions and preventing unauthorized modifications. The document details configuration methods, operational flows, and example projects to implement these protections effectively in embedded applications.
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| Manual - Software | PDF 37.97 MB | |
| Application Note |
PDF
9.11 MB
日本語
, 简体中文
AI-generated Summary:
Guidelines explain migrating Renesas RA MCU projects from e2 studio IDE to IAR Embedded Workbench and Keil MDK. The process covers IDE configuration, installation of RA Standalone Configurator (RASC), Flexible Software Package (FSP), patch/DFP installation, creating blank template projects, adding source code, adjusting compiler options, building projects, and debugging. Users must test thoroughly due to compiler differences. Installation steps for RASC include selecting installation scope, directory, agreeing to terms, and verifying installed folders. The document targets users familiar with e2 studio, FSP, and other IDEs, aiming to extend project support across multiple development environments.
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| Flyer | PDF 412 KB | |
| Application Note |
PDF
35.58 MB
日本語
AI-generated Summary:
The document guides users through creating a two-screen GUI application using Azure RTOS GUIX Studio on the EK-RA8D1 kit. It covers setting up the MIPI display controller, touch screen driver, and semaphores for task communication. The guide includes project creation, driver configuration, GUI design, and basic debugging using Renesas Flexible Software Package (FSP) with Azure RTOS ThreadX and GUIX libraries. Required tools include e2 studio IDE, FSP v5.1.0+, and GUIX Studio v6.3.0.1+. The bundled software files include source code for touch drivers and system threads. The document supports rapid embedded GUI development with touch interaction on Renesas RA MCUs.
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| Application Note |
PDF
5.76 MB
AI-generated Summary:
Instructions guide users to run an AWS cloud connectivity project on the CK-RA6M5 board using a Cellular interface. It covers importing, building, and loading the MQTT/TLS application with the Renesas e2 studio IDE and Flexible Software Package v5.0.0. Detailed steps include hardware setup, SIM activation, serial console connection, and AWS IoT configuration. The document emphasizes prerequisites like familiarity with MQTT/TLS, cellular modems, and Renesas development tools. It also explains programming methods, connection settings, and debugging tips to enable seamless cloud communication via LTE Cat-M1 cellular modules.
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| Application Note | PDF 5.24 MB | |
| Quick Start Guide | PDF 2.98 MB | |
| Application Note |
PDF
20.47 MB
日本語
AI-generated Summary:
Create a simple two-screen GUI using Azure RTOS GUIX Studio for the EK-RA8D1 kit. Configure the Renesas Flexible Software Package (FSP), which integrates Azure RTOS ThreadX, GUIX library, and hardware drivers, to enable rapid embedded application development. Set up GLCD controller, touch screen driver, and semaphores for task communication. Develop the project in e2 studio with FSP v5.1.0 and GUIX Studio v6.2.1.0. The application responds to touch inputs, demonstrating basic GUI functionality. The package includes source code files and instructions for hardware setup, project creation, and debugging. Download tools and install required software versions before starting development.
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| Manual - Software | PDF 37.70 MB | |
| Manual - Software | PDF 37.12 MB | |
| Application Note |
PDF
10.24 MB
AI-generated Summary:
The document explains how to update the RYZ012 Bluetooth LE module firmware via BLE radio OTA using an EK-RA4M2 board as the host MCU. It details hardware and software requirements, including the EK-RA4M2 kit, PMOD Expansion Board, e2 studio IDE, and TelinkBleOTA app. The firmware update process uses Serial Port Profile (SPP) communication between the host MCU and RYZ012 module. It covers assembly instructions, software setup, and troubleshooting tips for a successful OTA firmware update. The document also provides guidance on project import, build, execution, and BLE initialization.
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| Application Note |
PDF
9.01 MB
AI-generated Summary:
The firmware update process enables the host MCU to program the RYZ012 Bluetooth LE module via a Serial Port Profile (SPP) communication interface. Using the EK-RA4M2 board connected to the RYZ012 PMOD Expansion Board, the host MCU transfers and installs firmware updates to adapt to evolving system requirements. The update requires specific hardware, including the EK-RA4M2 kit, RYZ012 PMOD board with firmware v5.4 or later, and a Windows 10 PC. Software tools include e2 studio IDE, Renesas Flexible Software Package, QE for BLE, SEGGER J-Link RTT Viewer, Tera Term, and GATT Browser. Assembly involves connecting the RYZ012 PMOD to the EK-RA4M2 via PMOD connectors and configuring jumpers for USB communication. The document details the update procedure, project setup, software architecture, and troubleshooting tips for reliable firmware programming.
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| Manual - Software | PDF 35.80 MB | |
| Application Note |
PDF
1.86 MB
日本語
AI-generated Summary:
Firmware upgrade for the RYZ024A module occurs via a host MCU using the RA6M5 on the EK-RA6M5 board. The RYZ024A connects through a PMOD Expansion Board, and firmware files reside on a USB flash drive linked to the EK-RA6M5's USB FS connector. The host MCU transfers the firmware from the USB drive to the RYZ024A, enabling upgrade. The process involves UART communication, USB file access, and specific microcontroller peripherals and FSP modules. The document details hardware/software requirements, peripheral functions, FSP module usage, directory structure, and API commands for executing the upgrade.
