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Renesas Boards & Kits
Evaluation
Evaluation Kit for RZ/G2E MPU
RZ/G2E-EVKIT Active
Evaluate Renesas RZ/G2E MPUs with a 96Boards‑compatible platform that supports rapid initial development and system validation. The main and extension board combination enables hands‑on assessment of key device capabilities.
Partner Boards & Kits
SoM/SBC
i.Core RZ/G2E
The Engicam i.Core RZ/G2E is a compact EDIMM 2.0 (67.6 × 32 mm) system on module (SoM) designed for industrial embedded applications. It features onboard DDR3L memory up to 1GB, eMMC storage, Gigabit Ethernet, USB 3.0/2.0, and PCIe connectivity. The module also supports LVDS and MIPI-CSI interfaces for display and vision systems. Powered by a single 5V supply and supported by a Linux/Yocto BSP, it offers rich I/O capabilities in a small form factor, simplifying integration and accelerating time-to-market.
Provided By:
Engicam SrlSoM/SBC
SMARC RZ/G2E System on Module (SoM)
Provides a system-on-module (SoM) based on the Renesas RZ/G2E microprocessor. Delivers dual Arm® Cortex®-A53 processing with an integrated PowerVR GE8300 3D graphics engine and supports Full HD video encoding and decoding. Supports high-speed interfaces such as PCI Express® and display connectivity, making it suitable for HMI applications. Complies with the SMARC 2.1 standard form factor to enable flexible and scalable system design with high compatibility and expandability.
Provided By:
AlphaProject Co.,Ltd.Complementary Silicon Devices
DRAM & Flash Memory Solutions
Provides a comprehensive external memory solution for Renesas RZ and R‑Car families, supporting systems that require scalable off‑chip memory. Supported memory types include Serial NAND (Quad/Octal SPI, 512Mb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), ONFI NAND (ONFI 1.0, 1Gb to 8Gb, 1.8V and 3.3V, 100K/60K cycle endurance), DRAM (DDR2/3/4 from 512Mb to 32Gb and LPDDR2/3/4/4x/5/5x from 1Gb to 16Gb), and HyperRAM™ (HyperBus, 64Mb to 512Mb, 1.8V and 1.2V).
Provided By:
Winbond Electronics Corporation