The Renesas RA6M3 group of microcontrollers (MCUs) uses the high-performance Arm® Cortex®-M4 core and offers a TFT controller with 2D accelerator and JPEG decoder. Additionally, the RA6M3 MCU offers Ethernet MAC with individual DMA and USB high-speed interface to ensure high data throughput. The RA6M3 MCU is built on a highly efficient 40nm process and is supported by an open and flexible ecosystem concept—the Flexible Software Package (FSP), built on FreeRTOS—and is expandable to use other RTOSes and middleware. The RA6M3 is suitable for IoT applications requiring TFT, Ethernet, security, large embedded RAM, and USB High Speed (HS).

Features

  • 120MHz Arm® Cortex®-M4
  • 1MB - 2MB Flash memory and 640kB SRAM
  • 64kB Data Flash to store data as in EEPROM
  • Scalable from 100-pin to 176-pin packages
  • Ethernet controller with DMA
  • TFT controller/2D accelerator/JPEG decoder
  • Capacitive touch sensing unit
  • USB 2.0 Full Speed/USB High Speed
  • CAN 2.0B
  • SCI (UART, Simple SPI, Simple I2C)
  • SPI/I2C multimaster interface/SDHI

Applications

  • HMI (small/mid size TFT)
  • Applications with demand for High Speed USB and wired Ethernet applications
  • Security (fire detection, burglar detection, panel control)
  • Industry (robotics, door openers, sewing machines, vending machines, UPS)
  • HVAC (heating, air conditioning, boiler control)
  • General purpose