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| Application Note |
PDF
1.93 MB
日本語
AI-generated Summary:
The document details a self-test library designed for Renesas RA Family MCUs with Arm Cortex-M33 cores, supporting IEC60730 Class-C safety standards. It covers software routines for CPU instruction decoding, CPU registers, internal memory (ROM and RAM), system clock, and watchdog timer tests. The library operates within Arm TrustZone's secure area to ensure reliable and safe operation by performing tests at startup and periodically during runtime. It includes APIs for anomaly monitoring and separates secure and non-secure code areas. The package includes sample code and a VDE certification certificate, facilitating compliance with household appliance safety requirements.
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| Manual - Software | PDF 35.71 MB | |
| Manual - Software | PDF 35.50 MB | |
| Manual - Software | PDF 35.19 MB | |
| Manual - Software | PDF 34.41 MB | |
| Manual - Software | PDF 34.12 MB | |
| Application Note |
PDF
3.82 MB
AI-generated Summary:
The RA4W1 Group BLE sample application demonstrates Bluetooth Low Energy communication using the RA4W1 device. It covers BLE features, software architecture, protocol stack, and detailed demo project usage including building, debugging, and behavior of GATT Server and Client projects. The document provides implementation examples for various environments such as BareMetal, FreeRTOS, and Azure RTOS, detailing task management, event handling, and API usage. It also includes instructions for creating new projects, configuring BLE modules, managing device-specific and security data, and offers comprehensive support for BLE development with RA4W1.
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| Application Note |
PDF
1.61 MB
AI-generated Summary:
The RA2E2 microcontroller interfaces with the ZMOD4410 sensor module to measure indoor air quality by detecting total volatile organic compounds (TVOC) and estimating carbon dioxide levels. The ZMOD4410 integrates a gas sensing element with a CMOS signal conditioning IC, communicating via I2C. The RA2E2 Fast Prototyping Board supports rapid development with built-in debugging, Arduino Uno and Pmod™ interfaces, and extensive pin access. The RA2E2 MCU features an Arm Cortex-M23 core at up to 48 MHz, multiple communication interfaces including SCI, SPI, and I3C, 64 KB flash memory, and various safety and security functions. Applications include HVAC, air purifiers, thermostats, and smart building controls. The document details hardware schematics, software environment, sensor middleware integration, and operational instructions.
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| Manual - Software | PDF 34.05 MB | |
| Application Note | PDF 793 KB | |
| Manual - Software | PDF 33.42 MB | |
| Application Note |
PDF
1.64 MB
AI-generated Summary:
The document explains how to connect Renesas RA MCUs (RA6M3/RA6M4/RA6M5) to Microsoft Azure IoT Cloud using MQTT over TLS. It details the integration of RA Flexible Software Package (FSP) MQTT/TLS modules with the Azure IoT SDK for Embedded C, enabling secure device provisioning, registration, and data exchange via Azure IoT Hub and Device Provisioning Service (DPS). It outlines required development tools, hardware, and prerequisites, and provides step-by-step guidance for building, running, and validating the application on the EK-RA6M5 kit. The document also covers IoT Cloud architecture, MQTT/TLS protocols, and security considerations, serving as a practical reference for embedded developers targeting Azure IoT connectivity.
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| Manual - Software | PDF 33.13 MB | |
| Application Note |
PDF
1.82 MB
AI-generated Summary:
The document explains how to connect Renesas RA MCUs to AWS IoT Core using MQTT and TLS protocols for secure cloud communication. It covers configuring the Flexible Software Package (FSP) modules, including Core MQTT, Mbed TLS, and secure sockets, to enable encrypted data exchange over Ethernet. The guide details setting up AWS IoT Core, generating device certificates, and running an example application on the EK-RA6M3 development kit. It emphasizes MQTT’s lightweight publish/subscribe model and TLS’s role in ensuring data privacy and integrity. Developers learn to integrate secure cloud connectivity into IoT devices using RA MCUs and AWS services.
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| Manual - Software | PDF 32.29 MB | |
| Manual - Software | PDF 28.84 MB | |
| Application Note |
PDF
5.08 MB
AI-generated Summary:
The document guides users through creating a two-screen GUI application using Azure RTOS GUIX Studio on the EK-RA6M3G kit. It covers setting up the Renesas Flexible Software Package (FSP), including ThreadX RTOS, GUIX library, and hardware drivers. Users learn to configure the GLCD controller, touch screen driver, and semaphores for task communication. The guide details installing required tools, creating projects, enabling backlight, and integrating pre-written source code. It also explains basic debugging and GUI creation steps, enabling touchscreen interaction with a simple graphical interface. The zip download includes source files: touch_ft5x06 folder, hal_entry.c, system_thread_entry.c, touch_thread_entry.c, and windows_handler.c.
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| Manual - Software | PDF 27.16 MB | |
| Manual - Software | PDF 26.47 MB | |
| Manual - Software | PDF 24.72 MB | |
| Manual - Development Tools | PDF 7.24 MB 日本語 | |
| Manual - Software | PDF 24.57 MB | |
| Manual - Software | PDF 23.77 MB | |
| Manual - Software | PDF 21.96 MB | |
| Application Note |
PDF
2.78 MB
AI-generated Summary:
The document explains a motor failure detection system using TensorFlow on the RA6T1 MCU. It integrates motor control and AI-based fault detection by analyzing three-phase motor current via a trained neural network. The system uses FFT preprocessing and a fully connected neural network to identify abnormal motor load conditions. The demo kit includes hardware and software tools for data collection, model training, and motor control. The AI inference runs alongside motor control on a single MCU, improving maintenance efficiency and operational reliability.
