Overview
The DA14594-006FDEVKT-P Bluetooth® Low Energy Development Kit Pro for the DA14594 SmartBond™ System on Chip (SoC) includes a motherboard, daughterboard, and cables. This kit is primarily intended for software application development and power measurements.
The DA14594 is a dual-core Bluetooth 5.3 SoC that includes 256KB of embedded flash and supports Locationing 2.0 Tx features, including: Angle of Arrival (AoA)/Angle of Departure (AoD), Asset Tracking and Locationing At Scale (ATLAS) AoA, Eddystone, iBeacon, and Wireless Ranging (WiRa™) Gen3 Responder. The DA14594 operates at very low power levels while providing world-class RF performance. The DA14594 is available in both FCQFN and WLCSP packages.
Features
- Motherboard, SoC daughterboard, USB cable, and Quick Start Guide
- Easily attached/detached daughterboards
- Integrated power measurement module
- Can be powered from a USB power bank
- DC/DC buck or low-dropout regulator (LDO) mode operation
- MikroBUS & Pmod™ headers
- SEGGER J-Link debugger
Sample & Buy
DA14594-006FDEVKT-P
Active| Pb (Lead) Free: | Yes |
| Carrier Type: | Box |
1u | $59.00Budgetary Price
Add-on Hardware
Additional boards that work with this platform. Some may be required for full functionality or to evaluate specific features.
SmartBond DA14594 Bluetooth Low Energy 5.3 Daughterboard (FCQFN SoC)
DA14594-006FDB-P Active
Extend SmartBond development with a plug‑in daughterboard for rapid Bluetooth Low Energy evaluation.
Recommended Documents:
SmartBond DA14594 Bluetooth Low Energy 5.3 Daughterboard (WLCSP SoC)
DA14594-00O9DB-P Active
Evaluate compact Bluetooth Low Energy designs using a WLCSP‑based SmartBond daughterboard.
Recommended Documents:
Resources
Support
Support Communities
Get quick technical support online from Renesas Engineering Community technical staff.
Knowledge Base
Browse our knowledge base for helpful articles, FAQs, and other useful resources.
