Semiconductor & Embedded System Solutions

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High-Voltage GaN in Smaller, Cooler Packages

Dual-side cooled 8x8 mm 650V GaN maximizes power density in AI data centers through superior performance and efficient cooling.

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Homepage banner for Renesas SLG46801V GreenPak.

Industry’s Smallest Multi-Time Programmable GreenPAK™

Maximize design flexibility in ultra-compact applications with a tiny, cost-efficient programmable IC that can be updated even after deployment.

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Homepage banner for Renesas RZ/G3L and RZ/G3SE low power microprocessors, showing MPU chips with a modern technology-themed background, highlighting Renesas RZ/G3L and RZ/G3SE low power MPUs for industrial and IoT edge devices.

The 1mW Breakthrough: Low-Power Standby MPUs Ideal for HMI and IoT Edge

Seamlessly scale your product portfolio with pin-compatible RZ/G3L and RZ/G3SE MPUs. Reduce development efforts with reusable design assets.

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Visit Us at Electronica - Hall C5, Stand 479

Meet our experts and explore our latest technologies and solutions.

New Products

NEW

3D illustration featuring top and bottom views of LFBGA IC chip package with 368 lead count.

RZ/G3L

Power-Efficient, Multi-Core Architecture Microprocessor with 3D Graphics Accelerator for HMI

NEW

3D illustration featuring top and bottom views of SCQFN chip package with 72 lead count.

RAA278831

ASIL B Video Display and Diagnostics OpenLDI Bridge IC for Automotive HUD Systems

NEW

3D illustration featuring top and bottom views of LQFP IC chip package with 64 lead count.

RX14T

48MHz Entry-Level 32-bit Microcontroller for Motor Control with 128KB Flash

3D illustration featuring top and bottom views of QFN chip package with 22 lead count.

RRW22125

25W to 45W Digital AC/DC SSR Flyback SiP with 700V, 480mΩ GaN FET

3D illustration featuring top and bottom views of PQFN chip package with 8 lead count.

TP70H135G4PLSGB

700V 135mΩ High‑Voltage GaN FET in PQFN 8×8 Industry‑Standard Package

NEW

3D illustration featuring top and bottom views of STQFN IC chip package with 44 lead count.

PTX205R

Flexible NFC Controller with Reader and Card Emulation for IoT

3D illustration featuring top and bottom views of LSDIP chip package with 8 lead count.

RV1S9992A

4A Output Current, Gate Drive, LSDIP 8, 15mm Creepage Distance Optocoupler

NEW

3D illustration featuring top and bottom views of SOIC chip package with 14 lead count.

iW3701

Digital Two-Stage Combo Boost PFC and High-Voltage Buck Controller for High PF, Low THD Dimmable Lighting Solutions in Industrial Applications to 250W

3D illustration featuring top and bottom views of SOICN chip package with 14 lead count.

RRA79044

Quad, Ultra-Low Power, RRIO, Operational Amplifier

3D illustration featuring top and bottom views of TSSOP IC chip package with 20 lead count.

RA0E3

32MHz Arm Cortex-M23 Entry-Level Ultra-Low Power General-Purpose Microcontroller with 16KB Flash

Technician holding semiconductor wafer in hand.

Winning Combinations

Delivering comprehensive solutions with analog, power, embedded processing, and connectivity products.

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Humanoid robot hand holding battery indicating the robot's battery management system capabilities.

Humanoid Battery Management System

Integrated humanoid robot BMS enabling safe, real-time power management, protection, and battery-state control.

Gardener holding electric weed trimmer to trim grass in his garden.

Smart Cordless Brushless String Trimmer

Next-gen cordless brushless string trimmer with GaN motor control, AI/ML adaptive cutting, and Bluetooth LE connectivity for smart, efficient operation.

Automotive On-Board Charger (OBC) attached to an indoor garage wall with white electric car in the background.

6.6kW Single-Stage Onboard Charger (OBC)

Single-stage GaN-based bidirectional onboard charger with DAB topology, delivering high efficiency, compact size, and enhanced reliability.

News & Updates

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Sep 30, 2026Press Release	Renesas Unveils Industry's First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers
Sep 24, 2026Press Release	Renesas Introduces Smallest Configurable GreenPAK IC with Multi-Time Programmability in Ultra-Compact WLCSP and STQFN Packages
Sep 10, 2026Press Release	Renesas Launches 64-bit RZ/G3L and RZ/G3SE MPUs for Advanced HMI and IoT Edge Systems
Sep 10, 2026Blog	From HMI to IoT Edge: Scale Designs with RZ/G MPUs in One Unified Development Environment
Sep 8, 2026Blog	Beyond Silicon: Humanoid Robotics Design Is a Team Sport