Renesas Boards & Kits
RZ/V2N-EVK アクティブ
RZ/V2NクアッドコアVision AI MPU評価キット
RZ/V2N AI MPU評価キットV2.0（RTK0EF0186C03001BJ）は、RZ/V2NクアッドコアVision AI MPUの評価に最適な評価ボードキットです。本キットは、CPUボードと拡張ボード(EXPボード)で構成されています。V2.0では、DDRのSuspend to RAM機能に対応し、それに伴って電源回路構成の変更を行っています。また本評価キットはソフトウェア開発環境であるAIソフトウェア開発キット（AI SDK）に対応しています。低消費電力のAI推論、ビデオストリーミング、その他の内蔵機能を評価することが可能です。旧バージョンのEVKを御使用のお客様は... 続きを読む
RZ/V2H-EVK アクティブ
RZ/V2H Quad-core Vision AI MPU Evaluation Kit
RZ/V2H AI MPU評価キット（RTK0EF0168C04000BJ）は、RZ/V2HクアッドコアVision AI MPUの評価に最適な評価ボードキットです。CPUボードとEXPボードで構成されています。本評価キットはRZ/V2Hの標準ソフトウェアパッケージに対応しており、低消費電力AI推論，Video Streaming等の機能を評価することが可能です。搭載デバイスはオプション機能Image signal processor (ISP)、3D graphics engine (GE3D)、Trusted Secure IPに対応しています。
このボードをリモートでテストする
クラウド上のラボで利用でき、PCベースのGUIを使用して、物理ボードを必要とせずに、仮想ラボで設計の構成とテストをすぐに開始できます。
ISL80015ADEMO1Z アクティブ
Compact Synchronous Buck Converter Demonstration Board with 2.7V to 5.5V Vin Range and 1.8V 1.5A Output
Demonstrates compact point-of-load power conversion using ISL80015 and ISL80015A devices. Supports efficiency and size evaluation for low-voltage applications.
推奨ドキュメント:
Partner Boards & Kits
SoM/SBC
Banana Pi BPI-AI2H System on Module (SoM)
Open-source system on module (SoM) based on the Renesas RZ/V2H Vision AI MPU, designed for high-performance edge AI and computer vision applications. Featuring multi-core Arm® Cortex®-A55 processing, DRP-AI acceleration, rich multimedia capabilities, and high-speed connectivity options, the module provides a flexible platform for developing intelligent imaging, industrial automation, robotics, and edge computing solutions.
Provided By:
Banana Pi
SoM/SBC
RZ/G3S Smallest System-on-Module (SoM) Gateway Solution
Based on the Renesas RZ/G3S MPU family architecture, the MSRZG3S system-in-package offers high-performance Arm® Cortex®-A55/dual Cortex-M33 cores. Combining compact design with extensive functionality, it delivers low-power consumption, thermal efficiency, and low cost for embedded systems. Designed to meet OSM-standard specifications, the RZ/G3S general-purpose MPUs are built around Cortex-A55/dual Cortex-M33 CPU cores.
Provided By:
ARIES Embedded GmbH
SoM/SBC
SOMDEVICES uSMARC RZ/V2N
SMARC v2.1 system on module (SoM) based on the Renesas RZ/V2N processor, enables high-performance image processing and dynamic control using advanced artificial intelligence with excellent power efficiency. It supports high-speed interfaces such as PCIe, USB3.2, and Gigabit Ethernet. The module is part of µSMARC®, a smaller form factor that reduces size while remaining fully electrically and functionally compatible with the SMARC standard.
Provided By:
SomDevices
SoM/SBC
V2H 4X SBC
A compact single‑board computer (SBC) featuring high‑bandwidth 4‑lane PCIe Gen3 for real‑time edge AI and vision applications. It supports seamless connectivity to FPGAs, NPUs, and storage devices to offload compute‑intensive workloads and reduce latency. With four independent MIPI CSI interfaces, rich I/O, efficient power design, and a developer‑friendly layout, the V2H 4X SBC supports robotics, industrial automation, and autonomous systems, accelerating prototyping and deployment of advanced embedded solutions.
Provided By:
IMDT
SoM/SBC
V2H Single Board Computer (SBC)
Provides a carrier board that converts the system on module (SoM) into a compact, high‑performance single board computer (SBC). The cost‑effective small form factor design supports diverse applications including robotics, drones, and smart city systems. It supports flexible assembly options tailored to specific requirements, along with comprehensive onboard connectivity. The platform delivers an energy‑efficient solution with a minimal footprint, enabling powerful computing in space‑constrained environments.
Provided By:
IMDT
SoM/SBC
V2H System on Module (SoM)
Provides a cost‑effective embedded module powered by the Renesas RZ/V2H processor for AI‑driven vision applications. It supports four four‑lane MIPI CSI‑2 connections, enabling parallel attachment of up to four cameras. Customization options include onboard Wi‑Fi® and Bluetooth®, selectable memory and storage capacities, and flexible physical layer configurations. The module delivers a compact form factor and a complete hardware and software solution, supporting scalable and modular system design.
Provided By:
IMDT