Evaluation Kit for RA2A1 MCU Group
The EK-RA2A1 evaluation kit enables users to effortlessly evaluate the features of the RA2A1 MCU Group and develop embedded systems applications using Renesas' Flexible...
Overview
Description
download Download Latest FSP (v5.1.0):
FSP Windows Platform Installer
FSP Linux Platform Installer
FSP RASC Windows Installer
FSP RASC Linux Installer
See All FSP Releases & Patches on GitHub
The Renesas Flexible Software Package (FSP) is an enhanced software package designed to deliver user-friendly, scalable, high-quality software for embedded system designs using the Renesas RA family of Arm Microcontrollers, ensuring software compatibility across the RA family, from entry-level to high-performance microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.
FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease the implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.
FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, including Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions. FSP and e² studio can be used free of charge on any Renesas device.
Features
- Small memory footprint HAL drivers
- Intuitive configurator and code generator
- Static and dynamic analysis using industry-standard tools
- Application support using RTOS and non-RTOS environments
- Azure RTOS and its middleware stacks with Flexible Software Package
- Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
- FreeRTOS support – Includes Kernel and set of software libraries
- FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
- Tool configurable RTOS resources (Threads, mutexes, etc.)
- Middleware stacks from Renesas and third parties.
- TCP/IP and other connectivity protocol stacks including MQTT
- USB middleware support for CDC, HID, and MSC
- Wireless connectivity through Cellular (Cat-M1), Wi-Fi, and Bluetooth Low Energy LE 5.0 (BLE Mesh)
- File System support with FreeRTOS+FAT and LittleFS
- Storage (Block Media) support for SDMMC, SPI, and USB.
- Virtual EEPROM on Flash
- Capacitive touch middleware to implement widgets like Button, Slider, and Wheels.
- Motor control algorithms
- Secure Bootloader through MCUboot
- Sensor Module APIs
- TrustZone support (for applications on CM33-based MCUs)
- TrustZone enabled drivers and middleware
- Easy-to-use tool support for TrustZone configuration
- PSA Level 2 Certified
- AWS qualified for FreeRTOS
- Easy connectivity options to major cloud providers
- Secure connections through NetX Duo Secure and Mbed TLS
- Cryptographic APIs and integrated Hardware Acceleration support
- Arm PSA Cryptographic APIs
- Azure RTOS NetX Crypto APIs
- Ultimate security with FSP Crypto APIs (SCE9 protected mode)
- TinyCrypt targeting constrained devices
- Graphics interface support and tools
- Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
- Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
- Secure debugging capabilities
- Extensive tool support from Renesas and leading third-party solutions
- Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, toolchain, and Segger J-Link drivers)
- Complete source code available through GitHub
Release Information
For additional information and links go to GitHub.
v5.1.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.1.0.
Minimum e2 studio version for FSP 5.1.0 is e2 studio 2023-10
Download the FSP with e2 studio Windows installer for this release: FSP Windows Platform Installer
Download the FSP with e2 studio Linux AppImage for this release: FSP Linux Platform Installer
Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release:
FSP RASC Windows Installer
FSP RASC Linux Installer
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Features Added
- Support for new devices:
- RA8D1 MCU
- RA8T1 MCU
- Support for new development kits:
- EK-RA8D1
- MCK-RA8T1
- Added SCI_B LIN driver (r_sci_b_lin)
- Added support for multiple data collector instances
- Added ability to control the transmit power on the DA14531 via the existing APIs
- Support USB PPRN for FreeRTOS
- Added a new driver to support using the DA16xxx HTTP stack with FSP
Fixes and Improvements
- Arm® GNU Toolchain updated to version 13.2
- J-Link updated to version 7.92o
- Improved CTSU measurement accuracy by correcting correction calculation
Known Issues
- Potential issue with AES CCM support in PSA Crypto (under investigation)
- Potential issue with ZMOD4xxx RAQ support on CM4 devices (under investigation)
- EWARM support for RA8M1, RA8D1, RA8T1 and RA2E3
EWARM version 9.40.1 does not contain support for RA8M1, RA8D1, RA8T1, and RA2E3. To develop for these devices, It will be necessary to install support patch files which can be downloaded by EWARM v9.40.1 users from the IAR MyPages system. - The following is not yet supported in projects using LLVM Compiler:
- Bluetooth® Low Energy (LE) Mesh modules
- RYZ Cellular AWS support
- USB HMSC does not work with secure project on RA4, RA6 and RA8 series devices other than GCC compiler (deploys TrustZone®).