Product Options

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Download Toggle Controls Full Screen Reset
PLP Program Memory (KB) Data Flash (KB) RAM (KB) Lead Count (#) Pkg. Type Supply Voltage (V) Operating Freq (Max) (MHz) RTC LVD DMA I/O Ports Timer ADC DAC CAN (ch) CAN Interface Ethernet USB Human Machine Interface Bit Size CPU Temp. Range Security & Encryption Buy / Sample
R7FA6M3AF3CFP#AA0
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2033 Oct 1024 64 640 100 LQFP 2.7 - 3.6 120 1 1 DMAC x 8ch, DTC 76 32-bit x 13-ch 12-bit x 19-ch 12-bit x 2-ch 2 CAN x 2ch Yes USB Endpoints x 10, USB Host, USB Isochronous Transfer Support, USB Peripheral, USB Ports (ch) x 1 2D drawing engine, Camera Interface PDC, Capacitive Sensing Unit 18ch, Graphics LCD Controller, JPEG codec 32 ARM CM4 -40 to 105°C 3DES, 128-bit unique ID, AES, ARC4, DSA, ECC, GHASH, Key Management, MD5, RSA, SHA1, SHA224, SHA256, TRNG Get Samples,
R7FA6M3AF2CBG#AC0
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2033 Oct 1024 64 640 176 LFBGA 2.7 - 3.6 120 1 1 DMAC x 8ch, DTC 133 32-bit x 14-ch 12-bit x 24-ch 12-bit x 2-ch 2 CAN x 2ch Yes USB Endpoints x 10, USB Hi-Speed Support, USB Host, USB Isochronous Transfer Support, USB Peripheral, USB Ports (ch) x 2 2D drawing engine, Camera Interface PDC, Capacitive Sensing Unit 18ch, Graphics LCD Controller, JPEG codec 32 ARM CM4 -40 to 85°C 3DES, 128-bit unique ID, AES, ARC4, DSA, ECC, GHASH, Key Management, MD5, RSA, SHA1, SHA224, SHA256, TRNG Get Samples,
R7FA6M3AH2CBG#AC0
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PCB Symbol, Footprint, and 3D Model
2033 Oct 2048 64 640 176 LFBGA 2.7 - 3.6 120 1 1 DMAC x 8ch, DTC 133 32-bit x 14-ch 12-bit x 24-ch 12-bit x 2-ch 2 CAN x 2ch Yes USB Endpoints x 10, USB Hi-Speed Support, USB Host, USB Isochronous Transfer Support, USB Peripheral, USB Ports (ch) x 2 2D drawing engine, Camera Interface PDC, Capacitive Sensing Unit 18ch, Graphics LCD Controller, JPEG codec 32 ARM CM4 -40 to 85°C 3DES, 128-bit unique ID, AES, ARC4, DSA, ECC, GHASH, Key Management, MD5, RSA, SHA1, SHA224, SHA256, TRNG Get Samples,
R7FA6M3AH3CFC#AA0
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PCB Symbol, Footprint, and 3D Model
2033 Oct 2048 64 640 176 LQFP 2.7 - 3.6 120 1 1 DMAC x 8ch, DTC 133 32-bit x 14-ch 12-bit x 24-ch 12-bit x 2-ch 2 CAN x 2ch Yes USB Endpoints x 10, USB Hi-Speed Support, USB Host, USB Isochronous Transfer Support, USB Peripheral, USB Ports (ch) x 2 2D drawing engine, Camera Interface PDC, Capacitive Sensing Unit 18ch, Graphics LCD Controller, JPEG codec 32 ARM CM4 -40 to 105°C 3DES, 128-bit unique ID, AES, ARC4, DSA, ECC, GHASH, Key Management, MD5, RSA, SHA1, SHA224, SHA256, TRNG Get Samples,
R7FA6M3AH3CFP#AA0
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PCB Symbol, Footprint, and 3D Model
2033 Oct 2048 64 640 100 LQFP 2.7 - 3.6 120 1 1 DMAC x 8ch, DTC 76 32-bit x 13-ch 12-bit x 19-ch 12-bit x 2-ch 2 CAN x 2ch Yes USB Endpoints x 10, USB Host, USB Isochronous Transfer Support, USB Peripheral, USB Ports (ch) x 1 2D drawing engine, Camera Interface PDC, Capacitive Sensing Unit 18ch, Graphics LCD Controller, JPEG codec 32 ARM CM4 -40 to 105°C 3DES, 128-bit unique ID, AES, ARC4, DSA, ECC, GHASH, Key Management, MD5, RSA, SHA1, SHA224, SHA256, TRNG Get Samples,
