Overview
The EVB-RTP100E1P2G1FL-DSC evaluation board demonstrates the performance advantages of our low-voltage GaN technology in a high-efficiency synchronous buck converter. Featuring two RTP100E1P2G1FL-DSC 100V enhancement-mode (E-mode) gallium nitride (GaN) FETs in a half-bridge configuration and driven by the RRP68150 GaN gate driver, the board provides a compact platform for evaluating high-frequency power conversion designs.
The board enables evaluation of switching performance, efficiency, thermal behavior, and power density across a wide range of operating conditions. Integrated test points simplify waveform measurements and power-loss analysis, helping optimize power-stage layouts and demonstrate how dual-side-cooled (DSC) GaN technology can improve next-generation power conversion systems.
Features
- Performance testing of low-voltage GaN over a wide range of operating conditions
- Flexible and user-friendly buck converter evaluation board
- Evaluate system performance using the RRP68150 gate driver
- High-frequency power conversion optimization
- Convenient test points for waveform measurement
- Supports high-efficiency, high-power-density designs
- Demonstrates DSC GaN thermal advantages
Products in the Design

| RRP68150 | 100V, 2A Source, 5.3A Sink, 5V-Powered High-Frequency GaN/MOSFET Half-Bridge Drivers with Anti-Shoot-Through Protection |
Design Files & Documentation
- White PaperLow-voltage GaN technology delivers significant gains in efficiency, power density, and switching performance over conventional silicon devices. This paper explores GaN fundamentals, key performance benefits, and applications in data center power conversion and motor drive systems, while providing guidance for evaluating low-voltage GaN adoption.
- PCB Design FilesThe design files for the EVB-RTP100E1P2G1FL-DSC evaluation board include the schematic and PCB layout files used in the board design. These resources provide insight into the board's implementation and can assist with design review, customization, and evaluation of the RTP100E1P2G1FL-DSC low-voltage GaN device.
- Manual - Hardware
- Application NoteRenesas low-voltage GaN devices enable high-efficiency, high-power-density power conversion through ultra-fast switching and low-loss operation. Achieving optimal performance requires careful PCB layout and gate drive design to minimize parasitics and switching noise. This application note provides practical design recommendations and implementation guidance for low-voltage GaN power systems.
- Manual - Hardware
Recommended Documents (1)
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- Manual - Hardware
Manuals & Guides (1)
- White PaperLow-voltage GaN technology delivers significant gains in efficiency, power density, and switching performance over conventional silicon devices. This paper explores GaN fundamentals, key performance benefits, and applications in data center power conversion and motor drive systems, while providing guidance for evaluating low-voltage GaN adoption.
- Application NoteRenesas low-voltage GaN devices enable high-efficiency, high-power-density power conversion through ultra-fast switching and low-loss operation. Achieving optimal performance requires careful PCB layout and gate drive design to minimize parasitics and switching noise. This application note provides practical design recommendations and implementation guidance for low-voltage GaN power systems.
Application Notes & White Papers (2)
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- PCB Design FilesThe design files for the EVB-RTP100E1P2G1FL-DSC evaluation board include the schematic and PCB layout files used in the board design. These resources provide insight into the board's implementation and can assist with design review, customization, and evaluation of the RTP100E1P2G1FL-DSC low-voltage GaN device.
Schematics & Design Files (1)
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Sample & Buy
Videos & Training
REXGaN 100V GaN FETs deliver ultra-fast switching, low power loss, and high-power density for next-generation power conversion applications. Built on the Renesas REXGaN platform, these e-mode GaN power transistors combine low RDS(on), advanced packaging, and enhanced thermal performance to improve system efficiency. Silicon footprint compatibility enables low-friction migration from traditional silicon-based solutions while supporting higher performance and power density.
News & Blog Posts
Blog Post Oct 1, 2026 |