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説明

The SmartBond™ DA14683 is one of the world's first single-chip solutions for smart home, industrial and wearable devices that meets the enhanced security standards. These highly integrated System-on-Chip (SoC) devices support Bluetooth® 5 and include a range of dedicated features to ensure cutting-edge security for both consumers and developers.

The DA14683 comes with enhanced security features such as key manipulation, secure booting (i.e. starting the system only if the flash image is authenticated), a complete public/private hardware acceleration engine and a hardware true random number generator (TRNG).

As part of our SmartBond range, the SoC offers industry-leading performance from the lowest power consumption and smallest footprint. Its flexible architecture ensures plenty of processing capacity when you need it while saving power when you don't. It also allows the device to manage multi-sensor arrays and enables always-on sensing.

The device offers extensive memory capacity. The DA14683 supports unlimited external Flash for maximum design flexibility . And, the device allows users to benefit from Over-the-Air (OTA) updates. Integrated security and IPv6 support deliver dependable, future‑ready connectivity. A highly efficient, compact architecture reduces power consumption, Bill of Materials (BOM) cost, and overall system footprint.

To further simplify development, our SmartSnippets™ software and versatile hardware development kits help users optimize their software for power consumption.

パラメータ

属性
Wireless StandardBLE 5.0 Core specification
Proprietary 2G4 protocolNo
CPUM0
ROM (KB)128
Memory Size (OTP) (KB)64
RAM (KB)128
GPIOs (#)21, 37
Vcc (V)1.7-4.75
Integrated DCDCSIMO Buck DC-DC converter
Integrated Battery ChargerYes, 400mA USB charger
External Rails and Load Capacity3.3V @ 100mA, 1.4V @ 20mA, 1.2V @ 50mA, 1.8V @ 75mA
Tx Current (mA)3.4
Rx current (mA)3.1
Sensitivity (dBm) (dBm)-94
Clock Rate (MHz)96
Flexible System ClockYes
Execute from FLASHYes
Hardware Crypto EngineYes
QSPI Interface (#)1
SPI (#)2
I2C (#)2
UART (#)2
ADC10-bit x 8-ch
USB Ports (#)1
LE Data Length ExtensionsSupported
2MbpsNot Supported
LE Coded PHY (Long Range)Not Supported
Extended AdvertisingNot Supported
Periodic AdvertisingNot Supported
AoANot Supported
AoDNot Supported
GATT CachingNot Supported
Bluetooth® MeshOn request
Temp. Range (°C)-40 to +85°C

パッケージオプション

Pkg. TypePkg. Dimensions (mm)Lead Count (#)Pitch (mm)
AQFN6 x 6 x 0.8600.55
WLCSP3.4 x 3.0 x 0.5530.4

アプリケーション

  • Wearables
  • Smart home
  • Cloud connected applications
  • Industrial
  • Human interface devices
  • Virtual reality remotes
  • Banking
Part NumberStatusSamplesLongevityStockRoHSPackageBudgetary Price (USD)Lead Count (#)Carrier TypeMoisture Sensitivity Level (MSL)Pitch (mm)Pkg. Dimensions (mm)Qty. per Reel (#)Pb (Lead) FreeTemp. Range (°C)Country of AssemblyCountry of Wafer Fabrication
DA14683-00000A92ActiveN/A2033 SepIn StockRoHS:EN
AQFN1ku | $3.560#Tape & Reel30.55mm6 x 6 x 0.84000#Yes-40 to +85°CTAIWANTAIWAN
DA14683-00000U22ActiveN/A2033 SepIn StockRoHS:EN
WLCSP1ku | $3.12653#Tape & Reel10.4mm3.4 x 3.0 x 0.55000#Yes-40 to +85°CTAIWANTAIWAN

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