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Package Information

CAD Model:View CAD Model
Pkg. Type:QFN
Pkg. Code:
Lead Count (#):40
Pkg. Dimensions (mm):5 x 5 x 0.9
Pitch (mm):0.45

Environmental & Export Classifications

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ECCN (US)3A991.a.2
HTS (US)8542.31.0070
RoHS (DA14586-00F02AT2)Download

Product Attributes

Lead Count (#)40
Carrier TypeTape & Reel
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
Temp. Range (°C)-40 to +85°C
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
2MbpsNot Supported
ADC10-bit x 4-ch
AoANot Supported
AoDNot Supported
ApplicationBeacons, Proximity tags & trackers, HID, RCU
Bluetooth® MeshNot Supported
CPUM0
Clock Rate (MHz)16
Execute from FLASHNo
Extended AdvertisingNot Supported
External Rails and Load Capacitynone
Flash Memory (KB)256
Flexible System ClockNo
GATT CachingNot Supported
GPIOs (#)24
Hardware Crypto EngineYes
I2C (#)1
Integrated Battery ChargerNo
Integrated DCDCIntegrated Buck DC-DC converter
LE Coded PHY (Long Range)Not Supported
LE Data Length ExtensionsSupported
MCU/MPUM0
MOQ5000
Memory Size (OTP) (KB)64
Operating Freq (Max) (MHz)16
Output Power Range (dBm)-20
Periodic AdvertisingNot Supported
Pitch (mm)0.45
Pkg. Dimensions (mm)5 x 5 x 0.9
Pkg. TypeQFN
Price (USD)$4.30006
Proprietary 2G4 protocolNo
PublishedYes
QSPI Interface (#)0
Qty. per Reel (#)5000
RAM (KB)96
ROM (KB)128
Recommended for new DesignsYes
Rx current (mA)3.7
SPI (#)1
Sensitivity (dBm) (dBm)-93
Supply Voltage Vcc Range0.9-3.3
Tx Current (mA)3.4
UART (#)2
USB Ports (#)0
Wireless StandardBLE 5.0 Core specification

Description

Connected devices are constantly evolving. New generations appear that are smarter, more full featured and have longer battery lifetimes. To enable this, SmartBond has evolved too. The DA14586 offers designers all the benefits of the industry-leading DA1458x but with even greater flexibility to create more advanced applications from the smallest footprints and power budgets.

As part of the SmartBond family, the DA14586 is one of the smallest, lowest power and most integrated Bluetooth® solutions available. This versatile system-on-chip (SoC) is ideal for adding Bluetooth Low Energy (LE) to products like remote controls, proximity tags, beacons, connected medical devices, and smart home nodes. It supports all Bluetooth developments up to Bluetooth 5. Plus, with 96kB of RAM, the DA14586 has double the memory for user applications of its predecessor to take full advantage of the standard's features. It also includes an integrated microphone interface for voice support at low additional cost. The wide supply voltage range (0.9V – 3.6V) covers a larger choice of energy sources and gives full design flexibility.

SmartBond™ DA14586 combines the benefits of the lowest power, smallest size and lowest system cost Bluetooth Low Energy SoC with an integrated Flash. Furthermore, the DA14586 is pin-to-pin compatible with the DA14585 thereby offering a unique cost down path from Flash to One-Time-Programmable (OTP) memory.

Like all SmartBond solutions, the DA14586 is easy to design-in and supports standalone as well as hosted applications. It is supported by a complete development environment and the SmartSnippets™ software that helps you optimize your software for power consumption.

Benefits

  • Large memory to build complex applications
  • Longest battery life
  • Low system Bill of Materials (BOM)

Packages

  • QFN-40 (5.0mm x 5.0mm x 0.9mm)
  • WLCSP-34 (2.4mm x 2.66mm x 0.39mm)