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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation) - 6月はプライド月間として、LGBTQ+の権利や文化、コミュニティについて啓発する世界的な活動月間です

特長

  • Bluetooth 4.2
  • Cortex-M0 application processor
  • Power supply 0.9V – 3.6V
  • Single-pin RF I/O
  • Rich set of analog and digital peripherals
  • 8 connections
  • Optimized boot time
  • Supporting software upgrades Over-the-Air (OTA)

説明

The DA14581 integrated circuit is an optimized version of the DA14580, offering a reduced boot time and supporting up to 8 connections. It has a fully integrated radio transceiver and baseband processor for Bluetooth® Low Energy. It can be used as a standalone application processor or as a data pump in hosted systems.

The DA14581 supports a flexible memory architecture for storing Bluetooth profiles and custom application code, which can be updated Over-the-Air (OTA). The qualified Bluetooth Low Energy protocol stack and the HCI-ready software are stored in a dedicated Read-Only Memory (ROM). All software runs on the Arm® Cortex®-M0 processor via a simple scheduler.

The Bluetooth Low Energy firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG as well as custom profiles are supported. The transceiver interfaces directly to the antenna and is fully compliant with the Bluetooth 4.2 standard.

The DA14581 has dedicated hardware for the Link Layer implementation of Bluetooth Low Energy and interface controllers for enhanced connectivity capabilities.

Benefits

  • Based on the same outstanding DA14580 SoC
  • Uses a dedicated ROM which offers optimizations targeting A4WP and HCI
  • Alliance for Wireless Power (A4WP)
    • Fast boot time for Power Receiving Unit (PRU)
    • 8 connections for Power Transmitting Unit (PTU)
  • Human-Computer Interaction (HCI)
    • Optimized code for HCI which fits into the OTP
    • This enables customers/modules to provide a pre-programmed HCI device/module

Packages

  • WLCSP-34 (2.5mm x 2.5mm x 0.5mm)
  • QFN-40 (5.0mm x 5.0mm x 0.9mm)
  • Ultra-thin WLCSP-34 (2.436mm x 2.436mm x 0.334mm)

アプリケーション

  • Wireless charging (A4WP)
  • HCI
Part NumberStatusSamplesStockRoHSPackageBudgetary Price (USD)Carrier TypeMoisture Sensitivity Level (MSL)Pkg. Dimensions (mm)GPIOs (#)Pb (Lead) FreeCountry of AssemblyCountry of Wafer Fabrication
DA14581-00000VRANRNDN/AOut of StockRoHS:EN
WLCSP341ku | $1.797Tape & Reel12.5 x 2.5 x 0.324#YesTAIWANTAIWAN
DA14581-00AT2NRNDN/AOut of StockContactQFN401ku | $2.169Tape & Reel35 x 5 x 0.914#YesTAIWANTAIWAN
DA14581-00UNANRNDN/AIn StockRoHS:EN
WLCSP341ku | $1.797Tape & Reel12.5 x 2.5 x 0.514#YesTAIWANTAIWAN
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