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Features

  • CPU and DDR Memory Interfaces
    • 2x Cortex-A53 up to 1.0GHz
    • 32-bit LPDDR4-3200
  • Vision and Artificial Intelligence
    • AI Accelerator; DRP-AI at 1.0 TOPS/W class
    • Image Signal Processor (ISP) of multi-stream available
    • Camera Interface; 2x MIPI CSI
    • Face and Human Detection Engine
  • Video and Graphics, Display
    • H.265/H.264 Multi Codec
      Encoding; h.265 up to 2160p30, h.264 up to 1080p120
      Decoding; h.265 up to 2160p30, h.264 up to 1080p120
    • 2D Graphics Engine; 200MPixels/s
    • Display; MIPI-DSI (4-lane), HDMI 1.4a
  • High Speed Interfaces
    • 1x Gigabit Ethernet
    • 1x USB3.1 Gen1 Host/Peripheral
    • 1x PCIe Gen 2 (1-lane)
    • 2x SDIO 3.0
    • 1x NAND Flash Interface ONFI1.0
    • 1x eMMC 4.5.1
  • Hardware Security Engine provided
  • Package: FCBGA, 15x15mm 0.5mm pitch
  • Explore Renesas-validated DRAM Compatibility List

Description

The AI hardware IP, DRP-AI, configured with DRP and AI-MAC, combines both a high-speed AI inference and low power consumption and realizes 1TOPS/W class power performance. In addition, the image signal processor (ISP) is highly robust, producing a stable image independent of the environment, allowing for a high AI recognition accuracy. With these features, the RZ/V2M realizes low power consumption, which is a challenge for embedded devices, making heat dissipation measures easier. Since heat sinks and cooling fans are no longer needed, the equipment can be miniaturized and the BOM cost can be reduced. The result is that it is ideal for vision AI applications in a wide range of embedded markets, including surveillance security, retail, office automation (OA), industrial automation, robotics, and healthcare. In addition, the RZ/V2M also features abundant high-speed communication interfaces such as USB 3.1, PCI-Express, Gigabit Ethernet, and many CPU peripheral functions, so it can also be used in a variety of applications.

Parameters

AttributesValue
CPU ArchitectureArm
Main CPUCortex-A53 x 2
Program Memory (KB)0
RAM (KB)1200
Carrier TypeBulk (Tray), Full Carton (Tray)
Supply Voltage (V)3.135 - 3.465
I/O Ports177
NPUYes
DRAM I/FLPDDR4-3200 (32-bit)
3D GPU2D Graphics Engine
Temp. Range (°C)Tj = -40 to +103
Operating Freq (Max) (MHz)996
Ethernet speed10M/100M/1G
Ethernet (ch)1
EtherCat (ch) (#)0
USB FS (host ch/device ch)( 1 / 1 )
USB HS (host ch/device ch)( 1 / 1 )
USB SS (host ch/device ch)( 1 / 1 )
PCI Express (generation and ch)PCIe (Gen.2.0 2Lane) x 1 ch
SCI or UART (ch)2
SPI (ch)0
I2C (#)4
CAN (ch)0
CAN-FD (ch)0
WirelessNo
SDHI (ch)2
High Resolution Output TimerNo
PWM Output (pin#)0
32-Bit Timer (ch)32
16-Bit Timer (ch) (#)0
8-Bit Timer (ch)0
Standby operable timerNo
Asynchronous General Purpose Timer / Interval Timer (ch)0
16-Bit A/D Converter (ch)0
14-Bit A/D Converter (ch)0
12-Bit A/D Converter (ch)20
10-Bit A/D Converter (ch)0
24-Bit Sigma-Delta A/D Converter (ch)0
16-Bit D/A Converter (ch)0
12-Bit D/A Converter (ch)0
10-Bit D/A Converter (ch) (#)0
8-Bit D/A Converter (ch)0
Capacitive Touch Sensing Unit (ch)0
Graphics LCD ControllerNo
MIPI Interfaces (DSI) (ch)1
MIPI Interfaces (CSI) (ch)2
Image CodecH.264/H.265
Segment LCD ControllerNo
Security & EncryptionNo

Package Options

Pkg. TypePkg. Dimensions (mm)Lead Count (#)Pitch (mm)
FCBGA15 x 15 x 1.98410.5

Application Block Diagrams

Automated optical inspection block diagram utilizes a powerful MPU and M.2 Type E Wi-Fi/Bluetooth module featuring 4x4 MIMO antenna.
Automated Optical Inspection (AOI)
Powerful MPU with DRP-AI and Wi-Fi 6 support for high-speed, low-latency AOI systems.
The high-performance surveillance camera interactive block diagram features an MPU design with DRP-AI, delivering powerful AI processing and energy efficiency.
AI-Enabled Surveillance Camera
AI-powered surveillance camera with DRP-AI boosts security with 4K imaging and low power.