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| Application Note |
PDF
1.64 MB
AI-generated Summary:
Trusted Firmware-M (TF-M) integrates with Renesas Flexible Software Package (FSP) v2.0.3 to implement Arm Platform Security Architecture (PSA) specifications on Renesas RA Family MCUs. It supports PSA Certified Level 2 security, providing a secure execution environment using Arm TrustZone technology for Cortex-M33 devices. The package includes tools and hardware requirements for development and demonstrates secure firmware updates. TF-M offers a reference implementation of PSA Functional APIs, enabling secure IoT device design, reducing development complexity, and increasing security confidence through certification.
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| Manual - Software | PDF 21.60 MB | |
| Manual - Software | PDF 21.64 MB | |
| Manual - Software | PDF 21.26 MB | |
| Application Note |
PDF
1.78 MB
AI-generated Summary:
The solution demonstrates how to connect Renesas RA MCUs to Microsoft Azure IoT Central using MQTT/TLS over Wi-Fi or Ethernet. It reads on-chip temperature sensor data and publishes it to Azure IoT Core, while also subscribing to LED control commands to toggle LEDs remotely. The project uses Renesas Flexible Software Package (FSP) with embedded Azure C SDK, supporting secure device provisioning and communication. Hardware includes EK-RA6M3 evaluation kit, Wi-Fi PMOD or Ethernet, and a Windows PC. Software requirements cover e2 studio IDE, FSP, GCC toolchain, SEGGER J-Link, and terminal software. Users should have basic knowledge of MQTT/TLS and Renesas development tools.
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| White Paper |
PDF
1.98 MB
Automation in homes, buildings, and industries increasingly relies on electric motors. Renesas addresses design challenges with the RA6T1 microcontroller, offering high-precision motor control, reduced costs, and faster development. Paired with evaluation boards and the Motor Workbench 2.0, this solution simplifies motor control implementation, enabling efficient, secure, and innovative designs.
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| White Paper |
PDF
1.38 MB
日本語
, 简体中文
Security is essential for all electronics, from wireless sensors to industrial motor controllers. This paper introduces the Arm® TrustZone® system-wide approach to protecting embedded devices and software. It also explains how Renesas RA Family MCUs implement TrustZone to balance security, performance, and power efficiency across various use cases.
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| Application Note |
PDF
1.11 MB
AI-generated Summary:
Arm® TrustZone® technology divides RA Family microcontrollers into Secure and Non-Secure partitions, enabling secure application development by isolating memory and resources. Secure code accesses both partitions, while Non-Secure code accesses Secure resources only through Non-Secure Callable (NSC) gateways. Development involves creating separate Secure and Non-Secure projects or a Flat project without TrustZone. The RA Project Generator simplifies project setup, managing security attributes, peripheral access, and debugging configurations. Secure code initializes critical functions and controls access, while Non-Secure code interacts via guarded NSC drivers. The document details workflows, memory partitioning, calling conventions, and tooling support for efficient TrustZone implementation.
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| Manual - Software | PDF 20.22 MB | |
| Application Note |
PDF
645 KB
AI-generated Summary:
Steps to migrate existing RA projects to newer FSP versions include installing the latest FSP packs, importing projects into e2 studio, Keil µVision, or IAR EWARM, and configuring projects to use updated software components. The process covers downloading and installing updated software packages, importing project files, selecting appropriate FSP versions, and building and running projects. Detailed instructions guide users through workspace setup, project import, configuration updates, and tool integration for seamless migration across supported RA devices and evaluation kits.
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| Manual - Software | PDF 18.60 MB | |
| Manual - Software | PDF 18.36 MB | |
| Manual - Software | PDF 17.26 MB | |
| Manual - Software | PDF 16.30 MB | |
| White Paper |
PDF
196 KB
日本語
, 简体中文
Securing connected devices is more critical than ever, yet no single method addresses every vulnerability. This paper explores key approaches to securing internet communication in embedded systems, outlining the trade-offs developers face when balancing cost, development time, and implementation complexity.
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| White Paper |
PDF
178 KB
日本語
, 简体中文
This paper explores methods for safeguarding data within an MCU or application, using example scenarios to evaluate different levels of security implementation. It helps developers assess threats and select the appropriate level of data protection based on specific application requirements.
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| White Paper |
PDF
169 KB
日本語
, 简体中文
Security means different things depending on the application, but all MCU-based products must address risks such as code theft, device cloning, unauthorized access, and system hijacking. This paper introduces key security concepts in the context of embedded systems and outlines practical approaches to implementing protection in microcontroller-based designs without relying on complex terminology.
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| Manual - Software | PDF 9.72 MB | |
| Manual - Software | ZIP 265 KB | |
| White Paper |
PDF
1.38 MB
日本語
Ensuring security for embedded IoT designs can be challenging and time-consuming, even for experienced developers. Explore six common security challenges and discover how Renesas offers a platform-based approach that leverages the latest advances in both hardware and software to deliver comprehensive, multilayered protection.