R7FA6M3AF3CFC#AA0
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PCB Symbol, Footprint, and 3D Model
2033 Oct 1024 64 640 176 LQFP 2.7 - 3.6 120 1 1 DMAC x 8ch, DTC 133 32-bit x 14-ch 12-bit x 24-ch 12-bit x 2-ch 2 CAN x 2ch Yes USB Endpoints x 10, USB Hi-Speed Support, USB Host, USB Isochronous Transfer Support, USB Peripheral, USB Ports (ch) x 2 2D drawing engine, Camera Interface PDC, Capacitive Sensing Unit 18ch, Graphics LCD Controller, JPEG codec 32 ARM CM4 -40 to 105°C 3DES, 128-bit unique ID, AES, ARC4, DSA, ECC, GHASH, Key Management, MD5, RSA, SHA1, SHA224, SHA256, TRNG Get Samples,
R7FA6M3AH2CLK#AC0
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PCB Symbol, Footprint, and 3D Model
2033 Oct 2048 64 640 145 TFLGA 2.7 - 3.6 120 1 1 DMAC x 8ch, DTC 110 32-bit x 14-ch 12-bit x 22-ch 12-bit x 2-ch 2 CAN x 2ch Yes USB Endpoints x 10, USB Host, USB Isochronous Transfer Support, USB Peripheral, USB Ports (ch) x 1 2D drawing engine, Camera Interface PDC, Capacitive Sensing Unit 18ch, Graphics LCD Controller, JPEG codec 32 ARM CM4 -40 to 85°C 3DES, 128-bit unique ID, AES, ARC4, DSA, ECC, GHASH, Key Management, MD5, RSA, SHA1, SHA224, SHA256, TRNG Get Samples,
R7FA6M3AF3CFB#AA0
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Env. Documentation
PCB Symbol, Footprint, and 3D Model
2033 Oct 1024 64 640 144 LQFP 2.7 - 3.6 120 1 1 DMAC x 8ch, DTC 110 32-bit x 14-ch 12-bit x 22-ch 12-bit x 2-ch 2 CAN x 2ch Yes USB Endpoints x 10, USB Host, USB Isochronous Transfer Support, USB Peripheral, USB Ports (ch) x 1 2D drawing engine, Camera Interface PDC, Capacitive Sensing Unit 18ch, Graphics LCD Controller, JPEG codec 32 ARM CM4 -40 to 105°C 3DES, 128-bit unique ID, AES, ARC4, DSA, ECC, GHASH, Key Management, MD5, RSA, SHA1, SHA224, SHA256, TRNG Get Samples,
R7FA6M3AH3CFB#AA0
Active
Pkg. Info
Env. Documentation
PCB Symbol, Footprint, and 3D Model
2033 Oct 2048 64 640 144 LQFP 2.7 - 3.6 120 1 1 DMAC x 8ch, DTC 110 32-bit x 14-ch 12-bit x 22-ch 12-bit x 2-ch 2 CAN x 2ch Yes USB Endpoints x 10, USB Host, USB Isochronous Transfer Support, USB Peripheral, USB Ports (ch) x 1 2D drawing engine, Camera Interface PDC, Capacitive Sensing Unit 18ch, Graphics LCD Controller, JPEG codec 32 ARM CM4 -40 to 105°C 3DES, 128-bit unique ID, AES, ARC4, DSA, ECC, GHASH, Key Management, MD5, RSA, SHA1, SHA224, SHA256, TRNG Get Samples,
R7FA6M3AF2CLK#AC0
Active
Pkg. Info
Env. Documentation
PCB Symbol, Footprint, and 3D Model
2033 Oct 1024 64 640 145 TFLGA 2.7 - 3.6 120 1 1 DMAC x 8ch, DTC 110 32-bit x 14-ch 12-bit x 22-ch 12-bit x 2-ch 2 CAN x 2ch Yes USB Endpoints x 10, USB Host, USB Isochronous Transfer Support, USB Peripheral, USB Ports (ch) x 1 2D drawing engine, Camera Interface PDC, Capacitive Sensing Unit 18ch, Graphics LCD Controller, JPEG codec 32 ARM CM4 -40 to 85°C 3DES, 128-bit unique ID, AES, ARC4, DSA, ECC, GHASH, Key Management, MD5, RSA, SHA1, SHA224, SHA256, TRNG Get Samples,

