Learn how Renesas’ REXFET-1 process uses a split-gate trench structure to minimize conduction and switching losses, delivering significant advances from previous ANM1/ANM2 super-junction technologies.
The RL78/F25 is the first automotive MCU equipped with a capacitive sensing unit, supporting CAN FD and security to keep up with Electrical/Electronic (E/E) architecture trends.
Learn how Renesas is powering the future with GaN technology and investing in wide bandgap innovation.
Market demands for higher efficiency, density, and reliability in power delivery are driving the need for semiconductor innovation. Read how Renesas GaN is best suited to meet the requirements of high-performance systems.
Learn how power semiconductor technologies like GaN and low-voltage MOSFETs have evolved to meet the increasing demands for efficiency, power density, and reliability in high-performance applications.
Renesas delivers a secure, connected, and scalable Level 2 EV charging solution, empowering reliable, efficient charging for homes, workplaces, and light-commercial deployments.
RAA2S426x sensor signal conditioners address automotive industry challenges such as signal distortion, inaccurate readings, and prolonged development cycles, that compromise vehicle functionality and safety.
Yasuhiro Iizuka, Renesas' new VP of Engineering & Head of HPC Japan SoC Development, joined Renesas late last year from Sony with a goal to accelerate growth by sharpening Renesas' automotive SoC focus.
This executive blog shares insights from D.K Singh, VP of Engineering, Digitalization and Ted Pawela, VP and Head of Customer Success about how Renesas is driving innovation in the embedded systems space.
Learn how the DA14533 Bluetooth LE SoC is leading the charge in TPMS and other next-generation automotive applications.