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178 items
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Design & Development
Sample Code
Sample Code
Filters
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| Type | Title | Date Date |
| Sample Code | EK-RA2A1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA2A1]
ZIP
8.82 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA2A1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2A1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA2A2 Example Project Bundle
The EK-RA2A2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2A2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA2E1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA2E1]
ZIP
6.16 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA2E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA2E2 Example Project Bundle
[Software=RA FSP],[Board=EK-RA2E2]
ZIP
6.12 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA2E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA2L1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA2L1]
ZIP
9.65 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA2L1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2L1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA2L2 Example Project Bundle
The EK-RA2L2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2L2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA4E2 Example Project Bundle
[Software=RA FSP],[Board=EK-RA4E2]
ZIP
14.41 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA4E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA4M2 Example Project Bundle
[Software=RA FSP],[Board=EK-RA4M2]
ZIP
33.11 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA4M2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4M2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA4M3 Example Project Bundle
[Software=RA FSP],[Board=EK-RA4M3]
ZIP
33.04 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA4M3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4M3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA4W1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA4W1]
ZIP
9.07 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA4W1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4W1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA6E2 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6E2]
ZIP
15.58 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA6E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA6M1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M1]
ZIP
18.64 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA6M1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA6M2 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M2]
ZIP
18.93 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA6M2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA6M3 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M3]
ZIP
53.99 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA6M3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA6M3G Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M3G]
ZIP
30.04 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA6M3G example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M3G kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA6M4 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M4]
ZIP
51.43 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
Demonstrates some of the capabilities of the EK and FSP by using multiple peripherals. The example project initializes the Ethernet, USB, ADC, and GPIO modules to create a simple web server and a web client with control via a USB Comm Device class Terminal. Once programmed, the user can control the board by simulating button presses on a web browser and see a regularly updated board configuration on the screen.
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| Sample Code | EK-RA6M5 Example Project Bundle
[Software=RA FSP],[Board=EK-RA6M5]
ZIP
62.19 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
Demonstrates the typical use of the ADC HAL module APIs. The example project initializes the ADC in single scan or continuous scan mode based on the user selection in the RA configurator. Once initialized, the user can initiate the ADC scan and also stop the scan (in the case of continuous scan mode) using JLinkRTTViewer by sending commands.
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| Sample Code | FPB-RA0E1 Example Project Bundle
The FPB-RA0E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA0E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | FPB-RA0E2 Example Project Bundle
The FPB-RA0E2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA0E2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | FPB-RA0L1 Example Project Bundle
The FPB-RA0L1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA0L1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | FPB-RA2E3 Example Project Bundle
The FPB-RA2E3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA2E3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | FPB-RA2T1 Example Project Bundle
The FPB-RA2T1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA2T1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | FPB-RA4E1 Example Project Bundle
[Software=RA FSP],[Board=FPB-RA4E1]
ZIP
10.57 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The FPB-RA4E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA4E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | FPB-RA6E1 Example Project Bundle
[Software=RA FSP],[Board=FPB-RA6E1]
ZIP
13.50 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The FPB-RA6E1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA6E1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | MCK-RA4T1 Example Project Bundle
[Software=RA FSP],[Board=MCK-RA4T1]
ZIP
11.87 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The MCK-RA4T1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA4T1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | MCK-RA6T2 Example Project Bundle
[Software=RA FSP],[Board=MCK-RA6T2]
ZIP
7.61 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The MCK-RA6T2 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA6T2 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | MCK-RA6T3 Example Project Bundle
[Software=RA FSP],[Board=MCK-RA6T3]
ZIP
11.56 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The MCK-RA6T3 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA6T3 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | Quick-Start Example Project for EK-RA2L2
Demonstrates some of the capabilities of the EK-RA2L2 kit and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the USB, ADC, and GPIO modules with control via a USB Comm Device class terminal. Once programmed, the user can control the board using the board buttons and view the regularly updated board configuration on the kit’s information screen.
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| Sample Code | Quick-Start Example Project for EK-RA4C1
Demonstrates some of the capabilities of the EK-RA4C1 kit and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the QSPI, LPM, SLCD, and GPIO modules to create an interactive user demo.
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| Sample Code | Quick-Start Example Project for EK-RA8M2
Demonstrates some of the capabilities of the EK-RA8M2 kit and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the OSPI, UART, various timers, and GPIO modules along with various supporting stacks to create an interactive user demo.
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| Sample Code | Quick-Start Example Project for EK-RA8P1
Demonstrates some of the capabilities of the EK-RA8P1 and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the QSPI, MIPI CSI, GLCD, and GPIO modules along with various supporting stacks to create an interactive user demo.
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| Sample Code | Quick-Start Example Project for FPB-RA2T1
Demonstrates the capability of the Flexible Software Package (FSP) and FPB-RA2T1 by using multiple peripherals. The example project initializes the NMI and GPIO modules and uses switch (S1) to control the flashing frequency of the user LEDs. Once programmed, the user can control the board by pressing buttons on the device.
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| Sample Code | Quick-Start Example Project for MCK-RA8T2
Users can modify the operation of MOONS’ permanent magnet synchronous motor R42BLD30L3, including rotation start/stop and speed adjustments, by combining it with the inverter board provided in the MCK‑RA8T2 kit.