Documentation & Downloads

Title language Type Format File Size Date
Datasheets & Errata
RA6M3 Microcontroller Group Datasheet – Datasheet PDF 1.46 MB
User Guides & Manuals
RA6M3 Microcontroller Group User's Manual 日本語 Manual PDF 26.52 MB
E2 Emulator, E2 Emulator Lite Additional Document for User's Manual (Notes on Connection of RA Devices) 日本語 Manual PDF 558 KB
Renesas Flash Programmer Sample Circuit for Programming by Using a PC's Serial Port 日本語 Manual PDF 1.14 MB
Technical Updates
RA2A1 Group, RA2L1 Group, RA2E1 Group, RA4M1 Group, RA4W1 Group, RA6M1 Group, RA6M2 Group, RA6M3 Group, RA6T1 Group, Note on ALeRASE command 日本語 Technical Update PDF 152 KB
RA6M1 Group, RA6M2 Group, RA6M3 Group, RA6M4 Group, RA6T1 Group, VBATT minimum voltage level enhancement 日本語 Technical Update PDF 226 KB
RA6M1 Group, RA6M2 Group, RA6M3 Group, adding LGA/BGA packages with operating temperature -40 to +105 °C support 日本語 Technical Update PDF 113 KB
RA6M1, RA6M2, RA6M3 Errata for User's Manual: Hardware for I/O port 日本語 Technical Update PDF 217 KB
RA family, Addition of register definition for Flash 日本語 Technical Update PDF 139 KB
Errata for User's Manual: Hardware for HOCO (TN-RA-A0006A/E) 日本語 Technical Update PDF 110 KB
Errata for User's Manual: Hardware for SCE7 (TN-RA-A0003A/E) 日本語 Technical Update PDF 150 KB
Errata for User's Manual: Hardware for SCE7 (TN-RA*-A0003A/E) (TN-RA*-A0003A/E) – Technical Update PDF 150 KB
Application Notes & White Papers
- EK-RA6M3 Example Project Bundle – Application Note PDF 87 KB
- EK-RA6M3G Example Project Bundle – Application Note PDF 64 KB
RA6 Quick Design Guide 简体中文 Application Note PDF 2.38 MB
- RA AWS MQTT/TLS Cloud Connectivity Solution – Application Note PDF 2.13 MB
RA AWS MQTT/TLS Cloud Connectivity Solution – Application Note PDF 2.13 MB
Getting Started with Low Power Applications for RA6M3 – Application Note PDF 1.42 MB
Partner RTOS Aware Debugging for RA – Application Note PDF 830 KB
- RA Family IEC 60730/60335 Self Test Library for RA MCU (CM33) 日本語 Application Note PDF 1.76 MB
- RA Family IEC 60730/60335 Self Test Library for RA MCU (CM4_CM23) 日本語 Application Note PDF 1.73 MB
RA Family IEC 60730/60335 Self Test Library for RA MCU (CM33) 日本語 Application Note PDF 1.76 MB
RA Family IEC 60730/60335 Self Test Library for RA MCU (CM4_CM23) 日本語 Application Note PDF 1.73 MB
- Getting Started with the Wi-Fi Modules on FSP – Application Note PDF 891 KB
Getting Started with the Wi-Fi Modules on FSP – Application Note PDF 891 KB
Securing Data at Rest Utilizing the Renesas Security MPU – Application Note PDF 1.48 MB
Bring Fast, Accurate Multitouch User Interfaces to Your Designs 日本語, 简体中文 White Paper PDF 660 KB
RA Azure IoT Cloud Connectivity Solution – Application Note PDF 1.78 MB
Renesas RA Securing Data at Rest Using the Arm® TrustZone® – Application Note PDF 870 KB
Renesas RA Security Design with Arm® TrustZone® - IP Protection – Application Note PDF 2.76 MB
Migrating Projects to New FSP Version – Application Note PDF 645 KB
Renesas RA Family Establishing and Protecting Device Identity using SCE7 and Security MPU – Application Note PDF 497 KB
- Securing Data at Rest Utilizing the Renesas Security MPU – Application Note PDF 1.48 MB
Arm® Secure Boot Solution for RA6M3 MCU Group (R01AN5347EU0110) – Application Note PDF 281 KB
- Arm® Secure Boot Solution for RA6M3 MCU Group (R01AN5347EU0110) – Application Note PDF 281 KB
- RA Family Device Identity - Sample Code – Application Note PDF 512 KB
RA Family Device Identity - Sample Code – Application Note PDF 512 KB
RA6M3 Group RA6M3 HMI Expansion Board 日本語 Application Note PDF 1.83 MB
