Overview
Description
This evaluation board kit is ideal for evaluating RZ/A3UL. The RZ/A3UL Evaluation Board Kit consists of a module board (SOM) and a carrier board. The module board complies with the SMARC v2.1 standard.
Two types of evaluation boards are available: QSPI version and Octal-SPI version. For each version, there are two types: J link lite included type and J link lite not included type. Please select according to your needs.
- QSPI version: Memory configuration/ QSPI Serial Flash(Boot) + DDR4
- On-chip debugging emulator (J link lite) included
Type name / RTK9763U02S01002BE - On-chip debugging emulator (J link lite) not included
Type name / RTK9763U02S01000BE
- On-chip debugging emulator (J link lite) included
- Octal-SPI version: Memory configuration/ Octa Flash(Boot) + OctaRAM + DDR4
- On-chip debugging emulator (J link lite) included
Type name / RTK9763U02S01003BE - On-chip debugging emulator (J link lite) not included
Type name / RTK9763U02S01001BE
- On-chip debugging emulator (J link lite) included
RZ/A3UL Evaluation Board Kit supports real-time OSs (FreeRTOS, Azure RTOS) and various libraries (SSL/TLS, OTA, MQTT, TCP/IP, etc.) for IoT devices provided by major cloud vendors such as Amazon Web Services (AWS) and Microsoft.
In addition, it is equipped with input/output interfaces such as HDMI, audio, Ethernet, USB, and CAN, and can realize high-level IoT systems.
Features
- Device: RZ/A3UL
- Cortex-A55 Single
- BGA361pin, 13mmSq body, 0.5mm pitch
- Certified device in Azure Certified Device Catalog
- Module Board Function
- Two types of evaluation boards are available:
- QSPI version: QSPI Serial Flash (Boot) + DDR4
- Octal-SPI version: Octa Flash (Boot) + OctaRAM + DDR4
- DDR4 SDRAM: 1GB × 1pc
- QSPI flash memory: 128Mb × 1pc "AT25QL128A" (QSPI version)
- Octa RAM memory: 512Mb × 1pc / Octa flash memory: 1Gb × 1pc (Octal-SPI version)
- eMMC memory: 64GB × 1pc
- The microSD card slot is implemented and used as an eSD for boot.
- 5-output clock oscillator “5P35023” implemented
- PMIC power supply “DA9062” implemented
- Two types of evaluation boards are available:
- Carrier Board Function
- The FFC/FPC connector is mounted as standard for connection to high-speed serial interface for camera module.
- The Micro-HDMI connector via DSI/HDMI conversion module is mounted as standard for connection to high-speed serial interface for digital video module.
- The Micro-AB receptacle (ch0: USB2.0 OTG) and A receptacle (ch1: USB2.0 Host) are respectively mounted as standard for connection to USB interface.
- The RJ45 connector is mounted as standard for software development and evaluation using Ethernet.
- The audio codec is mounted as standard for advance development of audio system. The audio jack is implemented for connection to audio interface.
- The Micro-AB receptacles are implemented for connection to asynchronous serial port interface.
- The microSD card slot and two sockets for PMOD are implemented as an interface for RZ/A3UL peripheral functions.
- For power supply, a mounted USB Type-C receptacle supports the USB PD standard.
Applications
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Entry-Class HMI Platform
Entry‑class platform delivering reliable 64‑bit performance for modern HMI displays.
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Documentation
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| Type | Title | Date |
| Manual - Development Tools |
PDF
2.94 MB
The RZ/G2UL Evaluation Board Kit is a reference platform designed for evaluating the RZ/A3UL MPU. It consists of a module board and a carrier board, with the module board compliant with the SMARC v2.1 standard. This manual provides a comprehensive functional description of the RZ/G2UL SMARC module board.
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| Application Note |
PDF
10.34 MB
Learn how to use the Renesas RZ Flexible Software Package (FSP) for developing applications for the RZ microprocessor series. This document explains the usage of the RZ FSP running on the Cortex-A55 (CA55) core incorporated in the RZ/A3UL and RZ/A3M devices, including the development environment, software configuration, and application development workflow.
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| Manual - Development Tools | PDF 3.51 MB | |
| Application Note |
PDF
164 KB
Introduces practical example projects for the RZA3UL-EVK kit. The example projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the RZA3UL-EVK kit.
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| PCB Design Files | RZ/A3UL SMARC Module Board OCTAL Version Design Data V1.00
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| PCB Design Files | RZ/A3UL SMARC Module Board QSPI Version Design Data V1.00
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| Application Note |
PDF
254 KB
AI-generated Summary:
The RZ/A FSP Example Project Bundle provides sample projects demonstrating how to develop software using Renesas' Flexible Software Package (FSP) for embedded systems. It includes lightweight, efficient drivers with uniform APIs, detailed documentation, and build-time configuration for optimized module size. Supported kits include RZ/A3UL Evaluation Boards (QSPI and OCTAL-SPI editions) and EK-RZ/A3M. The bundle supports FSP version 3.5.0 and is compatible with e2 studio 2025-01. Example projects cover various peripherals such as ADC, CANFD, USB, LCDC, and FreeRTOS. The package includes new additions like RZ/A3M and SPIBSC examples, with no current bug fixes or restrictions. General precautions for handling microcontrollers are also outlined.
