Features
- Voltage supply range from 9V to 36V
- Over-voltage peak robustness of ±60V
- Ambient Temperature range -40°C to 125°C
- Configurable driver output current 50mADC to 400mADC
- RDSON of less than 2.5Ω
- Adjustable driver slew rate
- Integrated Wake-up detection
- MCU assisted Wake-up generation (typ. 700mA)
- OWI digital communication and calibration interface
- Integrated Linear Voltage Regulators 3.3V and 5V
- Glitch filter for receiver
- Integrated protection:
- ±1.25kV/2.5A (peak) surge protection for L+, CQ, GND/L- (8/20 μs pulse acc. IEC 61000-4- 5)
- Reverse polarity protection for L+, CQ, GND/L-
- On-chip diagnostics:
- Over temperature detection
- Supply voltage monitor
- Broken chip detection
RH4Z2501 - Block Diagram
Description
The RH4Z2501 is a line driver / level shifter IC for IO-link communication with integrated protection. It addresses the IO-Link device physical layer for sensors and actuator systems. Furthermore, the IC can also be used as single channel master. For device configuration and status reading, an OWI communication interface is available. The output drivers allow push-pull operation, with a maximum RDSon of less than 2.5Ω for all operational temperatures. The RH4Z2501 is fabricated in a powerful CMOS mixed-signal technology that allows short supply voltage peaks up to 60V.
Parameters
| Attributes | Value |
|---|---|
| Channels (#) | 1 |
| Master/Device | M/D |
| Advanced Features | Embedded reverse polarity, overvoltage, and surge protection |
| Supply Voltage (V) | 9 - 36 |
| Temp. Range (°C) | -40 to 125°C |
Application Block Diagrams
 | IO-Link Sensors This system enables smart sensor control via IO-Link communication. |
 | Industrial Programmable Logic Controller (PLC) Flexible embedded programmable logic controller (PLC) designed to integrate any type of interface for end-application needs. |
Additional Applications
- Universal cable driver
- IO-Link physical-layer transceiver (PHY)
- IO-Link-compliant devices
- IO-Link-compliant masters
- 24V line driver/level shifter
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| Part Number | Status | Samples | Stock | Package | Budgetary Price (USD) | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Internal TVS Surge Protection | Pitch (mm) | Pkg. Dimensions (mm) | Qty. per Reel (#) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) | Country of Assembly | Country of Wafer Fabrication |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RH4Z2501BJ3GNM#HD0 | Active | Available | In Stock | DFN | 1ku | $1.59 | 12# | Reel | 1 | Yes | 0.5mm | 3.0 x 3.0 x 0.75 | 1800# | Yes | e3 Sn | -40 to 125°C | THAILAND | GERMANY |
| RH4Z2501BJ3GNM#HD1 | Active | Available | Out of Stock | DFN | 1ku | $1.59 | 12# | Reel | 1 | No | 0.5mm | 3.0 x 3.0 x 0.75 | 1800# | Yes | e3 Sn | -40 to 125°C | THAILAND | GERMANY |
| RH4Z2501BJ8GBM#HD0 | Active | Available | Out of Stock | WLCSP | 15# | Reel | 1 | Yes | 0.4mm | 2.41 x 1.61 x 0.6 | 2500# | Yes | e1 SnAgCu | -40 to 125°C | |||
| RH4Z2501BJ8GBM#HD1 | Active | Available | Out of Stock | WLCSP | 15# | Reel | 1 | No | 0.4mm | 2.41 x 1.61 x 0.6 | 2500# | Yes | e1 SnAgCu | -40 to 125°C |
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- Application NotePDF 2.25 MB Mar 25, 2025AI-generated Summary: Two reference designs for an IO-Link sensing solution combine the ZSSC3286 dual-channel resistive sensor signal conditioner and the RH4Z2501 single-channel IO-Link physical layer transceiver. The designs focus on circuit schematics and PCB layouts optimized for EMC performance and thermal management. Both designs pass IO-Link conformance tests including functional and environmental tests such as ESD, EMC, burst, surge, and radiated emissions. Key design guidelines include short communication tracks, separation of high and low voltage areas, solid ground and power planes, via stitching, and proper capacitor placement. The document details two package types: QFN/DFN and WLCSP, with PCB stack-ups and layer layouts provided. PCB design files include BOM, schematics, and Gerber files.