Target Devices
Downloads
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| Software & Tools - Software | 简体中文 | |
| Software & Tools - Software | 简体中文 | |
| Software & Tools - Software | 简体中文 | |
| Software & Tools - Software | 简体中文 | |
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Synergy Download
Documentation
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| Type | Title | Date |
| Manual - Software | PDF 37.70 MB | |
| Manual - Software | ||
| Application Note | PDF 69 KB | |
| Application Note | PDF 65 KB | |
| Application Note | PDF 65 KB | |
| Application Note | PDF 66 KB | |
| Application Note | PDF 68 KB | |
| Application Note | PDF 69 KB | |
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| Application Note | PDF 66 KB | |
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| Application Note | PDF 70 KB | |
| Application Note | PDF 70 KB | |
| Application Note | PDF 73 KB | |
| Application Note | PDF 70 KB | |
| Application Note | PDF 70 KB | |
| Application Note | PDF 70 KB | |
| Application Note | PDF 69 KB | |
| Application Note | PDF 65 KB | |
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| Application Note | PDF 68 KB | |
| Application Note | PDF 65 KB | |
| Application Note | PDF 68 KB | |
| Application Note | PDF 66 KB | |
| Application Note | PDF 64 KB | |
| Application Note | PDF 1.63 MB | |
| Manual - Software | PDF 37.12 MB | |
| Quick Start Guide | PDF 3.24 MB 日本語 | |
| Application Note | PDF 1.79 MB | |
| Application Note | PDF 10.24 MB | |
| Application Note | PDF 9.01 MB | |
| Application Note | PDF 5.97 MB | |
| Manual - Software | PDF 35.80 MB | |
| Application Note | PDF 1.86 MB 日本語 | |
| Application Note | PDF 1.62 MB | |
| Application Note | PDF 2.75 MB | |
| Application Note | PDF 2.07 MB | |
| Application Note | PDF 1.96 MB | |
| Application Note | PDF 1.93 MB 日本語 | |
| Application Note | PDF 252 KB | |
| Application Note | PDF 4.02 MB | |
| Application Note | PDF 3.45 MB | |
| Application Note | PDF 5.21 MB | |
| Application Note | PDF 1.92 MB | |
| Manual - Software | PDF 35.71 MB | |
| Application Note | PDF 4.03 MB | |
| Application Note | PDF 4.22 MB 日本語 | |
| Application Note | PDF 181 KB 日本語 | |
| Application Note | PDF 1.04 MB | |
| Manual - Software | PDF 35.50 MB | |
| Manual - Software | PDF 35.19 MB | |
| Application Note | PDF 2.02 MB | |
| Manual - Software | PDF 34.41 MB | |
| Application Note | PDF 2.98 MB 日本語 | |
| Application Note | PDF 1.12 MB | |
| Application Note | PDF 2.15 MB | |
| Manual - Software | PDF 34.12 MB | |
| Application Note | PDF 3.82 MB | |
| Application Note | PDF 3.50 MB | |
| Application Note | PDF 1.61 MB | |
| Manual - Software | PDF 34.05 MB | |
| Application Note | PDF 793 KB | |
| Manual - Software | PDF 33.42 MB | |
| Application Note | PDF 2.44 MB 简体中文 | |
| Application Note | PDF 1.64 MB | |
| Application Note | PDF 3.00 MB | |
| Manual - Software | PDF 33.13 MB | |
| Application Note | PDF 2.53 MB | |
| Application Note | PDF 1.82 MB | |
| Manual - Software | PDF 32.29 MB | |
| Application Note | PDF 4.37 MB 日本語 | |
| Manual - Software | PDF 28.84 MB | |
| Application Note | PDF 5.08 MB | |
| Manual - Software | PDF 27.16 MB | |
| Application Note | PDF 2.24 MB | |
| Manual - Software | PDF 26.47 MB | |
| Manual - Software | PDF 24.72 MB | |
| Manual - Development Tools | PDF 7.24 MB 日本語 | |
| Manual - Software | PDF 24.57 MB | |
| Manual - Software | PDF 23.77 MB | |
| Manual - Software | PDF 21.96 MB | |
| Application Note | PDF 2.78 MB | |
| Application Note | PDF 1.64 MB | |