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| Application Note |
PDF
11.44 MB
AI-generated Summary:
The guide explains how to operate example projects using the RZ/A Flexible Software Package (FSP) for RZ/A3UL and RZ/A3M devices. It covers hardware and software requirements, tool installation, project downloading, and running procedures. The document details changing board edition settings and provides extensive examples for various peripherals such as ADC, CANFD, RIIC, SSI, USB, LCDC, INTC, WDT, Ether, FreeRTOS, SDHI, GTM, DMAC, MIPI, and SPIBSC. Each example includes project overview, hardware requirements, settings, and operation instructions.
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| Application Note |
PDF
8.76 MB
The RZ/A Flexible Software Package (FSP) enables rapid development of applications for RZ/A3UL and RZ/A3M microprocessors. It integrates seamlessly with the e2 studio IDE, providing a complete environment for project creation, configuration, and debugging. FSP includes ready-to-use components, drivers, and middleware, simplifying setup for applications.
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| PCB Design Files | RZ SMARC Series Carrier Board Design Data V5.00
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| Flyer | PDF 411 KB 日本語 | |
| Release Note | PDF 205 KB | |
| Manual - Software | ZIP 1.63 MB | |
13 items
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Design & Development
Software & Tools
Software & Tools
| Software title
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Software type
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Company
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| RZ Flexible Software Package (FSP) The RZ FSP is an enhanced software package designed to deliver user-friendly, scalable, high-quality software for embedded system designs using the Renesas RZ family of Arm microprocessors.
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Software Package | Renesas |
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1 item
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Sample Code
Sample Code
Filters
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| Type | Title | Date Date |
| Sample Code | RZA3UL-EVK Example Project Bundle
Demonstrates how to write code using various unified Renesas RZ Flexible Software Package (FSP) v4.x.x modules supported by the RZA3UL-EVK. The unified RZ FSP consolidates all previous family‑specific FSPs into a single package and provides an optimized, easy‑to‑use, scalable, high‑quality software solution for embedded system design.
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| Sample Code | RZ/A FSP Example Project Bundle V3.60 (Sample Code) (Deprecated)
[Software=RZA Flexible Software Package|v3.5.0],[Toolchains=GCC ARM A-Profile (AArch64 bare-metal)|13.2 rel1]
ZIP
2.08 MB
Application:
Consumer Electronics
Compiler:
GNU ARM Embedded
Function:
Application Example, BSP, Clock, Communication Interface, HMI, I/O or Pin, OS, Other peripherals, Software Package, Timer
IDE:
e2 studio
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| Sample Code |
[Software=RZ Software Development Kit],[Toolchains=GNU Arm Embedded]
日本語
Application:
Consumer Electronics
Compiler:
GNU ARM Embedded
Function:
Application Example, BSP, HMI, I/O or Pin, Memory, OS, Other peripherals, Software Package, Timer
IDE:
e2 studio
This is the RZ/A3 Software Development Kit (SDK) with Microsoft Azure support. The SDK contains sample projects for Azure RTOS (ThreadX) and Azure middleware (USB, file system, and GUI development, etc.).
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3 items
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Related Boards & Kits
Boards & Kits
Evaluation Board Kit for RZ/G2UL MPU
This evaluation board kit is ideal for evaluating RZ/G2UL. The RZ/G2UL Evaluation Board Kit consists of a module board (SOM) and a carrier board. The module board complies with the SMARC v2.1 standard.
Contents:
- RZ/G2UL Module Board (SMARC2.1)
- Common Carrier Board (For RZ/G2L, RZ/G2LC, RZ/G2UL and... Read More
Product Options
| Part Number | Status | Stock | Budgetary Price (USD) | Description | Security |
|---|---|---|---|---|---|
| RTK9763U02S01002BE | Active | In Stock | 1u | $294 | RZ/A3UL QSPI SMARC EVK (J link lite included) | None |
| RTK9763U02S01003BE | Active | In Stock | 1u | $294 | RZ/A3UL Octal-SPI SMARC EVK (J link lite included) | None |
| RTK9763U02S01000BE | NRND | In Stock | RZ/A3UL QSPI SMARC EVK (J link lite not included) | None | |
| RTK9763U02S01001BE | NRND | In Stock | RZ/A3UL Octal-SPI SMARC EVK (J link lite not included) | None |
Videos & Training
Learn how to import and run Flexible Software Package (FSP) example projects in e² studio using the RZ/A3UL Evaluation Board Kit. The same workflow applies to both RZ and RA device families. This video walks through three demos covering ADC configuration, USB PCDC communication, and LCDC display control.
Additional Videos
Partners
Zephyr Project
The Zephyr Project is an open-source, scalable real‑time operating system (RTOS) designed for resource-constrained embedded systems and supports a wide range of hardware architectures and development boards. For the Renesas RZ/A3UL SMARC Evaluation Kit, Zephyr provides focused documentation covering board features, supported peripherals, and basic build, flashing, and debugging workflows to help developers quickly get started.
See the Zephyr Project RZ/A3UL SMARC Evaluation Kit Documentation
Support
Support Communities
- "Jlink RTT is not supported for this setup" and "Jlink RTT Viewer cannot read the buffer" issue for rz/a3ul (CA55 Core) project.
Hello everyone!We are trying to print logs using the latest Segger RTT version. Our project uses the rz/a3ul (CA55 Core) which is supported as mentioned in the " wiki.segger.com/J-Link_ARMv8-AR " link. We attempted to use below solution: Using the J-link script ...
Mar 12, 2024
Support Communities
