Evaluation Kit for RA6M3 MCU Group
The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible...
The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M3 is suitable for IoT applications requiring TFT, Ethernet, security, large embedded RAM, and USB High Speed (HS).
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PDF 1.41 MB | Datasheet | |
PDF 27.99 MB 日本語 | Manual - Hardware | |
PPS 40.98 MB | Presentation | |
PPS 18.12 MB | Presentation | |
PDF 8.18 MB 日本語 | Brochure | |
PDF 73 KB | Application Note | |
PDF 70 KB | Application Note | |
PDF 1.63 MB | Application Note | |
PDF 465 KB 日本語 | Flyer | |
PDF 606 KB | Guide | |
PDF 102 KB 日本語 | Technical Update | |
PDF 3.24 MB 日本語 | Quick Start Guide | |
PDF 2.77 MB | Application Note | |
PDF 1.94 MB 日本語 | Application Note | |
PDF 3.64 MB 日本語 | Application Note | |
PDF 169 KB 日本語 | Technical Update | |
PDF 188 KB | Application Note | |
PDF 1.62 MB | Application Note | |
PDF 123 KB 日本語 | Product Change Notice | |
PDF 2.07 MB | Application Note | |
PDF 252 KB | Application Note | |
PDF 3.45 MB | Application Note | |
PDF 5.21 MB | Application Note | |
PDF 169 KB 日本語 | Technical Update | |
PDF 4.03 MB | Application Note | |
PDF 516 KB 日本語 | Technical Update | |
PDF 1.58 MB 日本語 | Application Note | |
PDF 3.75 MB 简体中文 | Application Note | |
PDF 1.96 MB 简体中文 | Application Note | |
PDF 2.33 MB 日本語 | Application Note | |
PDF 67 KB | Application Note | |
PDF 1.17 MB 日本語 | Product Change Notice | |
PDF 2.02 MB | Application Note | |
PDF 19.79 MB 日本語 | Brochure | |
PDF 289 KB | White Paper | |
PDF 3.50 MB | Application Note | |
PDF 257 KB 日本語 | Product Change Notice | |
PDF 658 KB | Application Note | |
PDF 183 KB | Application Note | |
PDF 8.01 MB 日本語 , 简体中文 | Application Note | |
PDF 2.02 MB | Application Note | |
PDF 5.28 MB 日本語 , 简体中文 | Brochure | |
PDF 2.23 MB 日本語 | Application Note | |
PDF 191 KB 日本語 | Technical Update | |
PDF 1.64 MB | Application Note | |
PDF 429 KB | Product Reliability Report | |
PDF 171 KB 日本語 | Product Change Notice | |
PDF 303 KB 日本語 , 简体中文 | Flyer | |
PDF 2.53 MB | Application Note | |
PDF 1.82 MB | Application Note | |
PDF 421 KB 日本語 | Application Note | |
PDF 228 KB 日本語 | Technical Update | |
PDF 670 KB | Application Note | |
PDF 4.37 MB 日本語 | Application Note | |
PDF 628 KB | White Paper | |
PDF 112 KB 日本語 | Technical Update | |
PDF 56 KB | Application Note | |
PDF 195 KB 日本語 | Technical Update | |
PDF 5.08 MB | Application Note | |
PDF 159 KB 日本語 | Technical Update | |
PDF 747 KB | Application Note | |
PDF 566 KB | Quick Start Guide | |
PDF 822 KB | Quick Start Guide | |
PDF 106 KB 日本語 | Technical Update | |
PDF 497 KB 日本語 | Technical Update | |
PDF 294 KB | Application Note | |
PDF 226 KB 日本語 | Technical Update | |
PDF 1.72 MB 日本語 | Application Note | |
PDF 757 KB 日本語 | Application Note | |
PDF 560 KB 日本語 | Technical Update | |
PDF 152 KB 日本語 | Technical Update | |
PDF 226 KB 日本語 | Technical Update | |
PDF 113 KB 日本語 | Technical Update | |
PDF 1.76 MB 日本語 | Application Note | |
PDF 1.73 MB 日本語 | Application Note | |
PDF 891 KB | Application Note | |
PDF 217 KB 日本語 | Technical Update | |
PDF 139 KB 日本語 | Technical Update | |
PDF 7.93 MB 日本語 , 简体中文 | Brochure | |
PDF 1.78 MB | Application Note | |
PDF 110 KB 日本語 | Technical Update | |
PDF 645 KB | Application Note | |
PDF 324 KB 日本語 | Release Note | |
PDF 150 KB | Technical Update | |
PDF 150 KB 日本語 | Technical Update | |
PDF 1.83 MB 日本語 | Application Note | |
PDF 417 KB 日本語 , 简体中文 | Flyer | |
PDF 332 KB 日本語 | Flyer | |
PDF 196 KB 日本語 , 简体中文 | White Paper | |
PDF 178 KB 日本語 , 简体中文 | White Paper | |
PDF 169 KB 日本語 , 简体中文 | White Paper | |
ZIP 8.73 MB 日本語 | Schematic | |
ZIP 42.48 MB 日本語 | Schematic | |
PDF 1.38 MB 日本語 | White Paper | |
PDF 10.28 MB 日本語 , 简体中文 | Other | |
PDF 4.86 MB 日本語 | Product Change Notice | |
PDF 3.74 MB 日本語 | Product Change Notice | |
PDF 14.70 MB 日本語 | General Reliability Literature | |
PDF 1.46 MB 日本語 | Product Change Notice | |
99 items
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Software title
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Software type
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Company
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QE for Capacitive Touch: Development Assistance Tool for Capacitive Touch Sensors In developing embedded system using the capacitive touch sensor of MCUs, you can easily setup initial configurations of the touch interface as well as process the tuning of sensors, and reduce development time. [Plugin for Renesas IDE "e2 studio"] [Standalone Version] [Support MCU/MPU:RA, RL78, RX, Renesas Synergy™]
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Solution Toolkit | Renesas |
Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required.
