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RA Flexible Software Package (FSP)

Software Package

Renesas Flexible Software Package (FSP) v6.5.0 User's ManualRenesas Flexible Software Package (FSP) User's Manual (Web Version - HTML)

Overview

The Renesas Flexible Software Package (FSP) is an enhanced software package designed to deliver user-friendly, scalable, high-quality software for embedded system designs using the Renesas RA family of Arm Microcontrollers, ensuring software compatibility across the RA family, from entry-level to high-performance microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.

download Download Latest FSP (v6.5.0):

FSP Platform Installer (Includes e² studio IDE, toolchain, and FSP packs):

RA Smart Configurator (RASC) Installer (FSP packages to use with 3rd party IDEs with IAR Embedded Workbench, Arm Keil MDK):

FSP Standalone Installer (FSP packs for the users who only update the FSP and no e² studio update):

  • Download from the Assets section of the GitHub

The installation instructions can be found here. All the FSP Releases and Patches can be found on GitHub.

FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease the implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.

FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, including Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions. FSP and e² studio can be used free of charge on any Renesas device.

RA Flexible Software Package (FSP)
  • Multi-Core and Single Core support of Arm® Cortex®- M-based RA MCUs
  • Small memory footprint HAL drivers
  • Intuitive configurator and code generator
  • Static and dynamic analysis using industry-standard tools
  • Application support using RTOS and non-RTOS environments
  • Azure RTOS and its middleware stacks with Flexible Software Package
    • Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
  • FreeRTOS support – Includes Kernel and set of software libraries
    • FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
  • Tool configurable RTOS resources (Threads, mutexes, etc.)
  • Middleware stacks from Renesas and third parties
    • Ethos-U55 support for CM85-based MCUs for efficient AI/ML integration
    • TCP/IP and other connectivity protocol stacks including MQTT
    • USB middleware support for CDC, HID, and MSC
    • Wireless connectivity through Cellular (Cat-M1), Wi-Fi, and Bluetooth Low Energy LE 5.0 (BLE Mesh)
    • File System support with FreeRTOS+FAT and LittleFS
    • Storage (Block Media) support for SDMMC, SPI, and USB.
    • Virtual EEPROM on Flash
    • Capacitive touch middleware to implement widgets like Button, Slider, and Wheels.
    • Motor control algorithms
    • Secure Bootloader through MCUboot
    • Sensor Module APIs
  • TrustZone support (for applications on CM33-based MCUs)
    • TrustZone-enabled drivers and middleware
    • Easy-to-use tool support for TrustZone configuration
  • PSA Level 2 Certified
  • AWS-qualified for FreeRTOS
  • Easy connectivity options to major cloud providers
  • Secure connections through NetX Duo Secure and Mbed TLS
  • Cryptographic APIs and integrated Hardware Acceleration support
    • Arm PSA Cryptographic APIs
    • Azure RTOS NetX Crypto APIs
    • Ultimate security with FSP Crypto APIs (SCE9 protected mode)
    • Oberon Ocrypto targeting low end RA2E1 devices
    • TinyCrypt targeting constrained devices
  • Graphics interface support and tools
    • LVGL integration support for RA devices
    • Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
    • Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
  • Secure debugging capabilities
  • Extensive tool support from Renesas and leading third-party solutions
  • Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, toolchain, and Segger J-Link drivers)
  • Complete source code available through GitHub

For additional information and links, go to GitHub.

v6.5.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.5.0.

Minimum e2 studio version for FSP 6.5.0 is e2 studio 2026-04.2

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.exe, from here.

Download the FSP with e2 studio Linux installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.xz.run, from here. Refer to the installation steps for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v6_5_0_e2s_v2026-04.2.pkg, from here. Refer to the installation steps for information on installing e2 studio and related software components in a macOS PC.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

Post - FSP v6.5.0 changes to toolchain support

Future releases of FSP will no longer ship with the GCC toolchain integrated within the combined e2 studio/FSP platform installer. The use of the GCC toolchain with FSP will still be supported, and an option in the platform installer will allow GCC to be downloaded from the internet and installed as part of the overall install process. Alternatively, it is possible to link e2 studio to an installation of the GCC toolchain already on the user's computer.

