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Renesas Boards & Kits
RZ/G2E-EVKIT アクティブ
RZ/G2E MPU向け評価キット
96Boards互換プラットフォームを使用して、ルネサスのRZ/G2E MPUを評価し、迅速な初期開発およびシステム検証を実現できます。 メインボードと拡張ボードの組み合わせにより、主要なデバイス機能を実機で評価できます。
Partner Boards & Kits
Complementary Silicon Devices
DRAM & Flash Memory Solutions
Provides a comprehensive external memory solution for Renesas RZ and R‑Car families, supporting systems that require scalable off‑chip memory. Supported memory types include Serial NAND (Quad/Octal SPI, 512Mb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), ONFI NAND (ONFI 1.0, 1Gb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), DRAM (DDR2/3/4 from 512Mb to 32Gb and LPDDR2/3/4/4x/5/5x from 1Gb to 16Gb), and HyperRAM™ (HyperBus, 64Mb to 512Mb, 1.8V and 1.2V).
Provided By:
Winbond Electronics Corp. JapanSoM/SBC
i.Core RZ/G2E
The Engicam i.Core RZ/G2E is a compact EDIMM 2.0 (67.6 × 32 mm) system on module (SoM) designed for industrial embedded applications. It features onboard DDR3L memory up to 1GB, eMMC storage, Gigabit Ethernet, USB 3.0/2.0, and PCIe connectivity. The module also supports LVDS and MIPI-CSI interfaces for display and vision systems. Powered by a single 5V supply and supported by a Linux/Yocto BSP, it offers rich I/O capabilities in a small form factor, simplifying integration and accelerating time-to-market.
Supported Products:
RZ/G2EProvided By:
Engicam SrlSoM/SBC
SMARC RZ/G2E System on Module (SoM)
Provides a System on Module (SoM) based on the Renesas RZ/G2E. Delivers dual Arm® Cortex®-A53 processing with an integrated PowerVR GE8300 3D graphics engine and supports Full HD video encoding and decoding. Supports high-speed interfaces such as PCI Express and display connectivity, making it suitable for HMI applications. Complies with the SMARC 2.1 standard form factor to enable flexible and scalable system design with high compatibility and expandability.
Provided By:
株式会社アルファプロジェクト