- Application NotePDF 446 KB Jan 24, 2024AI-generated Summary: The document explains power supply design options and limitations for the RH4Z2501 IC, focusing on internal and external voltage regulators. It details the internal 5V and 3.3V LDOs, their thermal limits, and maximum current capabilities. External solutions include using an NPN transistor or Power MOSFET to offload heat dissipation, and external DC-DC converters for higher current and efficiency. Calculations for power dissipation and maximum output currents are provided, emphasizing thermal management and component selection for optimal performance.
- Application NoteAI-generated Summary: The document details the implementation of IO-Link communication using the RA2E2 microcontroller and associated hardware. It covers the configuration and operation of an IO-Link Inductive Sensor Board that detects metal proximity via a sensing coil and communicates detection status to a host PC through an IO-Link USB Master. The system uses an IO-Link stack from TMG and supports configuration and monitoring via a Windows-based GUI tool. Hardware components include the RA2E2 MCU, RH4Z2501 IO-Link Line Driver, and NCV2252SN2T1G comparator. The document also outlines the development environment, hardware setup, software components, and step-by-step instructions for building and running sample projects.Related Files:
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- Application NotePDF 2.25 MB Mar 25, 2025AI-generated Summary: Two reference designs for an IO-Link sensing solution combine the ZSSC3286 dual-channel resistive sensor signal conditioner and the RH4Z2501 single-channel IO-Link physical layer transceiver. The designs focus on circuit schematics and PCB layouts optimized for EMC performance and thermal management. Both designs pass IO-Link conformance tests including functional and environmental tests such as ESD, EMC, burst, surge, and radiated emissions. Key design guidelines include short communication tracks, separation of high and low voltage areas, solid ground and power planes, via stitching, and proper capacitor placement. The document details two package types: QFN/DFN and WLCSP, with PCB stack-ups and layer layouts provided. PCB design files include BOM, schematics, and Gerber files.
- Application NotePDF 446 KB Jan 24, 2024AI-generated Summary: The document explains power supply design options and limitations for the RH4Z2501 IC, focusing on internal and external voltage regulators. It details the internal 5V and 3.3V LDOs, their thermal limits, and maximum current capabilities. External solutions include using an NPN transistor or Power MOSFET to offload heat dissipation, and external DC-DC converters for higher current and efficiency. Calculations for power dissipation and maximum output currents are provided, emphasizing thermal management and component selection for optimal performance.
- Application NoteAI-generated Summary: The document details the implementation of IO-Link communication using the RA2E2 microcontroller and associated hardware. It covers the configuration and operation of an IO-Link Inductive Sensor Board that detects metal proximity via a sensing coil and communicates detection status to a host PC through an IO-Link USB Master. The system uses an IO-Link stack from TMG and supports configuration and monitoring via a Windows-based GUI tool. Hardware components include the RA2E2 MCU, RH4Z2501 IO-Link Line Driver, and NCV2252SN2T1G comparator. The document also outlines the development environment, hardware setup, software components, and step-by-step instructions for building and running sample projects.Related Files:
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Renesas Boards & Kits
RH4Z2501-KIT
Active
Evaluation Kit for RH4Z2501
The RH4Z2501 evaluation kit can be used for a detailed evaluation and configuration of the Renesas RH4Z2501 family. The kit contains two boards, the RH4Z2501 evaluation board and a communication board. The communication board provides a USB interface to the user's computer running the evaluation... Read More
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RH4Z2501-PMOD
Active
IO-Link Pmod Module for the RH4Z2501 Physical Layer Transceiver
The RH4Z2501-PMOD Board is a Pmod™ module for the RH4Z2501 Renesas silicon evaluation. The purpose of the module is to be used with a standard MCU evaluation board with a compatible Pmod interface to implement an IO-Link device.
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See how the robust RH4Z2501 combines flexible configurations and embedded diagnostics to simplify IO-Link integration and achieve best-in-class performance.
Introducing the ZSSC3286 sensor signal conditioner with dual path resistive analog front-end, integrated IO-Link stack with Smart Sensor Profile in COM3 mode, and a full-chain evaluation kit.
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