Download the Latest FSP v3.8.0
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The Renesas Flexible Software Package (FSP) is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA family of Arm Microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.
FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.
FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, included Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions.
See latest FSP release information on GitHub.
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This application project discusses the considerations for securing Data at Rest in an embedded system and
provides guidelines on how to use the Security MPU hardware feature of the RA Family MCUs to implement
a secure Data at Rest solution. ZIP3.45 MB Related Files: Compiler: ARMCC IDE: e2 studio |
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The Example Projects contained within the bundle show how to write code for the various Renesas Flexible Software
Package (FSP) modules supported by the EK-RA6M3 kit. ZIP27.09 MB Related Files: IDE: e2 studio, Keil |
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The Example Projects contained within the bundle show how to write code for the various Renesas Flexible Software
Package (FSP) modules supported by the EK-RA6M3G kit. ZIP8.64 MB Related Files: Compiler: GNU ARM Embedded IDE: e2 studio, Keil, IAR EWARM |
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This application project is built with the integrated “Azure IoT SDK for Embedded C” package which allows
small embedded (IoT) devices like Renesas RA family of MCUs RA6M3, RA6M4, and RA6M5 to
communicate with Azure services. ZIP9.71 MB IDE: e2 studio |
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Related Files: Application: Consumer Electronics, Industrial Compiler: GNU ARM Embedded Function: Communication Interface IDE: e2 studio |
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The application project uses the Flexible Software Package (FSP) of
the RA family|| the GNU GCC compiler|| and the integrated development environment e2 studio IDE to
demonstrate an exception handling flow for multiple possible faults. ZIP2.69 MB Related Files: Compiler: GNU ARM Embedded IDE: e2 studio, Keil |
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The application example provided in the package uses AWS IoT Core. The detailed steps in this
document show first-time AWS IoT Core users how to configure the AWS IoT Core platform to run this
application example. ZIP4.89 MB IDE: e2 studio |
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Some typical applications for PWM with nanosecond delays are power supply control, motor control, inverter
control, battery charging, digital lightning control, and power factor correction (PFC). ZIP801 KB Related Files: IDE: e2 studio |
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MCUboot is a secure bootloader for 32-bit MCUs. It defines a common infrastructure for the bootloader,
defines system flash layout on microcontroller systems, and provides a secure bootloader that enables easy
software update ZIP22.71 MB Related Files: IDE: e2 studio |
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The Renesas Flexible Software Package includes Azure RTOS ThreadX® real-time operating system, the
Azure RTOS GUIX library and hardware drivers unified under a single robust software package. ZIP4.97 MB Related Files: IDE: e2 studio |
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The application example provided in this package uses the Secure Crypto Engine 9 (SCE9) module based
on RA6M4 to generate a pair of ECC keys and uses a local CA to generate the device certificate based on
the ECC public key. ZIP8.80 MB IDE: e2 studio |
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The driver for the new module is developed while referencing the existing Wi-Fi driver provided by FSP as a starting point. ZIP929 KB Related Files: IDE: e2 studio |
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The application example provided in this package uses the Secure Crypto Engine (SCE) module based on RA6M3
to generate a device identity unique to each device which is securely stored in the internal flash using the Security
Memory Protection Unit (MPU) and the Flash Access Window (FAW) hardware features of the MCU. ZIP16.23 MB Related Files: Compiler: ARMCC IDE: e2 studio |
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The Example Projects contained within the bundle show how to write code for the various Renesas Flexible Software
Package (FSP) modules supported by the EK-RA6M3G kit. ZIP2.96 MB Related Files: Compiler: GNU ARM Embedded IDE: e2 studio, Keil |
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This video shows how to import the Renesas RA Flat project and TrustZone project in e² studio.
e² studio Tips - How to Import Example Project in e² studio for RA
0:00:00 Opening
0:00:14 Flat Project and TrustZone Project
0:00:34 Set up IDE
0:00:54 Download Example Project
0:01:07 Import Flat Project
0:02:44 Import TrustZone Project
0:04:30 e² studio User Guide
![]() |
Arm Cortex M85 Is Here, Is Your IoT Design Ready? | Blog Post | Apr 28, 2022 |
![]() |
The RA MCU family is made to help solve your design challenges | Blog Post | Sep 25, 2021 |
![]() |
Get Where You’re Going with the Official Renesas RA Family Guide | Blog Post | Jun 29, 2021 |
![]() |
Renesas Extends Support for Microsoft Azure RTOS Across 32-bit MCU Families with Simple Licensing for Secure Embedded IoT Development | News |
Software components in the FSP support following toolchains:
Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions
The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.
e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:
Configure or change MCU and board-specific parameters from the initial project selection.
Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.
The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.
The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.
Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.
The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.
QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.
The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.
In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.