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| Sample Code | RSSK-RA6T1 Example Project Bundle
[Software=RA FSP],[Board=RSSK-RA6T1]
ZIP
6.91 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The RSSK-RA6T1 example project shows how to write code for various Renesas Flexible Software Package (FSP) modules supported by the RSSK-RA6T1 kit. The Flexible Software Package provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | EK-RA4C1 Example Project Bundle
The EK-RA4C1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4C1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | EK-RA4L1 Example Project Bundle
The EK-RA4L1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4L1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | EK-RA4M1 Example Project Bundle
[Software=RA FSP],[Board=EK-RA4M1]
ZIP
10.16 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
The EK-RA4M1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA4M1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | EK-RA8D1 Example Project Bundle
The EK-RA8D1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8D1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | EK-RA8D2 Example Project Bundle
The EK-RA8D2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8D2 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | EK-RA8E2 Example Project Bundle
The EK-RA8E2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8E2 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | EK-RA8M1 Example Project Bundle
The EK-RA8M1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8M1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | EK-RA8M2 Example Project Bundle
The EK-RA8M2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8M2 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | EK-RA8P1 Example Project Bundle
The EK-RA8P1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the EK-RA8P1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | EK-RA8T2 Example Project Bundle
The EK-RA8T2 example project shows how to write code using various Flexible Software Package (FSP) modules supported by the EK-RA8T2 kit. The FSP provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | FPB-RA0E3 Example Project Bundle
The FPB-RA0E3 example project shows how to write code using various Flexible Software Package (FSP) modules supported by the FPB-RA0E3 kit. The FSP provides an optimized, easy-to-use, scalable, and high-quality software solution for embedded system design.
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| Sample Code | FPB-RA8E1 Example Project Bundle
The FPB-RA8E1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the FPB-RA8E1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | MCK-RA8T1 Example Project Bundle
The MCK-RA8T1 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA8T1 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | MCK-RA8T2 Example Project Bundle
The MCK-RA8T2 example project bundle demonstrates how to write code for various Renesas Flexible Software Package (FSP) modules supported by the MCK-RA8T2 kit. The sample code provides ready‑to‑build reference implementations that illustrate peripheral operation and system behavior, enabling developers to quickly evaluate FSP features and accelerate embedded application development.
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| Sample Code | Quick-Start Example Project for EK-RA4L1
Demonstrates some of the capabilities of the EK-RA4L1 kit and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the QSPI, LPM, SLCD, and GPIO modules to create an interactive user demo.
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| Sample Code | Quick-Start Example Project for EK-RA8D2
Demonstrates some of the capabilities of the EK-RA8D2 kit and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the OSPI, MIPI CSI, GLCD, and GPIO modules along with various supporting stacks to create an interactive user demo.
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| Sample Code | Quick-Start Example Project for EK-RA8T2
Demonstrates some of the capabilities of the EK-RA8T2 and Flexible Software Package (FSP) by using multiple peripherals. The example project initializes the OSPI, UART, various timers, and GPIO modules along with various supporting stacks to create an interactive user demo.
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| Sample Code | Quick-Start Example Project for FPB-RA0E3
Demonstrates the capability of the Flexible Software Package (FSP) and FPB-RA0E3 by using multiple peripherals. The example project initializes the IRQ and GPIO modules and uses SW to control the flashing frequency of the user LEDs. Once programmed, the user can control the board by pressing buttons on the device.
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| Sample Code | Building a Vision AI Application using the RA8P1 MCU with Ethos-U55 NPU
This application project is designed to provide guidelines for implementing vision AI applications using Renesas RA8P1 MCUs with Ethos-U NPU support.
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| Sample Code | Injecting and Updating Secure User Keys - Sample Code
Learn how Renesas MCU security revolves around integrated security engines. There are different types of security engines across the RA MCU. Users can find the specific engine used in a particular MCU from its hardware user’s manual. The security engines can operate in two different modes, called Compatibility Mode and Protected Mode. The application note “Renesas Security Engine Operational Modes” explains the definition of the two modes and their use cases.
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| Sample Code | Reference System Design for Vision AI on EK-RA8D1
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| Sample Code |
[Software=RA Flexible Software Package|v]
ZIP
2.61 MB
Application:
Artificial Intelligence (AI), Automotive, Communications Infrastructure, Consumer Electronics, Human Machine Interface (HMI), Industrial
Compiler:
ARMCC
Function:
Application Example
IDE:
e2 studio
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| Sample Code | VK-RA8M1 Voice Application Combo (VAS, VCR) Project
[Software=RA Flexible Software Package|v]
ZIP
13.99 MB
Application:
Artificial Intelligence (AI), Automotive, Communications Infrastructure, Consumer Electronics, Human Machine Interface (HMI), Industrial
Compiler:
ARMCC
Function:
Application Example
IDE:
e2 studio
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| Sample Code | VK-RA8M1 Voice Application Combo (VAS, VCR, SID) Project
[Software=RA Flexible Software Package|v]
ZIP
14.60 MB
Application:
Artificial Intelligence (AI), Automotive, Communications Infrastructure, Consumer Electronics, Human Machine Interface (HMI), Industrial
Compiler:
ARMCC
Function:
Application Example
IDE:
e2 studio
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| Sample Code | Voice Kit RA6E1 Voice Application Combo (VAS, VCR) Project
[Software=RA Flexible Software Package|v]
ZIP
13.75 MB
Application:
Artificial Intelligence (AI), Automotive, Communications Infrastructure, Consumer Electronics, Human Machine Interface (HMI), Industrial
Compiler:
ARMCC
Function:
Application Example
IDE:
e2 studio
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| Sample Code | Voice Kit RA6E1 Voice Application Combo (VAS, VCR, SID) Project
[Software=RA Flexible Software Package|v]
ZIP
13.62 MB
Application:
Artificial Intelligence (AI), Automotive, Communications Infrastructure, Consumer Electronics, Human Machine Interface (HMI), Industrial
Compiler:
ARMCC
Function:
Application Example
IDE:
e2 studio
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| Sample Code | Monitoring of Environment Sensors with the EK-RA2L2 - Sample Code
[Software=RA Flexible Software Package|v6.3.0],[Toolchains=GNU Arm Embedded|13.2.1.arm-13-7]
ZIP
100.52 MB
日本語
Learn how to implement environmental sensor monitoring on the EK‑RA2L2 using a USB Type‑C reference design for RA2L2 MCUs. The sample code demonstrates USB Type‑C CC detection, intermittent environmental sensor measurements using an RTC, and sensor data logging. It also supports real-time display of date and time, sensor data, and USB connection status on a Pmod OLED, as well as transmission of log data to a PC. This makes the sample code ideal for evaluation and demonstration purposes.
