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Renesas Electronics Corporation

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Renesas Boards & Kits

Partner Boards & Kits

SoM/SBC

i.Core RZ/G2E

The Engicam i.Core RZ/G2E is a compact EDIMM 2.0 (67.6 × 32 mm) system on module (SoM) designed for industrial embedded applications. It features onboard DDR3L memory up to 1GB, eMMC storage, Gigabit Ethernet, USB 3.0/2.0, and PCIe connectivity. The module also supports LVDS and MIPI-CSI interfaces for display and vision systems. Powered by a single 5V supply and supported by a Linux/Yocto BSP, it offers rich I/O capabilities in a small form factor, simplifying integration and accelerating time-to-market.
Engicam Srl
SoM/SBC

SMARC RZ/G2E System on Module (SoM)

Provides a system-on-module (SoM) based on the Renesas RZ/G2E microprocessor. Delivers dual Arm® Cortex®-A53 processing with an integrated PowerVR GE8300 3D graphics engine and supports Full HD video encoding and decoding. Supports high-speed interfaces such as PCI Express® and display connectivity, making it suitable for HMI applications. Complies with the SMARC 2.1 standard form factor to enable flexible and scalable system design with high compatibility and expandability.
DRAM & Flash Memory Solutions
Complementary Silicon Devices

DRAM & Flash Memory Solutions

Provides a comprehensive external memory solution for Renesas RZ and R‑Car families, supporting systems that require scalable off‑chip memory. Supported memory types include Serial NAND (Quad/Octal SPI, 512Mb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), ONFI NAND (ONFI 1.0, 1Gb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), DRAM (DDR2/3/4 from 512Mb to 32Gb and LPDDR2/3/4/4x/5/5x from 1Gb to 16Gb), and HyperRAM™ (HyperBus, 64Mb to 512Mb, 1.8V and 1.2V).