EK-RA6M3G Example Project Overview – Application Note PDF 90 KB
EK-RA6M3 Example Project Overview – Application Note PDF 105 KB
- EK-RA6M3G Example Project Overview – Application Note PDF 90 KB
- EK-RA6M3 Example Project Overview – Application Note PDF 105 KB
RA Family Using QE and FSP to Develop Capacitive Touch Application 日本語 Application Note PDF 963 KB
Renesas RA Family Flash Memory Programming – Application Note PDF 1.85 MB
Renesas RA Family System Specifications for Standard Boot Firmware – Application Note PDF 749 KB
Arm® Secure Boot Solution for RA6M3 MCU Group (R01AN5347EU0100) – Application Note PDF 264 KB
Security for the Connected World 日本語, 简体中文 White Paper PDF 169 KB
How to Solve the 6 Top Security Challenges of Embedded IoT Design 日本語 White Paper PDF 1.38 MB
PCNs & PDNs
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) 日本語 Product Change Notice PDF 4.86 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E ) 日本語 Product Change Notice PDF 3.74 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E ) 日本語 Product Change Notice PDF 1.46 MB
Downloads
EK-RA6M3 Example Project Bundle - Sample Code – Sample Code ZIP 5.87 MB
EK-RA6M3G Example Project Bundle - Sample Code – Sample Code ZIP 5.77 MB
e² studio 2021-04 Linux Host 日本語 Upgrade - IDE XZ 586.56 MB
QE for Capacitive Touch [RA,RL78] V1.3.0: Development Assistance Tool for Capacitive Touch Sensor 日本語 Software ZIP 4.78 MB
RA AWS MQTT/TLS Cloud Connectivity Solution - Sample Code – Sample Code ZIP 2.34 MB
- RA AWS MQTT/TLS Cloud Connectivity Solution - Sample Code – Sample Code ZIP 2.34 MB
- LPM Application – Sample Code ZIP 2.72 MB
RA Family IEC 60730/60335 Self Test Library for RA MCU (CM33) - Sample Code 日本語 Sample Code ZIP 5.06 MB
RA Family IEC 60730/60335 Self Test Library for RA MCU (CM4_CM23) - Sample Code 日本語 Sample Code ZIP 8.83 MB
- RA Family IEC 60730/60335 Self Test Library for RA MCU (CM33) - Sample Code 日本語 Sample Code ZIP 5.06 MB
- RA Family IEC 60730/60335 Self Test Library for RA MCU (CM4_CM23) - Sample Code 日本語 Sample Code ZIP 8.83 MB
Getting Started with the Wi-Fi Modules on FSP - Sample Code – Sample Code ZIP 929 KB
- Getting Started with the Wi-Fi Modules on FSP - Sample Code – Sample Code ZIP 929 KB
- Securing Data at Rest Utilizing the Renesas Security MPU - Sample Code – Sample Code ZIP 1.59 MB
- RA Azure IoT Cloud Connectivity Solution - Sample Code – Sample Code ZIP 2.01 MB
- Renesas RA Securing Data at Rest Using the Arm® TrustZone® - Sample Code – Sample Code ZIP 881 KB
- Renesas RA Security Design with Arm® TrustZone® - IP Protection - Sample Code – Sample Code ZIP 2.66 MB
Securing Data at Rest Utilizing the Renesas Security MPU - Sample Code – Sample Code ZIP 1.59 MB
Getting Started with the Graphics Application for RA Family - Sample Code – Sample Code ZIP 5.74 MB
BSDL Files for RA6M3 日本語 Model ZIP 21 KB
- Arm® Secure Boot Solution for RA6M3 MCU Group - Sample Code - Sample Code (r01an5347eu0110) – Sample Code ZIP 40.83 MB
Arm® Secure Boot Solution for RA6M3 MCU Group - Sample Code - Sample Code (r01an5347eu0110) – Sample Code ZIP 40.83 MB
RA Family Device Identity - Sample Code - Sample Code – Sample Code ZIP 8.13 MB
- RA Family Device Identity - Sample Code - Sample Code – Sample Code ZIP 8.13 MB
- EK-RA6M3G Example Project Overview - Sample Code – Sample Code ZIP 2.96 MB
- EK-RA6M3 Example Project Overview - Sample Code – Sample Code ZIP 3.00 MB
EK-RA6M3G Example Project Overview - Sample Code – Sample Code ZIP 2.96 MB
EK-RA6M3 Example Project Overview - Sample Code – Sample Code ZIP 3.00 MB
QE for Capacitive Touch [RA] V1.1.0: Development Assistance Tool for Capacitive Touch Sensor 日本語 Software ZIP 3.31 MB
