Features
- Standard level gate drive voltage: VGS(th) = 2.0V to 4.0V
- Super low on-state resistance: RDS(on) = 0.65mΩ max
- Low input capacitance
- Designed for automotive application and AEC-Q101 (HTRB, HTGB) qualified
RBA500N10EHWT-2UA01 Chip Dimensions & Circuit
Description
The REXFET-1 100V technology, featuring a split gate structure, offers low on-state resistance. It reduces capacitance and gate charge for more efficient switching. This technology enables the device to offer high switching speed and low power loss, thereby improving energy efficiency. Furthermore, it enhances durability and reliability, making it suitable for Automotive applications such as power management systems, motor control, and DC-DC converters.
Parameters
| Attributes | Value |
|---|---|
| Qualification Level | Automotive |
| Nch/Pch | Nch |
| Channels (#) | 1 |
| Standard Pkg. Type | Bare die |
| Gate Level | Standard |
| VDSS (Max) (V) | 100 |
| ID (A) | 500 |
| Ciss (Typical) (pF) | 34000 |
| Qg typ (nC) | 450 |
| Series Name | REXFET-1 |
Package Options
| Pkg. Type |
|---|
| Bare |
Application Block Diagrams
 | 3-Phase RISC-V Motor Controller 3-phase motor controller with pre-programmed 32-bit RISC-V ASSP. |
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| Part Number | Status | Samples | Stock | RoHS | Package | Standard Pkg. Type | Carrier Type |
|---|---|---|---|---|---|---|---|
| RBA500N10EHWT-2UA01#GFH | Active | Available | Out of Stock | RoHS:EN RoHS:JA | Bare | Bare die | Embossed Tape |
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- Application NotePDF 599 KB R07AN0052EJ0100 Rev.1.00 May 27, 2026REXFET PLECS models enable accurate simulation of power MOSFET behavior, including electrical and thermal characteristics. The model integrates channel and body diode behavior, supports configurable simulation parameters, and provides probe functions for switching, conduction, and temperature analysis. This application note outlines installation, library integration, model configuration, and usage considerations to optimize simulation results.Related Files:
- Application NotePDF 596 KB R07AN0051EJ0100 Rev.1.00 Apr 27, 2026Compares the thermal performance of automotive power MOSFETs in the TOLL (TO-Leadless) package and its derivatives, including the TOLT (TO-Leaded Top-side Cooling) package. The information presented in this document is intended to serve as a comprehensive guideline for designing high-power automotive systems.
- Application NotePDF 936 KB R07AN0050EJ0100 Rev.1.00 Dec 03, 2025Measurement frequency and the influence of parasitic inductance are crucial in capacitance measurements for Power MOSFETs. Split-gate structures, with their low Crss and higher Ciss, face challenges from parasitic inductance, making high-frequency measurements difficult. In contrast, standard-gate trench structures allow relatively accurate results. The influence of parasitic inductance in actual measurements is examined from various perspectives.
- GuidePDF 988 KB R07ZZ0016EJ0100 Rev.1.00 Dec 03, 2025The diagrams in this document show the recommended mounting pad layout dimensions for Renesas Power MOSFETs. In actual PCB design, optimization should consider mounting density, mountability, dimensional tolerances, and other relevant factors.
- White PaperPDF 4.45 MB R16WP0011EU0100 Rev.1.00 Nov 04, 2025High-power, high-efficiency systems such as electric motor drives and battery management systems continue to see rapid adoption and increasing power demands. To address these requirements, lower on-resistance and improved switching performance are needed. This paper presents an advanced split-gate trench process and next-generation MOSFETs with a 30% reduction in specific on-resistance to meet these needs.
- Application NoteRenesas presents a reliability framework for power discrete bare die products, detailing quality assurance levels—KGD, KTD, and PD—along with their respective testing protocols. The framework highlights how external factors such as assembly, storage, and handling affect reliability. Customers are advised to validate performance under actual use conditions.
