Package Information
| Pitch (mm) | 0.5 |
| Lead Count (#) | 841 |
| Pkg. Dimensions (mm) | 15 x 15 x 2.1 |
| Pkg. Code | pkg_11904 |
| Pkg. Type | FCBGA |
Environmental & Export Classifications
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | 5A002 |
| HTS (US) | 85423190000 |
| RoHS (R9A09G011GBG#ACC) | EnglishJapanese |
| Pb (Lead) Free | Yes |
Product Attributes
| Carrier Type | Full Carton (Tray) |
| Family Name | RZ |
| Series Name | RZ/V |
| Group Name | V2M |
| CPU Architecture | Arm |
| Main CPU | Cortex-A53 x 2 |
| Sub CPU | No |
| Floating Point Unit | Double/Single |
| Bit Length | 64 |
| Program Memory (KB) | 0 |
| Data Flash (KB) | 0 |
| RAM (KB) | 1200 |
| ECC SRAM | Yes |
| Lead Count (#) | 841 |
| Pitch (mm) | 0.5 |
| Pkg. Dimensions (mm) | 15 x 15 x 1.9 |
| Number of Supply Voltage(s) (#) | 6 |
| Supply Voltage (V) | 3.135 - 3.465 |
| I/O Ports | 177 |
| DMAC or DTC | DMAC |
| DMA (ch) | 16 |
| Temperature Sensor (ch) (#) | 2 |
| Power-On Reset | No |
| Watchdog Timer (ch) | 2 |
| External Memory Bus (bit) | 32 |
| DRAM I/F | LPDDR4-3200 (32-bit) |
| 3D GPU | 2D Graphics Engine |
| Accelerator | DRP-AI |
| Temp. Range | Tj = -40 to +103°C |
| External Interrupt Pins (#) | 8 |
| LVD or PVD | No |
| Operating Freq (Max) (MHz) | 996 |
| Operating Freq of Sub CPU (Max) | 0 |
| Sub-clock (32.768 kHz) | No |
| On-chip Oscillator | Yes |
| Ethernet speed | 10M/100M/1G |
| Ethernet (ch) | 1 |
| EtherCat (ch) (#) | 0 |
| USB Ports (#) | 1 |
| USB FS (host ch/device ch) | ( 1 / 1 ) |
| USB HS (host ch/device ch) | ( 1 / 1 ) |
| USB SS (host ch/device ch) | ( 1 / 1 ) |
| PCI Express (generation and ch) | PCIe (Gen.2.0 2Lane) x 1 ch |
| SCI or UART (ch) | 2 |
| SPI (ch) | 0 |
| QSPI (ch) | 0 |
| OSPI (ch) | 0 |
| I2C (#) | 4 |
| I3C (ch) | 0 |
| CAN (ch) | 0 |
| CAN-FD (ch) | 0 |
| Wireless | No |
| IrDA | No |
| LIN (#) | 0 |
| SDHI (ch) | 2 |
| High Resolution Output Timer | No |
| PWM Output (pin#) | 0 |
| 32-Bit Timer (ch) | 32 |
| 16-Bit Timer (ch) (#) | 0 |
| 8-Bit Timer (ch) | 0 |
| Standby operable timer | No |
| Asynchronous General Purpose Timer / Interval Timer (ch) | 0 |
| RTC | No |
| 16-Bit A/D Converter (ch) | 0 |
| 14-Bit A/D Converter (ch) | 0 |
| 12-Bit A/D Converter (ch) | 20 |
| 10-Bit A/D Converter (ch) | 0 |
| 24-Bit Sigma-Delta A/D Converter (ch) | 0 |
| 16-Bit D/A Converter (ch) | 0 |
| 12-Bit D/A Converter (ch) | 0 |
| 10-Bit D/A Converter (ch) (#) | 0 |
| 8-Bit D/A Converter (ch) | 0 |
| Analog Comparator (ch) | 0 |
| OPAMP (ch) (#) | 0 |
| PGA (ch) | 0 |
| Capacitive Touch Sensing Unit (ch) | 0 |
| Graphics LCD Controller | No |
| MIPI Interfaces (DSI) (ch) | 1 |
| MIPI Interfaces (CSI) (ch) | 2 |
| Camera I/F (Parallel) | No |
| Image Codec | H.264/H.265 |
| 2D Drawing Engine | No |
| Segment LCD Controller | No |
| SSI (ch) | 1 |
| Security & Encryption | No |
| Debug Interface | JTAG |
| Moisture Sensitivity Level (MSL) | 3 |
| Country of Assembly | Taiwan |
| Country of Wafer Fabrication | United States |
| Price (USD) | 1ku | 45.45833 |
| 12-Bit Timer (ch) | 0 |
| 32-Bit High Res Timer (ch) | 0 |
| ADC | 12-bit x 20-ch |
| Asynchronous General Purpose Timer (ch) | 0 |
| Bit Size | 64 |
| CPU | Cortex-A53 x 2 |
| DMA | Yes |
| Delta-Sigma A/D Converter | No |
| Ethernet | 10/100M/1G x 1 ch |
| Family Name | |
| Group Name | |
| High-Speed Analog Comparator (ch) | 0 |
| Human Machine Interface | Display Function |
| Lead Compliant | Yes |
| Length (mm) | 15 |
| Low-Power Analog Comparator (ch) | 0 |
| MOQ | 1 |
| PLL | Yes |
| Pb (Lead) Free | Yes |
| Pkg. Type | FCBGA |
| SPI (#) | 0 |
| Suggested Kits | RZ/V2M-EVKIT |
| Tape & Reel | No |
| Thickness (mm) | 1.9 |
| Timer | 32-bit x 32-ch |
| UART (#) | 2 |
| USB | USB3.1 Gen1 x 1 ch (H/F) |
| USB MCU/ USB ASSP | USB MCU |
| USB Remarks | SuperSpeed(Gen1) Support |
| USBFS (ch) | 1 |
| USBHS (ch) | 1 |
| Width (mm) | 15 |
Description
The AI hardware IP, DRP-AI, configured with DRP and AI-MAC, combines both a high-speed AI inference and low power consumption and realizes 1TOPS/W class power performance. In addition, the image signal processor (ISP) is highly robust, producing a stable image independent of the environment, allowing for a high AI recognition accuracy. With these features, the RZ/V2M realizes low power consumption, which is a challenge for embedded devices, making heat dissipation measures easier. Since heat sinks and cooling fans are no longer needed, the equipment can be miniaturized and the BOM cost can be reduced. The result is that it is ideal for vision AI applications in a wide range of embedded markets, including surveillance security, retail, office automation (OA), industrial automation, robotics, and healthcare. In addition, the RZ/V2M also features abundant high-speed communication interfaces such as USB 3.1, PCI-Express, Gigabit Ethernet, and many CPU peripheral functions, so it can also be used in a variety of applications.