| Manual - Software | PDF 21.60 MB | |
| Application Note | PDF 891 KB | |
| Manual - Software | PDF 21.64 MB | |
| Manual - Software | PDF 21.26 MB | |
| Application Note | PDF 1.78 MB | |
| White Paper | PDF 1.98 MB | |
| White Paper | PDF 1.38 MB 日本語 , 简体中文 | |
| Application Note | PDF 1.11 MB | |
| Manual - Software | PDF 20.22 MB | |
| Application Note | PDF 645 KB | |
| Manual - Software | PDF 18.60 MB | |
| Manual - Software | PDF 18.36 MB | |
| Manual - Software | PDF 17.26 MB | |
| Manual - Software | PDF 16.30 MB | |
| White Paper | PDF 196 KB 日本語 , 简体中文 | |
| White Paper | PDF 178 KB 日本語 , 简体中文 | |
| White Paper | PDF 169 KB 日本語 , 简体中文 | |
| Manual - Software | PDF 9.72 MB | |
| Manual - Software | ZIP 265 KB | |
| White Paper | PDF 660 KB 日本語 , 简体中文 | |
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Design & Development
Sample Code
Sample Code
Filters
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| Type | Title | Date Date |
| Sample Code |
[Software=RA FSP],[Board=EK-RA2A1]
ZIP
7.06 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA2E1]
ZIP
4.24 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA2E2]
ZIP
5.12 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA2L1]
ZIP
6.77 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA4E2]
ZIP
10.38 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA4M1]
ZIP
6.93 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA4M2]
ZIP
17.22 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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[Software=RA FSP],[Board=EK-RA4M3]
ZIP
17.23 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA4W1]
ZIP
8.28 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA6E2]
ZIP
10.76 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA6M1]
ZIP
12.74 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA6M2]
ZIP
13.01 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA6M3]
ZIP
34.76 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA6M3G]
ZIP
11.37 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA6M4]
ZIP
28.75 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=EK-RA6M5]
ZIP
31.96 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code | ZIP 27.75 MB | |
| Sample Code |
[Software=RA FSP],[Board=FPB-RA4E1]
ZIP
6.37 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=FPB-RA6E1]
ZIP
8.13 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=MCK-RA4T1]
ZIP
9.16 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=MCK-RA6T2]
ZIP
5.67 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=MCK-RA6T3]
ZIP
8.84 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code |
[Software=RA FSP],[Board=RSSK-RA6T1]
ZIP
5.79 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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| Sample Code | ZIP 5.11 MB | |
| Sample Code |
[Software=RA FSP]
ZIP
6.70 MB
日本語
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| Sample Code | ZIP 1.75 MB | |
| Sample Code |
[Software=FSP],[Toolchain=GCC ARM Embedded Toolchain version 10.3.1]
ZIP
10.24 MB
Compiler:
GCC ARM Embedded
IDE:
e2 studio
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| Sample Code |
[Software=FSP | v4.2.0],[Toolchain=GCC ARM Embedded Toolchain version 10.3.1]
ZIP
10.29 MB
IDE:
e2 studio IDE v2022-10
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| Sample Code | ZIP 3.36 MB | |
| Sample Code |
Some typical applications for PWM with nanosecond delays are power supply control, motor control, inverter
control, battery charging, digital lightning control, and power factor correction (PFC).