Note: The LLVM toolchain/Arm Toolchain for Embedded (ATfE) will continue to be integrated within the e2 studio/FSP platform installer.

With FSP 6.3.0 and later, when using the LLVM toolchain, the compiler optimization level is set to -Os by default for RA4/RA6/RA8 MCUs, whereas previous FSPs would use -O2. This has been done as with LLVM, -Os causes a balance of optimizations similar to GCC's -O2 option.

Note that for RA0/RA2 MCUs, where keeping memory size to a minimum is typically of primary importance, the -Oz optimization level is selected by default.

All installers are available in the Assets section of this release.

Refer to the https://github.com/renesas/fsp/blob/master/README.md "README.md" in the FSP root folder for setup instructions, hardware details, and related links.

New Features

  • MCUboot Solution Template Enhancements:
    • Single‑Image MCUboot Templates:
      • Added MCUboot single image solution template for RA6 CM4 devices (RA6M1, RA6T1, RA6M2, RA6M3) using mbedtls
      • Added MCUboot single image solution template for cm33 devices (RA6M4, RA6M5, RA4M2, RA4M3) using mbedtls with crypto accelerator
      • Added MCUboot single image solution template for cm33 devices (RA6M4, RA6M5, RA6E1, RA4M2, RA4M3, RA4E1) using mbedtls with crypto accelerator
      • Added MCUboot single image solution template for CM85 devices using mbedtls with crypto accelerator
    • MCUboot with MMF (Mirrored Memory Flash) Support:
      • Added MCUboot single image solution template in MMF mode for RA6 CM4 devices (RA6M1, RA6T1, RA6M2, RA6M3) using mbedtls
      • Added the MCUboot single image solution template in MMF mode for RA2A2 using mbedtls
    • Multi‑Image MCUboot Templates:
      • Added the MCUboot multi-image solution template in Overwrite mode for CM85 devices (RA8P1, RA8D2, RA8M2, RA8T2) using mbedtls
  • Middleware and Feature Additions:
    • Added support for Host USB Video Class (HUVC) driver
    • Updated LVGL graphic library to version v9.5.0
    • Added support for LwIP SNMP application
    • Added link detection support for all RMAC port from r_layer3_switch
  • New Board and Package Support:
    • Added support for EK-RA8P1, EK-RA8M2, EK-RA8D2 V2 board
    • Updated FSP pin configuration support for:
      • RA8M1, RA8M2 and RA8T1 (169‑BGA package)
      • RA4L1 (72-WLCSP package)
      • RA0E1 (20-TSSOP package):
        • Removed the sub-clock and its pins from the FSP clock configuration and pin configuration
        • Initialized the sub-clock related registers per TU
  • Cryptography and Security Updates:
    • Added HMAC-SHA3 224/256/384/512 feature for RSIP-E50D
    • Added xDLMS InitiateRequest message decryption feature for RSIP-E11A
  • Updated to MbedTLS version 3.6.6

