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特長

  • Complies to the Bluetooth 5 core specification
  • Integrated One-Time-Programmable (OTP) memory
  • 2Mb Flash
  • Extended user RAM (96kB)
  • Low operating voltage (1.8V to 3.6V)
  • I2C and pulse density modulation (PDM) audio interfaces

説明

Connected devices are constantly evolving. New generations appear that are smarter, more full featured and have longer battery lifetimes. To enable this, SmartBond has evolved too. The DA14586 offers designers all the benefits of the industry-leading DA1458x but with even greater flexibility to create more advanced applications from the smallest footprints and power budgets.

As part of the SmartBond family, the DA14586 is one of the smallest, lowest power and most integrated Bluetooth® solutions available. This versatile system-on-chip (SoC) is ideal for adding Bluetooth Low Energy (LE) to products like remote controls, proximity tags, beacons, connected medical devices, and smart home nodes. It supports all Bluetooth developments up to Bluetooth 5. Plus, with 96kB of RAM, the DA14586 has double the memory for user applications of its predecessor to take full advantage of the standard's features. It also includes an integrated microphone interface for voice support at low additional cost. The wide supply voltage range (0.9V – 3.6V) covers a larger choice of energy sources and gives full design flexibility.

SmartBond™ DA14586 combines the benefits of the lowest power, smallest size and lowest system cost Bluetooth Low Energy SoC with an integrated Flash. Furthermore, the DA14586 is pin-to-pin compatible with the DA14585 thereby offering a unique cost down path from Flash to One-Time-Programmable (OTP) memory.

Like all SmartBond solutions, the DA14586 is easy to design-in and supports standalone as well as hosted applications. It is supported by a complete development environment and the SmartSnippets™ software that helps you optimize your software for power consumption.

Benefits

  • Large memory to build complex applications
  • Longest battery life
  • Low system Bill of Materials (BOM)

Packages

  • QFN-40 (5.0mm x 5.0mm x 0.9mm)
  • WLCSP-34 (2.4mm x 2.66mm x 0.39mm)

パラメータ

属性
Wireless StandardBLE 5.0 Core specification
Proprietary 2G4 protocolNo
CPUM0
Flash Memory (KB)256
ROM (KB)128
Memory Size (OTP) (KB)64
RAM (KB)96
GPIOs (#)24
Supply Voltage Vcc Range0.9-3.3
Integrated DCDCIntegrated Buck DC-DC converter
Integrated Battery ChargerNo
External Rails and Load Capacitynone
Tx Current (mA)3.4
Rx current (mA)3.7
Output Power Range (dBm)-20
Sensitivity (dBm) (dBm)-93
Clock Rate (MHz)16
Flexible System ClockNo
Execute from FLASHNo
Hardware Crypto EngineYes
QSPI Interface (#)0
SPI (#)1
I2C (#)1
UART (#)2
ADC10-bit x 4-ch
USB Ports (#)0
LE Data Length ExtensionsSupported
2MbpsNot Supported
LE Coded PHY (Long Range)Not Supported
Extended AdvertisingNot Supported
Periodic AdvertisingNot Supported
AoANot Supported
AoDNot Supported
GATT CachingNot Supported
Bluetooth® MeshNot Supported
Temp. Range (°C)-40 to +85°C

パッケージオプション

Pkg. TypePkg. Dimensions (mm)Lead Count (#)Pitch (mm)
QFN5 x 5 x 0.9400.45

アプリケーション

  • Remote controls
  • Proximity tags and trackers
  • Beacons
  • Connected medical devices
  • Smart home
  • Human interface devices
  • VR controllers
  • Connected sensors
  • Wireless charging

適用されたフィルター