- Product Reliability ReportPDF 432 KB APR-25-H0111 Jun 20, 2025
- Application NotePDF 722 KB R07AN0040EJ0100 Rev.1.00 Nov 13, 2024AI-generated Summary: 48V automotive electrical systems enhance power capacity and efficiency by reducing current and cable size, enabling lighter and more compact vehicle designs. Renesas develops the REXFET-1 series MOSFETs with advanced wafer and package technologies, achieving ultra-low ON-resistance and high reliability for middle-voltage applications. The TOLL and TOLG packages optimize thermal performance, EMI behavior, and space, supporting up to 300A current. These MOSFETs meet automotive standards, improve switching efficiency, and reduce heat dissipation, facilitating the demands of electric and hybrid vehicles' powertrains and auxiliary systems.
- Application NoteAI-generated Summary: Absolute maximum ratings define safe operational limits for MOSFETs, including voltage, current, and temperature thresholds to prevent device damage. Electrical characteristics specify parameters like breakdown voltage, threshold voltage, on-resistance, capacitances, and switching times. Allowable channel dissipation decreases as case temperature rises, calculated by a specific formula. The safe operating area (SOA) outlines five limiting conditions: current rating, on-resistance, channel dissipation, secondary breakdown, and voltage rating, ensuring reliable MOSFET operation under various conditions.
- Application NoteAI-generated Summary: The document outlines derating standards for Power MOSFETs and IGBTs, emphasizing temperature, humidity, voltage, current, and power limits to ensure device reliability. It discusses package type selection between hermetic sealed and plastic molded types, highlighting the advantages of surface-mount packages for miniaturization. It also details precautions for physical handling, including proper lead forming, cutting, and mounting techniques to prevent stress and damage during installation.
Recommended Documents (1)
Datasheets (1)
- GuidePDF 988 KB R07ZZ0016EJ0100 Rev.1.00 Dec 03, 2025The diagrams in this document show the recommended mounting pad layout dimensions for Renesas Power MOSFETs. In actual PCB design, optimization should consider mounting density, mountability, dimensional tolerances, and other relevant factors.
Manuals & Guides (1)
- Application NotePDF 599 KB R07AN0052EJ0100 Rev.1.00 May 27, 2026REXFET PLECS models enable accurate simulation of power MOSFET behavior, including electrical and thermal characteristics. The model integrates channel and body diode behavior, supports configurable simulation parameters, and provides probe functions for switching, conduction, and temperature analysis. This application note outlines installation, library integration, model configuration, and usage considerations to optimize simulation results.Related Files:
- Application NotePDF 596 KB R07AN0051EJ0100 Rev.1.00 Apr 27, 2026Compares the thermal performance of automotive power MOSFETs in the TOLL (TO-Leadless) package and its derivatives, including the TOLT (TO-Leaded Top-side Cooling) package. The information presented in this document is intended to serve as a comprehensive guideline for designing high-power automotive systems.
- Application NotePDF 936 KB R07AN0050EJ0100 Rev.1.00 Dec 03, 2025Measurement frequency and the influence of parasitic inductance are crucial in capacitance measurements for Power MOSFETs. Split-gate structures, with their low Crss and higher Ciss, face challenges from parasitic inductance, making high-frequency measurements difficult. In contrast, standard-gate trench structures allow relatively accurate results. The influence of parasitic inductance in actual measurements is examined from various perspectives.
- White PaperPDF 4.45 MB R16WP0011EU0100 Rev.1.00 Nov 04, 2025High-power, high-efficiency systems such as electric motor drives and battery management systems continue to see rapid adoption and increasing power demands. To address these requirements, lower on-resistance and improved switching performance are needed. This paper presents an advanced split-gate trench process and next-generation MOSFETs with a 30% reduction in specific on-resistance to meet these needs.
- Application NoteRenesas presents a reliability framework for power discrete bare die products, detailing quality assurance levels—KGD, KTD, and PD—along with their respective testing protocols. The framework highlights how external factors such as assembly, storage, and handling affect reliability. Customers are advised to validate performance under actual use conditions.View More (8)
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Jeff demonstrates how Renesas' REXFET MOSFETs, with low on-resistance and fast switching performance, enable more efficient BLDC motor operation in industrial and automotive applications.
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