Fixes and Improvements

  • Added support to disable the TAU_PWM master-channel interrupt
  • OFS register ZHUK is placed after PBPS
  • Fixed the issue where the IPV settings are not applied to the VLAN and Layer 3 entries
  • Support MAC table searches by source MAC address, destination MAC address, or both
  • Added support for lwIP PPP configuration
  • Updated the CCD setting description in r_ioport to notify users to enable CCD support when using CCD pins
  • Improved CTSU2 diagnosis feature in r_ctsu
  • Fixed issues in CTSU2 CCO correction for devices with certain characteristics (announced in R20TS1229EJ0100), and CTSU1 CCO correction for RA4M2 and RA4M3
  • Fixed MPU region size check to avoid configuring zero size regions when D-Cache is enabled for RA8 devices
  • RSIP Protected Mode driver improvements:
    • Reduced code size for RSIP-E51A and RSIP-E50D PM drivers
    • Updated control procedures for the RSIP-E11A PM driver to code size reduction version
    • Updated CAVP certified module for RSIP-E31A PM driver due to re-acquisition of CAVP certification
    • Bugs fixed:
      • Buffer size of cert info and wrapped secret was not defined correctly when using brainpool curve
      • Buffer size of input message was not defined correctly when using KDF-SHA 512
  • Updated PQC-Lib V2.00 with stack overflow bug fix
  • Fixed incorrect bit length for SCE9 PSA Crypto wrapped keys
  • Updated description for RAMP in MDF
  • Fixed link bug r_ether with ICS1894 PHY
  • Updated IAR toolchain to v9.70.4
  • Fixed build error when user custom PHY function is used on ESWM
  • Fixed rm_motor_control callback issue when 2 motors are enabled
  • rm_motor_pm_foc module:
    • Fixed a unit typo where degree values were assigned to variables intended to be in radians
    • Optimized the sine and cosine calculations in the transform function within the current control loop of rm_motor_pm_foc_inner
    • Fixed typos in rm_motor_pm_foc.h:
      • Renamed p_to_outer_active to p_to_inner_active in the outer module
      • Renamed p_to_outer_copy to p_to_inner_copy in the outer module
  • rm_motor_sensor module:
    • Fixed a unit typo where degree values were stored in variables intended for radians
    • Fixed an issue where the sign of e_q inverted during deceleration, causing a loss of value continuity and resulting in incorrect angle integration
  • Added D-Cache enabled support for RA8 devices for below modules:
    • DTC: Review DTC documentation for details
    • SPI_B: Review SPI_B documentation for details
    • SCI_B_SPI: Review SCI_B_SPI documentation for details
    • SCI_B_UART: Review SCI_B_UART documentation for details
  • Corrected the copyright notice errors in the CAVP module source files for RSIP-E31A
  • Improved rm_psa_crypto SHA-256 code to handle message lengths that are multiples of 128 bytes
  • Updated workaround document for e2 studio 2026-04 pin configuration tooling
  • Updated the BSP usage notes and Cortex-M85 cache document with information relevant to DTC driver D-Cache support
  • Fixed an error in the macro definitions that specify the sizes of the key buffer for SCE9 Key Injection
  • Fixed pin output support enable when using the compare match feature
  • LVGL updates:
    • Enabled runtime control of the GPU (enable/disable)
    • Fixed the screen lock issue when using Dave2D
    • Set LV_USE_OBJ_NAME to enabled by default
  • Fixed D-Cache enable and warmstart post-initialization call sequence in SystemInit()
  • Corrected maximum configurable bitrate for R_SPI_B
  • Updated procedures for RSIP-E51A
  • ThreadX projects no longer globally disable GCC sign conversion warnings
  • Fixed WDT security attribution not set in secure project in RA8x2

Known Issues

  • Solution Projects (TrustZone, Multicore):
    • There are issues related to pin configuration in e2 studio 2026-04.2. Refer to this document for workarounds
  • RA0x devices:
    • HS400x and ZMOD4xxx sensors cannot be used on RA0E1
    • FS3000 sensor does not support SAU-I2C driver
  • Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
  • PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to a specific Linux OS (USB Host).
  • EWARM version 9.70.4 does not contain support for RA0E3. To develop with IAR for these devices, it is necessary to install a support patch file for which can be downloaded by EWARM v9.70.4 users from the IAR MyPages system
    • RA0E3 (arm_Renesas_RA0E3_20260106_1.zip)
  • When importing projects in e2 studio that were created using a previous toolchain version, be sure that the version specified in the project is integrated (Window->Preferences->Renesas->Renesas Toolchain Integration) or select the appropriate toolchain version if upgrading the project to a later FSP version.
  • When upgrading RA6T2 projects to FSP 6.4.0, the GTETRGx pin assignments might be lost; please re-assign the pins manually.
  • When upgrading RA0E1/E2/L1 projects to FSP 6.4.0, the SAU_SPI00 pin group might be changed; please restore the pin group manually.
  • For known issues in the tools, please refer to the respective tool's release notes e2 studio RN.
  • Updated rm_psa_cryto header to allow using the functions in a CPP project

Visit GitHub Issues for this project.

Downloads

Documentation

Design & Development

Note: Separate installation of e² studio is not required for FSP, as the FSP Platform Installer installs e² studio and all other tools required to use FSP.