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Software Package | Renesas |
E2 emulator [RTE0T00020KCE00000R] On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RH850, R-Car D1, RL78, RX]
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Emulator | Renesas |
E2 emulator Lite [RTE0T0002LKCE00000R] On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RL78, RX]
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Emulator | Renesas |
PG-FP6 Flash memory programmer [Programming software: Dedicated GUI-based software, the "FP6 Terminal"] [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, SuperH RISC engine, V850, 78K, R8C]
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Programmer (Unit/SW) | Renesas |
Renesas Flash Programmer (Programming GUI) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78KR, 78K0]
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Programmer (Unit/SW) | Renesas |
RA Smart Configurator The Renesas RA Smart Configurator (RA SC) is a desktop application that helps you in configuring software systems (including a Board Support Package (BSP), drivers, RTOS, and middleware) for RA-Family MCUs when you are using a third-party IDE and toolchain.
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Solution Toolkit | Renesas |
Sensor Software Modules for Renesas MCU Platforms Middleware (FIT module and FSP module) and sample software packages that enable control and data acquisition for Renesas sensor products.
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Sensor | Renesas |
QE for Display: Development Assistance Tool for Display Applications This development assistance tool supports the development of embedded systems which use the LCD display functions of display controllers from Renesas. [Plugin for Renesas IDE "e² studio"] [Support MCU/MPU:RZ, RX, RA]
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Solution Toolkit | Renesas |
Security Key Management Tool Key wrapping tool for key management systems using Renesas security IP. Enables secure installation and update of user application and device lifecycle management (DLM) keys.
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Solution Toolkit | Renesas |
e² studio - information for RA Family Eclipse-based Renesas integrated development environment (IDE).
[Support MCU/MPU: RA, RE, RX, RL78, RH850, Renesas Synergy, RZ]
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IDE and Coding Tool | Renesas |
SEGGER emWin GUI Library for Renesas RA Products SEGGER's emWin graphics library is a ready-to-use solution that provides a versatile and professional GUI platform for creating interactive and high-quality graphical user interfaces on any type of display for the Renesas RA family.
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Imaging | SEGGER |
12 items
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Title | Type | Date Date |
[Software=RA FSP],[Board=EK-RA6M3]
ZIP
29.95 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | |
[Software=RA FSP],[Board=EK-RA6M3G]
ZIP
11.21 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | |
This application project discusses the considerations for securing Data at Rest in an embedded system and provides guidelines on how to use the Security MPU hardware feature of the RA Family MCUs to implement a secure Data at Rest solution.
ZIP
2.50 MB
Compiler:
ARMCC
IDE:
e2 studio
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Sample Code | |
[Software=RA FSP]
ZIP
6.70 MB
日本語
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Sample Code | |
[Software=RA Flexible Software Package|v4.3.0],[Toolchains=GNU Arm Embedded|10.3-2021.10]]
ZIP
5.03 MB
日本語
Application:
Consumer Electronics, Key Technologies
Compiler:
GNU ARM Embedded
Function:
Application Example, HMI
IDE:
e2 studio
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Sample Code | |
Some typical applications for PWM with nanosecond delays are power supply control, motor control, inverter
control, battery charging, digital lightning control, and power factor correction (PFC).
ZIP
2.43 MB
IDE:
e2 studio
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Sample Code | |
The application example provided in this package uses the Secure Crypto Engine (SCE) module based on RA6M3 to generate a device identity unique to each device which is securely stored in the internal flash using the Security Memory Protection Unit (MPU) and the Flash Access Window (FAW) hardware features of the MCU.
ZIP
12.62 MB
Compiler:
ARMCC
IDE:
e2 studio
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Sample Code | |
ZIP 17.69 MB | Sample Code | |
ZIP 7.92 MB | Sample Code | |
[Software=RA FSP | v4.4.0]
ZIP
4.86 MB
|
Sample Code | |
ZIP 7.36 MB | Sample Code | |
MCUboot is a secure bootloader for 32-bit MCUs. It defines a common infrastructure for the bootloader, defines system flash layout on microcontroller systems, and provides a secure bootloader that enables easy software update.