ZIP
2.43 MB
IDE:
e2 studio
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| Sample Code |
The application example provided in this package uses the Secure Crypto Engine 9 (SCE9) module based on RA6M4 to generate a pair of ECC keys and uses a local CA to generate the device certificate based on the ECC public key.
ZIP
10.59 MB
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| Sample Code | ZIP 1.93 MB | |
| Sample Code |
[Software=FSP|v3.5.0],[Toolchains=GNU Arm Embedded|10.3.1.20210824]
ZIP
5.84 MB
日本語
Application:
Consumer Electronics
IDE:
e2 studio
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| Sample Code | ZIP 17.69 MB | |
| Sample Code |
[Software=FSP|v4.4.0],[Toolchain: GCC ARM Embedded | 10.3.1.20210824]
ZIP
1.87 MB
Compiler:
GNUARM-NONE
IDE:
e2 studio
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| Sample Code |
[Software=RA FSP | v4.4.0]
ZIP
4.86 MB
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| Sample Code |
[Software=RX Driver Package|V1.37;RA Flexible Software Package|v4.4],[Toolchains=CC-RX|V3.05;GNU Arm Embedded|10.3.1.20210824;GNURX|8.3.0.202202;GNURL|4.9.2.202201]
ZIP
396.01 MB
日本語
Application:
Industrial
Compiler:
CC-RX, GNU ARM Embedded, GNURL78
Function:
Application Example, Communication Interface, Evaluation Kit, Protocol, Software Package
IDE:
e2 studio
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| Sample Code | ZIP 25.33 MB | |
| Sample Code | ZIP 1.55 MB | |
| Sample Code | ZIP 745 KB | |
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40 items
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e² studio Tips - How to Import Example Project in e² studio for RA
This video shows how to import the Renesas RA Flat project and TrustZone project in e² studio.
e² studio Tips - How to Import Example Project in e² studio for RA
0:00:00 Opening
0:00:14 Flat Project and TrustZone Project
0:00:34 Set up IDE
0:00:54 Download Example Project
0:01:07 Import Flat Project
0:02:44 Import TrustZone Project
0:04:30 e² studio User Guide
Video List
Events & Webinars
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| Three Reasons You'll Want to Use Our Flexible Software Package for Your IoT Designs | Blog Post | Nov 15, 2022 | |
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| The RA MCU Family is Made to Help Solve Your Design Challenges | Blog Post | Sep 25, 2021 | |
| Get Where You’re Going with the Official Renesas RA Family Guide | Blog Post | Jun 29, 2021 | |
| Renesas Extends Support for Microsoft Azure RTOS Across 32-bit MCU Families with Simple Licensing for Secure Embedded IoT Development | News | Jun 15, 2021 |
Additional Details
Components
- CMSIS compliant pack files for e2 studio integrated development environment
- BSPs for RA MCUs and boards
- HAL drivers to access peripherals
- Real Time Operating Systems (RTOS)
- Middleware stacks and protocols
- Module configurators and code generators
- Source files to integrate with any development environment and third-party tools
Supported Toolchains
Software components in the FSP support following toolchains:
- e2 studio Integrated Development Environment, with toolchain supports of GCC Arm Embedded and LLVM Embedded Toolchain for Arm
- IAR Embedded Workbench
- Arm Keil MDK
Software Installation Instructions
Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions
e2 studio Integrated Development Environment
The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.
e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:
BSP configuration
Configure or change MCU and board-specific parameters from the initial project selection.
Clock Configuration
Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.
Pin Configuration
The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.
Module Configuration
The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.
Interrupt Configuration
Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.
Components Configuration
The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.
QE Tools
QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.
The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.
Other Tool Features
- Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
- Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
- Smart Manual that provides driver and device documentation in the form of tooltips right in the code
- Edit Hover feature to show detailed descriptions of code elements while editing
- Welcome Window with links to example projects, application notes and a variety of other self-help support resources
- Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.
Third Party Tool Support
In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.