RE Family, The World’s Most Energy Efficient MCUs with Arm® Cortex® M Core Implemented on Silicon on Thin Buried Oxide (SOTB)

705 ULPMark-CP score certified by EEMBC ULPMark™ benchmark


The RE Family based on the Silicon on Thin Buried Oxide (SOTB™ ) process technology realizes both ultra-low current consumption in both active and standby mode and high speed CPU operation (64MHz) at low voltage (1.62V) , which is impossible to achieve with conventional bulk silicon processes. The RE01 has been certified by EEMBC to have the highest score of 705 for the ULPMark-CP by the EEMBC ULPMark™ benchmark, which has been developed to provide a standard method to compare the energy efficiency of ultra-low power MCUs. In addition, the built-in energy harvesting control circuit enables the equipment to operate from energy harvesting power sources with only weak ambient energy.

The RE Family can significantly extend battery life and deliver high performance even for small batteries and energy harvesting power supplies that can supply only a small amount of current. The RE Family is suitable for many IoT applications such as hybrid watch, smart home/building, healthcare, smart agriculture, structure monitoring, and trackers

Family Lineup



RE0 系列全球顶级超低功耗 MCU 拥有 Arm® Cortex®-M0+ 内核,适用于要求低功耗的物联网设备。它们能够实现 25-35uA/MHz 工作电流(待机模式下电流为 400-500 nA)和低电压高速运行 (1.62V,64MHz),内置功能包括能量采集控制电路、超低功耗 14 位 ADC (4uA),闪存(rewriting时约为 0.6mA),安全功能(Trusted Secure IP),MIP-LCD 并行接口,和 2D 图像引擎。

Group Flash (KB) RAM (KB) Pin Voltage (V) Max Freq (MHz) Features
RE01 1500KB 1536 256 100-156 1.62-3.6 64 能量采集控制电路,超低功耗 14 位 ADC (4uA),闪存(rewriting 时约为0.6mA),Trusted Secure IP,MIP-LCD 并行接口,2D 图像引擎,电机驱动器控制
RE01 256KB 256 128 56-100 1.62-3.6 64 能量采集控制电路,超低功耗 14 位 ADC (4uA),闪存(rewriting 时约为0.6mA),Trusted Secure IP,RTC,32 位唤醒计时器