- Arm® Secure Boot Solution for RA6M3 MCU Group - Sample Code - Sample Code (r01an5347eu0100) – Sample Code ZIP 40.75 MB
EK-RA6M3Gv1 - Design Package 日本語 Software ZIP 8.73 MB
EK-RA6M3v1 - Design Package 日本語 Software ZIP 42.48 MB
Tool News
[Upgraded to version] e² studio 2021-01 日本語 Tool News - Release PDF 159 KB
[Upgrade to revision] Programming GUI for PG-FP6 Flash Memory Programmer (FP6 Terminal) V1.05.01 日本語 Tool News - Release PDF 57 KB
[Upgrade to revision] Renesas Flash Programmer V3.08.01 日本語 Tool News - Release PDF 81 KB
[Notification] Flash Programmer Survey Invitation 日本語 Tool News - Notification PDF 29 KB
[Upgrade to revision] Solution Toolkit QE for Capacitive Touch[RA] V1.2.0: Development Assistance Tool for Capacitive Touch Sensor 日本語 Tool News - Release PDF 105 KB
[Upgrade to revision] Renesas Flash Programmer V3.08.00 日本語 Tool News - Release PDF 83 KB
[Upgraded to version] e² studio 2020-10 日本語 Tool News - Release PDF 160 KB
[Upgrade to revision] Programming GUI for PG-FP6 Flash Memory Programmer (FP6 Terminal) V1.05.00 日本語 Tool News - Release PDF 72 KB
[Upgrade to revision] Renesas Flash Programmer V3.06.02 日本語 Tool News - Release PDF 80 KB
[Upgraded to version] e² studio 2020-07 日本語 Tool News - Release PDF 159 KB
[Upgrade to revision] Programming GUI for PG-FP6 Flash Memory Programmer (FP6 Terminal) V1.04.02 日本語 Tool News - Release PDF 74 KB
[Upgrade to revision] Programming GUI for PG-FP6 Flash Memory Programmer (FP6 Terminal) V1.04.01 日本語 Tool News - Release PDF 73 KB
[Released on the web] e² studio 2020-04 日本語 Tool News - Release PDF 184 KB
[Upgraded to revision] e² studio Integrated Development Environment V7.8.0 日本語 Tool News - Release PDF 194 KB
[Upgrade to revision] Solution Toolkit QE: Development Assistance Tool for Applications QE for Capacitive Touch[RA] V1.1.0: Development Assistance Tool for Capacitive Touch Sensor 日本語 Tool News - Release PDF 484 KB
[Upgrade to revision] e² studio Integrated Development Environment V7.7.0 日本語 Tool News - Release PDF 128 KB
[Upgrade to revision] Programming GUI for PG-FP6 Flash Memory Programmer (FP6 Terminal) V1.04.00 日本語 Tool News - Release PDF 642 KB
[Upgrade to revision] e² studio Integrated Development Environment V7.6.0 日本語 Tool News - Release PDF 253 KB
Other
An Introduction to Renesas Advanced (RA) MCU Kits – Presentations PPSX 38.31 MB
Deep Dive into EK-RA6M3 and EK-RA6M3G Kits – Presentations PPSX 20.26 MB
Industrial Automation Brochure 日本語, 简体中文 Brochure PDF 7.93 MB
Segger emWin v614d - Documentation, Tools and Samples – Library ZIP 82.99 MB
e² studio 2020-07 Release Note – Release Note PDF 1.52 MB
Segger emWin v614a - Documentation, Tools and Samples 日本語 Other ZIP 79.34 MB
Renesas Flash Programmer V3.06.02 Release Notes 日本語 Release Note PDF 324 KB
e² studio V7.8.0 Release Note – Release Note PDF 1.26 MB
e² studio 2020-04 Release Note – Release Note PDF 1.30 MB
[Flyer] E2Emulator[RTE0T00020KCE00000R] 日本語, 简体中文 Flyer PDF 381 KB
Renesas Software and Tools Flash Memory Programmer PG-FP6 日本語, 简体中文 Flyer PDF 417 KB
Renesas RA Family of 32-bit MCUs with Arm® Cortex®-M Core Flyer 日本語 Flyer PDF 391 KB
RA6M3 Group Flyer 日本語 Flyer PDF 332 KB
Building Automation Brochure 日本語 Brochure PDF 6.65 MB
e² studio V7.7.0 Release Note – Release Note PDF 1.22 MB
e² studio V7.6.0 Release Note – Release Note PDF 2.61 MB
Semiconductor Package Mount Manual 日本語, 简体中文 Other PDF 10.28 MB
Semiconductor Reliability Handbook 日本語 Other PDF 14.70 MB
QFN Mounting Manual 日本語, 简体中文 Other PDF 3.19 MB
info: For device-specific or order-specific documentation, submit a support request.