 

Videos & Training

Learn how to import and run Flexible Software Package (FSP) example projects in e² studio using the RZ/A3UL Evaluation Board Kit. The same workflow applies to both RZ and RA device families. This video walks through three demos covering ADC configuration, USB PCDC communication, and LCDC display control.

Additional Details

Components

  • CMSIS compliant pack files for e2 studio integrated development environment
  • BSPs for RA MCUs and boards
  • HAL drivers to access peripherals
  • Real Time Operating Systems (RTOS)
  • Middleware stacks and protocols
  • Module configurators and code generators
  • Source files to integrate with any development environment and third-party tools

Supported Toolchains

Software components in the FSP support following toolchains:

  • e2 studio Integrated Development Environment, with toolchain supports of GCC Arm Embedded and LLVM Embedded Toolchain for Arm
  • IAR Embedded Workbench
  • Arm Keil MDK

Software Installation Instructions

Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions

e2 studio Integrated Development Environment

The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.

e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:

BSP configuration

Configure or change MCU and board-specific parameters from the initial project selection.

Clock Configuration

Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.

Pin Configuration

The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.

Module Configuration

The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.

Interrupt Configuration

Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.

Components Configuration

The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.

QE Tools

QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.

The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.

Other Tool Features

  • Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
  • Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
  • Smart Manual that provides driver and device documentation in the form of tooltips right in the code
  • Edit Hover feature to show detailed descriptions of code elements while editing
  • Welcome Window with links to example projects, application notes and a variety of other self-help support resources
  • Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.

Third Party Tool Support

In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.

Resources

Support

Support Communities

  1. Is there FSP(Flexible Software Package) in RL78/G23 as RA has like /ra, /ra_cfg, and ra_gen?

    ... product which has RA Flexible Software Package (FSP).  I generated the code using Smart Configurator in RL78, but couldn't see the code style like RA on /ra, /ra_cfg, and ra_gen.  Does Renesas support  FSP(Flexible Software Package) for RL78/G23 and may I get ...

    Feb 12, 2025
  2. RA2A1 and FSP package missing peripheral driver

    Hi I see the SJ1A and RA2A1 are the same chip but using the RA Flexible Software Package (FSP) in the E2Studio Configurator are missing the driver for some analog  pheripheral. The driver for OPAMP, SigmaDeltaADC, DAC8 driver .. are not in the TAB stack and are not selecteble using NewStack ...

    Nov 28, 2019
  3. Endless loop situation in r_agt_common_preamble() (FSP 16 bit AGT)

    Hello, I'm using the R7FA6E10D2CFM with the Renasas RA FSP 5.5.0 and FreeRTOS Kernel V10.6.1. I've experienced an endless loop situation in r_agt_common_preamble(). The problem happens when AGT1 (16 bit) interrupt occurs while my FreeRTOS task is calling R_AGT_Stop ...

    Aug 13, 2025
View All Results from Support Communities (1885)

Knowledge Base

  1. LVGL: Using 32-bit Color Formats with GLCDC

    ... is a lightweight open-source embedded graphics library designed for microcontroller-based user interfaces. A Renesas-maintained port of LVGL is now included in the RA Flexible Software Package (FSP), making it straightforward to integrate LVGL into RA MCU projects through the FSP Configurator*. Several Renesas MCU families are designed ...

    Jan 6, 2026
  2. RA Family: Secure key injection and flash programming in mass production using RFP CLI interface

    ... Mode and Protected Mode: In Compatibility Mode, the security engines can inject secure keys as well as plaintext keys. Key injection must be performed using RA Family Flexible Software Package (FSP) APIs. All security engines support Compatibility Mode. In Protected Mode, the security engines can inject only secure keys. Key ...

    Jan 29, 2026
  3. RA6T2 : Compatibility

    ... also been optimized for motor control.However, the CPU core is naturally compatible with the Arm Cortex-M series, and the peripheral functions are highly compatible. In addition, RA6T2 applies FSP (Flexible Software Package) like other RA family products, which enhances the reusability of software assets and enables flexible development.

    Dec 9, 2021
View All Results from Knowledge Base (327)
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