[Toolchains=GCC Arm Embedded|9.3.1.20200408] [Software=RA FSP|v4.2.0] [Board=EK-RA6M3;EK-RA6M4]
ZIP
29.00 MB
Compiler:
GNU Arm Embedded
IDE:
e2 studio
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Sample Code | |
ZIP 13.95 MB | Sample Code | |
This application project is built with the integrated “Azure IoT SDK for Embedded C” package which allows
small embedded (IoT) devices like Renesas RA family of MCUs RA6M3, RA6M4, and RA6M5 to
communicate with Azure services.
ZIP
9.71 MB
IDE:
e2 studio
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Sample Code | |
The application project uses the Flexible Software Package (FSP) of
the RA family|| the GNU GCC compiler|| and the integrated development environment e2 studio IDE to
demonstrate an exception handling flow for multiple possible faults.
ZIP
2.69 MB
Compiler:
GNU ARM Embedded
IDE:
e2 studio, Keil
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Sample Code | |
The application example provided in the package uses AWS IoT Core. The detailed steps in this
document show first-time AWS IoT Core users how to configure the AWS IoT Core platform to run this
application example.
ZIP
4.89 MB
IDE:
e2 studio
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Sample Code | |
The Renesas Flexible Software Package includes Azure RTOS ThreadX® real-time operating system, the
Azure RTOS GUIX library and hardware drivers unified under a single robust software package.
[Toolchains=GCC Arm Embedded|9.3.1.20200408] [Software=RA FSP|v3.1.0] [Board=EK-RA6M3G]
ZIP
4.97 MB
Compiler:
GNU Arm Embedded
IDE:
e2 studio
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Sample Code | |
ZIP 5.06 MB 日本語 Compiler: GNU ARM Embedded, ICCARM Function: Security IDE: e2 studio, IAR EWARM | Sample Code | |
[Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v1.1.0]
ZIP
8.83 MB
日本語
Compiler:
GNU Arm Embedded, IAR Compiler for Arm
Function:
Security
IDE:
e2 studio, IAR EWARM
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Sample Code | |
The driver for the new module is developed while referencing the existing Wi-Fi driver provided by FSP as a starting point.
ZIP
929 KB
IDE:
e2 studio
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Sample Code | |
20 items
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The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible...
The EK-RA6M3G evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using Renesas' Flexible...
The Avnet Silica HoriZone is a cloud-ready Renesas RA board with a multi-sensor Arduino Shield and a secure element. It allows you to explore Renesas RA...
The EBV IoT SmartCTherm solution is powered by the Renesas RA6M3 MCU and Sequans GM01Q. SmartCTherm is a smart IoT sensor node solution that can monitor indoor climate...
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
Select an orderable part number:
Orderable Part ID | Sample |
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R7FA6M3AF2CBG#AC0 | Availability |
R7FA6M3AF2CLK#AC0 | Availability |
R7FA6M3AF3CBG#AC0 | Availability |
R7FA6M3AF3CFB#AA0 | Availability |
R7FA6M3AF3CFB#BA0 | Availability |
R7FA6M3AF3CFB#HA0 | Availability |
R7FA6M3AF3CFC#AA0 | Availability |
R7FA6M3AF3CFC#BA1 | Availability |
R7FA6M3AF3CFP#AA0 | Availability |
R7FA6M3AF3CFP#BA0 | Availability |
R7FA6M3AF3CLK#AC0 | Availability |
R7FA6M3AH2CBG#AC0 | Availability |
R7FA6M3AH2CLK#AC0 | Availability |
R7FA6M3AH3CBG#AC0 | Availability |
R7FA6M3AH3CFB#AA0 | Availability |
R7FA6M3AH3CFB#BA0 | Availability |
R7FA6M3AH3CFC#AA0 | Availability |
R7FA6M3AH3CFC#BA1 | Availability |
R7FA6M3AH3CFP#AA0 | Availability |
R7FA6M3AH3CFP#BA0 | Availability |
R7FA6M3AH3CLK#AC0 | Availability |
Kickstart IoT and embedded systems development using Renesas EK-RA6M5, EK-RA6M4, and EK-RA6M3 evaluation kits for the RA6 MCU series. This video provides an overview of the kit architecture, key features, a quick start example project, and many useful resources to begin innovating quickly with Renesas RA MCUs.
Flash: 2MB RAM: 640kB | ● | ● | ● | ● | ● |
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Flash: 1MB RAM: 640kB | ● | ● | ● | ● | ● |
Pin Count Package Size Pitch | 100-pin LQFP 14x14mm 0.5mm | 144-pin LQFP 20x20mm 0.5mm | 145-pin LGA 7x7mm 0.5mm | 176-pin LQFP 24x24mm 0.5mm | 176-pin BGA 13x13mm 0.8mm |