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Part NumberStatusSamplesStockPackageBudgetary Price (USD)Carrier TypeFamily NameSeries NameGroup NameCPU ArchitectureMain CPUSub CPUFloating Point UnitBit LengthProgram Memory (KB)Data Flash (KB)RAM (KB)ECC SRAMLead Count (#)Pitch (mm)Pkg. Dimensions (mm)Number of Supply Voltage(s) (#)Supply Voltage (V)I/O PortsDMAC or DTCDMA (ch)Temperature Sensor (ch) (#)Power-On ResetWatchdog Timer (ch)External Memory Bus (bit)DRAM I/FNPU3D GPUAcceleratorMOQTemp. Range (°C)External Interrupt Pins (#)LVD or PVDOperating Freq (Max) (MHz)Sub-clock (32.768 kHz)On-chip OscillatorEthernet speedEthernet (ch)EtherCat (ch) (#)USB Ports (#)USB FS (host ch/device ch)USB HS (host ch/device ch)USB SS (host ch/device ch)PCI Express (generation and ch)SCI or UART (ch)SPI (ch)QSPI (ch)OSPI (ch)I2C (#)I3C (ch)CAN (ch)CAN-FD (ch)WirelessIrDALIN (#)SDHI (ch)High Resolution Output TimerPWM Output (pin#)32-Bit Timer (ch)16-Bit Timer (ch) (#)8-Bit Timer (ch)Standby operable timerAsynchronous General Purpose Timer / Interval Timer (ch)RTC16-Bit A/D Converter (ch)14-Bit A/D Converter (ch)12-Bit A/D Converter (ch)10-Bit A/D Converter (ch)24-Bit Sigma-Delta A/D Converter (ch)16-Bit D/A Converter (ch)12-Bit D/A Converter (ch)10-Bit D/A Converter (ch) (#)8-Bit D/A Converter (ch)Analog Comparator (ch)OPAMP (ch) (#)PGA (ch)Capacitive Touch Sensing Unit (ch)Graphics LCD ControllerMIPI Interfaces (DSI) (ch)MIPI Interfaces (CSI) (ch)Camera I/F (Parallel)Image Codec2D Drawing EngineSegment LCD ControllerSSI (ch)Security & EncryptionDebug InterfaceMoisture Sensitivity Level (MSL)Country of AssemblyCountry of Wafer Fabrication
R9A09G011GBG#ACCActiveAvailableIn StockFBGA1ku | $36.08Bulk (Tray)RZRZ/VV2MArmCortex-A53 x 2NoDouble/Single64001200KBYes841#0.5mm15 x 15 x 1.96#3.135 - 3.465177DMAC162#No232LPDDR4-3200 (32-bit)Yes2D Graphics EngineDRP-AI1Tj = -40 to +1038#No996MHzNoYes10M/100M/1G1ch01#( 1 / 1 )( 1 / 1 )( 1 / 1 )PCIe (Gen.2.0 2Lane) x 1 ch20004#000NoNo02No03200No0No00200000000000No12NoH.264/H.265NoNo1chNoJTAG3TAIWANUSA
R9A09G011GBG#BCCActiveAvailableOut of StockFBGA1ku | $36.08Full Carton (Tray)RZRZ/VV2MArmCortex-A53 x 2NoDouble/Single64001200KBYes841#0.5mm15 x 15 x 1.96#3.135 - 3.465177DMAC162#No232LPDDR4-3200 (32-bit)Yes2D Graphics EngineDRP-AI1008Tj = -40 to +1038#No996MHzNoYes10M/100M/1G1ch01#( 1 / 1 )( 1 / 1 )( 1 / 1 )PCIe (Gen.2.0 2Lane) x 1 ch20004#000NoNo02No03200No0No00200000000000No12NoH.264/H.265NoNo1chNoJTAG3TAIWANUSA

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DRAM & Flash Memory Solutions

Provides a comprehensive external memory solution for Renesas RZ and R‑Car families, supporting systems that require scalable off‑chip memory. Supported memory types include Serial NAND (Quad/Octal SPI, 512Mb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), ONFI NAND (ONFI 1.0, 1Gb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), DRAM (DDR2/3/4 from 512Mb to 32Gb and LPDDR2/3/4/4x/5/5x from 1Gb to 16Gb), and HyperRAM™ (HyperBus, 64Mb to 512Mb, 1.8V and 1.2V).