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Renesas Electronics Corporation

Features

  • Ultra-fast switching e-mode GaN HEMT
  • JEDEC-qualified GaN technology
  • Silicon-compatible package footprint for easy design migration
  • Low 1.8mΩ typical on-resistance
  • Dual-side-cooled package for simplified thermal design
  • Zero reverse recovery charge (Qrr)
  • Low gate charge and output charge for improved efficiency

Description

The RTP100E1P8G1FL-DSC is a 100V, 1.8mΩ enhancement-mode (e-mode) gallium nitride (GaN) FET built on Renesas' Gen 1 REXGaN® platform and housed in a compact 3.3mm × 3.3mm dual-side-cooled (DSC) FCLGA package. Utilizing advanced packaging technology, it combines ultra-fast switching performance with enhanced thermal characteristics to enable high-efficiency, high-power-density designs. Its dual-side-cooled package and silicon-compatible footprint simplify migration from traditional silicon MOSFETs to GaN technology, helping reduce development time, improve thermal management, and lower overall power losses.

Parameters

AttributesValue
Blocking CapabilityUni-Directional Switch
Qualification LevelStandard
Vds min (V)100
V(TR)DSS max (V)120
RDSON (Typ) (mΩ)1.8
RDSON (max) (mΩ)2.4
Vth typ (V)1.1
Id max @ 25°C (A)38.7
Qg typ (nC)16.3
Qoss (nC)50
Ron * Qoss (FOM)99
Ciss (Typical) (pF)2147
Coss (Typical) (pF)606
Mounting TypeSurface Mount
Temp. Range (°C)-40 to +150°C

Package Options

Pkg. TypePkg. Dimensions (mm)Lead Count (#)Pitch (mm)
FCLGA3.3 x 3.3 x 0.79690.65

Product Comparison

3D illustration featuring top and bottom views of FCLGA IC chip package with 9 lead count.
3D illustration featuring top and bottom views of FCLGA IC chip package with 9 lead count.
3D illustration featuring top and bottom views of FCLGA IC chip package with 8 lead count.
3D illustration featuring top and bottom views of FCLGA chip package with 8 lead count.
RTP100E1P8G1FL-DSCRTP100E005G1FLRTP100E2P6G1FLRTP100E1P2G1FL-DSC
RDSON (Typ) (mΩ)1.852.61.2
Theta-JA (°C/W)474529.418.4
IDS (A) @ Ta = 25°C29173057
IDS (A) @ Tc = 25°C28259109545
Qoss (nC)5024.24686
Qg typ (nC)16.35.29.427
Pkg. TypeFCLGAFCLGAFCLGAFCLGA
Pkg. Dimensions (mm)3.3 x 3.3 x 0.7963.3 x 3.3 x 0.9025.0 x 6.0 x 0.9025 x 6 x 0.702

Application Block Diagrams

800V to 48V DCX system block diagram showing an isolated LLC-resonant DC transformer that converts 800V DC to 48V DC using GaN FETs and gate drivers for high-efficiency power delivery.
800V to 48V DCX System
Efficiently converts an 800V DC bus to 48V DC with galvanic isolation for high-density, high-efficiency power delivery.

Additional Applications

  • 48V Intermediate Bus Converters for Telecom and AI Data Centers
  • Synchronous Rectification and DC/DC Converters
  • Battery-Powered Tools
  • Class-D Audio Amplifiers
  • Energy Storage Systems
  • 48V Servo Drive
  • Robotics Systems

Complete Your Design

Explore complementary products to elevate your design

Part NumberStatusSamplesStockRoHSPackageBudgetary Price (USD)Carrier TypeMoisture Sensitivity Level (MSL)Mounting TypeTemp. Range (°C)Assembly LocationWafer Fab Location
RTP100E1P8G1FL-DSC-TRActiveAvailableOut of StockRoHS:EN
RoHS:JA
FCLGA1ku | $1.63Tape & Reel3Surface Mount-40 to +150°CCHINATaiwan

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