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| Sample Code | RA8 CEU Webcam Getting Started Guide
Learn how to implement an embedded webcam solution in the Renesas RA8 MCU, featuring an integrated Camera Engine Unit (CEU) and advanced networking capabilities.
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| Sample Code | Using MCUboot with Dual-core RA8 MCUs
Learn multicore application project creation using the MCUboot module on the Renesas EK-RA8P1 kit using FSP v6.4.0, and recreate the bootloader and link the application projects to work with the bootloader using the FSP solution project. Understand the procedures for configuring an application to work with the bootloader, and for downloading and updating a new application image.
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| Sample Code | Renesas RA Family Establishing and Protecting Device Identity using SCE7 and FAW
The application example provided in this package uses the Secure Crypto Engine (SCE) module based on RA6M3 to generate a device identity unique to each device which is securely stored in the internal flash using the Security Memory Protection Unit (MPU) and the Flash Access Window (FAW) hardware features of the MCU.
ZIP
8.62 MB
Compiler:
ARMCC
IDE:
e2 studio
Guides you in integrating the RA Family SCE7 module with the FSP Mbed Crypto middleware in your design. Explains how to add, configure, and use these components effectively, providing example code as a practical reference and starting point for secure application development.
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| Sample Code | Quick-Start Example Project for EK-RA8E2
The EK-RA8E2 Example Project demonstrates specific capabilities of the EK and FSP by using multiple peripherals. The project initializes the QSPI, MIPI CSI, GLCD, and GPIO modules along with various supporting stacks to create an interactive user demo.
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| Sample Code | RA FSP Example Project Porting Guide
Provides the fundamental knowledge needed to port example projects from one RA kit to another. It then demonstrates these principles by explaining how to port three example projects of varying levels of complexity from the MCK-RA4T1 to the FPB-RA4T1.
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| Sample Code | RA6 Booting Encrypted Image using MCUboot and QSPI
This application project then walks the user through the updates to the bootloader to add encryption for the QSPI based secondary image storage. The application examples implemented image downloading to the QSPI secondary slot over USB PCDC. MCUboot with encryption also supports internal flash encryption.
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| Sample Code |
ZIP
4.41 MB
Featuring a 1GHz Arm Cortex-M85 and 250MHz Arm Cortex-M33, the RA8 dual-core MCU delivers high performance through asymmetric processing. This sample package provides practical use cases showing how both cores can be leveraged to maximize throughput and responsiveness.
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| Sample Code | 16-Bit Analog-to-Digital Converter Operation for RA6T2
[Software=RA FSP]
ZIP
2.51 MB
Compiler:
ARMCC
IDE:
e2 studio
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| Sample Code | Booting Encrypted Image on RA4 using MCUboot and QSPI
This application note walks the user through application project creation using the MCUboot module on Renesas EK-RA4M3 with external QSPI flash as the secondary image storage area. The application examples implemented image downloading to the QSPI secondary slot over USB PCDC. MCUboot with encryption also supports internal flash encryption.
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| Sample Code | Develop Graphics Applications Using the MIPI DSI Interface on the RA8D1
Provides sample code for the development of a graphics application for the RA8D1 MCU using the MIPI display on the EK-RA8D1 evaluation kit.
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| Sample Code | Virtual EEPROM Example Using RA4E2
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| Sample Code |
ZIP
6.56 MB
Learn how to build a secure bootloader for Renesas RA0 and RA2 MCUs using MCUboot with TinyCrypt. This sample package includes bootloader and example application projects to help you implement secure boot functionality.
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| Sample Code | Getting Started with GUIX Thermostat Application for EK-RA8D2
This thermostat application provides a reference for developing complex dual-core, multi-threaded applications with a touch screen graphical Human Machine Interface (HMI) by using Renesas FSP and Azure RTOS GUIX. It describes steps to create a basic GUIX for FSP, integrates touch driver, handles multiple hardware accesses across cores, manages system updates, and performs event handling.
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| Sample Code | Injecting Plaintext User Keys
Learn how to inject plaintext keys into RA MCUs using security engines operating in Compatibility Mode. Example projects for various MCUs and security engines demonstrate plaintext key injection with Renesas Flexible Software Package (FSP) APIs and PSA Certified Crypto APIs.
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| Sample Code | RA2 Secure Firmware Update using MCUboot and Flash Dual Bank
MCUboot is a secure bootloader for 32-bit MCUs. It defines a common infrastructure for the bootloader, defines system flash layout on microcontroller systems, and provides a secure bootloader that enables easy software update. MCUboot is operating system and hardware independent and relies on hardware porting layers from the operating system it works with.