Software & Tool Pages

Title Type Description Company
Flexible Software Package (FSP) Software Package FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain and Segger J-Link drivers required to use this software. No additional installations are required. 		Renesas
E2 emulator [RTE0T00020KCE00000R] Emulator On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RH850, R-Car D1, RL78, RX] Renesas
E2 emulator Lite [RTE0T0002LKCE00000R] Emulator On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RL78, RX] Renesas
e² studio IDE and Coding Tool Eclipse-based Renesas integrated development environment (IDE).
[Support MCU/MPU: RA, RE, RX, RL78, RH850, Renesas Synergy, RZ]
(Note: You need to install compiler separately as an additional software)
(Note: No separate e² studio installation required for RA FSP, this will be installed as part of the FSP with e² studio installer (Platform Installer) on GitHub.)
 Renesas
PG-FP6 Programmer (Unit/SW) Flash memory programmer [Programming software: Dedicated GUI-based software, the "FP6 Terminal"] [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, SuperH RISC engine, V850, 78K, R8C] Renesas
Renesas Flash Programmer (Programming GUI) Programmer (Unit/SW) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78KR, 78K0] Renesas
RA Smart Configurator Solution Toolkit The Renesas RA Smart Configurator (RA SC) is a desktop application that helps you in configuring software systems (including a Board Support Package (BSP), drivers, RTOS, and middleware) for RA-Family MCUs when you are using a third-party IDE and toolchain. Renesas
QE for Capacitive Touch: Development Assistance Tool for Capacitive Touch Sensors Solution Toolkit In developing embedded system using the capacitive touch sensor of RA family and RX family MCUs, you can easily setup initial configurations of the touch interface as well as process the tuning of sensors, and reduce development time. [Plugin for Renesas IDE "e2 studio"]
 Renesas

Boards & Kits

Part Number Title Type Company
EK-RA6M3 RA6M3 MCU Group Evaluation Board Evaluation Renesas
EK-RA6M3G RA6M3 MCU Group Evaluation Board with Graphics Expansion Boards Evaluation Renesas

News & Additional Resources

Type Date
Renesas RA Partner Ecosystem Overview Page Mar 22, 2020
Renesas Electronics Unveils RA Family of 32-Bit Arm Cortex-M Microcontrollers with Superior Performance and Advanced Security for Intelligent IoT Applications News Oct 8, 2019

Pin Count / Memory Size

Flash: 2MB
RAM: 640kB		 ● ● ● ● ●
Flash: 1MB
RAM: 640kB		 ● ● ● ● ●
Pin Count
Package
Size
Pitch		 100-pin
LQFP
14x14mm
0.5mm		 144-pin
LQFP
20x20mm
0.5mm		 145-pin
LGA
7x7mm
0.5mm		 176-pin
LQFP
24x24mm
0.5mm		 176-pin
BGA
13x13mm
0.8mm