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| Sample Code |
ZIP
8.34 MB
Explore the development of a graphics application built for the RA8D2 MCU, running on a MIPI graphics expansion board with the RA8D2 evaluation kit. Developers can use this sample code as a reference for integrating graphics functionality and accelerating development on RA8D2-based platforms.
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| Sample Code | Application Design using RA8 Single Core First Stage Bootloader
Establish the credentials used by the factory boot firmware and the FSBL to verify the OEM firmware. The application project then demonstrates the verification of the firmware using either technique available: Cyclic Redundancy Check 32 (CRC32) integrity verification or Elliptic Curve Cryptography (ECC) NIST P-256 signature authentication combined with HMACSHA256 authentication.
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| Sample Code | RA AWS Cloud Connectivity and Firmware Update OTA on CK-RA6M5 v2 with Ethernet - Sample Code
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| Sample Code | Application Design using RA8 Series MCU Decryption On the Fly for OSPI
Use Decryption On-The-Fly (DOTF) with the RA8 MCU Renesas Secure IP (RSIP) in compatibility mode and protected mode. For the Renesas Secure IP (RSIP) compatibility mode, runtime-encrypted data is stored and decrypted using DOTF. For the RSIP protected mode, a securely injected DOTF key is used. This application project also demonstrates how the DOTF feature operates in a dual-core environment using the RA8P1 MCU.
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| Sample Code | Quick-Start Example Project for FPB-RA0L1
The quick-start example project for FPB-RA0L1 demonstrates some of the capabilities of the Fast Prototyping Board (FPB) and Flexible Software Package (FSP) by using multiple peripherals. The project initializes the IRQ and GPIO modules and uses a switch (SW1) to control the flashing frequency of the user LEDs. Once programmed the user can control the board by using button presses on the device.
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| Sample Code |
ZIP
248.66 MB
Understanding how to generate cryptographic keys is an important part of leveraging security features offered by RA Family MCUs. This sample code demonstrates how to use the RSIP security engine to generate and securely store a private and public key pair for use with Public Key Infrastructure (PKI)—as well as Certificate Authority (CA) interaction to obtain a device certificate using the public key.
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| Sample Code | LPM Application Package
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| Sample Code | Establishing and Protecting Device Identity using SCE9 and Arm® TrustZone® - Sample Code
The application example provided in this package uses the Secure Crypto Engine 9 (SCE9) module based on RA6M4 to generate a pair of ECC keys and uses a local CA to generate the device certificate based on the ECC public key.
ZIP
9.17 MB
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| Sample Code | Getting Started with ADC Interleaved Mode Application
|
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| Sample Code | Digital Filtering using the IIR Filter Accelerator
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| Sample Code |
Some typical applications for PWM with nanosecond delays are power supply control, motor control, inverter
control, battery charging, digital lightning control, and power factor correction (PFC).
ZIP
924 KB
IDE:
e2 studio
|
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| Sample Code | Getting Started with the Graphics Application
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| Sample Code | Getting Started with GUIX Thermostat Application
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| Sample Code | Quick-Start Example Project for FPB-RA4E2
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| Sample Code | Quick-Start Example Project for FPB-RA6E2
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| Sample Code | ZIP 4.18 MB | |
| Sample Code | RA8 MCU Advanced Secure Bootloader Design using MCUboot and Code Flash Dualbank Mode
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| Sample Code | Security Design using Arm TrustZone - Cortex M85
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| Sample Code | "GUIX Thermostat" for EK-RA8D1 Parallel GLCD Display
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| Sample Code | Getting Started with Wi-Fi Modules on FSP
The driver for the new module is developed while referencing the existing Wi-Fi driver provided by FSP as a starting point.
ZIP
2.55 MB
IDE:
e2 studio
|
|
| Sample Code | Security Design with Arm® TrustZone® using Cortex-M33
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| Sample Code | FPB-RA4T1 Example Project Bundle
|
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| Sample Code | FPB-RA6T3 Example Project Bundle
|
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| Sample Code | RA AWS MQTT/TLS Cloud Connectivity Solution – Cellular Application Project
[Software=RA FSP|v4.2.0]
ZIP
7.74 MB
Compiler:
GNUARM-None
IDE:
e2 studio
|
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| Sample Code | Renesas RA Family HOCO Calibration Using the CAC
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| Sample Code | Renesas RA Securing Data at Rest Using the Arm® TrustZone® - Sample Code
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| Sample Code | RA4 Secure Bootloader Using MCUboot and Internal Code Flash - Sample Code
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| Sample Code | High Performance with RA8 MCU using Arm® Cortex®-M85 core with Helium™
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| Sample Code | CAN FD Example Using RA4E2 and RA6E2 - Application Project
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| Sample Code | Securing Data at Rest Utilizing the Renesas Security MPU
This application project discusses the considerations for securing Data at Rest in an embedded system and provides guidelines on how to use the Security MPU hardware feature of the RA Family MCUs to implement a secure Data at Rest solution.
ZIP
2.66 MB
Compiler:
ARMCC
IDE:
e2 studio
|
|
| Sample Code | GUIX Hello World for EK-RA8D1 MIPI LCD Display
|
|
| Sample Code | Renesas RA Family Exception Handling
The application project uses the Flexible Software Package (FSP) of
the RA family|| the GNU GCC compiler|| and the integrated development environment e2 studio IDE to
demonstrate an exception handling flow for multiple possible faults.
ZIP
5.66 MB
Compiler:
GNU ARM Embedded
IDE:
e2 studio, Keil
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| Sample Code | RYZ024A PMOD LTE Connectivity with EK-RA4M2 MCU Quick Start Guide
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| Sample Code | GUIX "Hello World" for EK-RA8D1 - Sample Code
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| Sample Code | RYZ012 and RA MCU Firmware Update from BLE Radio OTA
[Software=FSP],[Toolchain=GCC ARM Embedded Toolchain version 10.3.1]
ZIP
10.24 MB
Compiler:
GCC ARM Embedded
IDE:
e2 studio
|
|
| Sample Code | RYZ012 and RA MCU Firmware Update from Host MCU
[Software=FSP | v4.2.0],[Toolchain=GCC ARM Embedded Toolchain version 10.3.1]
ZIP
10.29 MB
IDE:
e2 studio IDE v2022-10
|
|
| Sample Code | RYZ024A and RA MCU Firmware Upgrade from Host MCU - Sample Code
|
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| Sample Code | IEC 60730/60335 Self Test Library for RA MCU (CM33 Class-C)
[Software=FSP|v3.5.0],[Toolchains=GNU Arm Embedded|10.3.1.20210824]
ZIP
5.84 MB
日本語
Application:
Consumer Electronics
IDE:
e2 studio
|
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| Sample Code | RA2E2 ZMOD4410 Sensor Device Example – Application Project
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| Sample Code | RA2E2 HS3001 Sensor Device Example – Application Project
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116 items
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||
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Blog Post Jan 28, 2022 |
Blog Post Jan 28, 2022 |
News Jun 15, 2021 |
Additional Details
Components
- CMSIS compliant pack files for e2 studio integrated development environment
- BSPs for RA MCUs and boards
- HAL drivers to access peripherals
- Real Time Operating Systems (RTOS)
- Middleware stacks and protocols
- Module configurators and code generators
- Source files to integrate with any development environment and third-party tools
Supported Toolchains
Software components in the FSP support following toolchains:
- e2 studio Integrated Development Environment, with toolchain supports of GCC Arm Embedded and LLVM Embedded Toolchain for Arm
- IAR Embedded Workbench
- Arm Keil MDK
Software Installation Instructions
Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions
e2 studio Integrated Development Environment
The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.
e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:
BSP configuration
Configure or change MCU and board-specific parameters from the initial project selection.
Clock Configuration
Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.
Pin Configuration
The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.
Module Configuration
The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.
Interrupt Configuration
Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.
Components Configuration
The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.
QE Tools
QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.
The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.
Other Tool Features
- Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
- Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
- Smart Manual that provides driver and device documentation in the form of tooltips right in the code
- Edit Hover feature to show detailed descriptions of code elements while editing
- Welcome Window with links to example projects, application notes and a variety of other self-help support resources
- Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.
Third Party Tool Support
In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.
Resources
Support
Support Communities
- Is there FSP(Flexible Software Package) in RL78/G23 as RA has like /ra, /ra_cfg, and ra_gen?
... product which has RA Flexible Software Package (FSP). I generated the code using Smart Configurator in RL78, but couldn't see the code style like RA on /ra, /ra_cfg, and ra_gen. Does Renesas support FSP(Flexible Software Package) for RL78/G23 and may I get ...
Feb 12, 2025 - RA2A1 and FSP package missing peripheral driver
Hi I see the SJ1A and RA2A1 are the same chip but using the RA Flexible Software Package (FSP) in the E2Studio Configurator are missing the driver for some analog pheripheral. The driver for OPAMP, SigmaDeltaADC, DAC8 driver .. are not in the TAB stack and are not selecteble using NewStack ...
Nov 28, 2019 - Endless loop situation in r_agt_common_preamble() (FSP 16 bit AGT)
Hello, I'm using the R7FA6E10D2CFM with the Renasas RA FSP 5.5.0 and FreeRTOS Kernel V10.6.1. I've experienced an endless loop situation in r_agt_common_preamble(). The problem happens when AGT1 (16 bit) interrupt occurs while my FreeRTOS task is calling R_AGT_Stop ...
Aug 13, 2025
Knowledge Base
- LVGL: Using 32-bit Color Formats with GLCDC
... is a lightweight open-source embedded graphics library designed for microcontroller-based user interfaces. A Renesas-maintained port of LVGL is now included in the RA Flexible Software Package (FSP), making it straightforward to integrate LVGL into RA MCU projects through the FSP Configurator*. Several Renesas MCU families are designed ...
Jan 6, 2026 - RA Family: Secure key injection and flash programming in mass production using RFP CLI interface
... Mode and Protected Mode: In Compatibility Mode, the security engines can inject secure keys as well as plaintext keys. Key injection must be performed using RA Family Flexible Software Package (FSP) APIs. All security engines support Compatibility Mode. In Protected Mode, the security engines can inject only secure keys. Key ...
Jan 29, 2026 - How to Use Event Link Controller to Link Peripherals on RA6M5 Evaluation Kit
... Timer (GPT) with the Analog-to-Digital Converter (ADC) on the EK-RA6M5 board. Flexible Software Package (FSP) supports event linking with the r_elc FSP module, timer operation with the r_gpt FSP module, and ADC conversion with the r_adc FSP module. This example demonstrates configuring the GPT ...
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