Features
- VIN input range: +3.0V to +16V
- Supports 90A DC current
- 3.3V compatible tri-state PWM input (ISL99392R5935)
- 5V compatible tri-state PWM input (ISL99392BR5935)
- ±3% accuracy continuous signal for current monitor
- 8mV/°C master temperature monitor, TOUT
- 4mV/°C individual temperature monitor, TREF
- Comprehensive fault protection for high system reliability
- High-side FET short and overcurrent protection
- Smart Reverse Overcurrent Protection (SROCP)
- Over-Temperature Protection (OTP)
- VCC Undervoltage Lockout (UVLO)
- Fault reporting outputs
- Up to 1.25MHz switching frequency
- RoHS compliant with Exemption 7a, 5 x 6 PQFN
Description
The ISL99392R5935 and ISL99392BR5935 are 90A Smart Power Stages (SPS) that are compatible with Renesas ISL68/69xxx Digital Multiphase (DMP) controllers and phase doublers (ISL6617A), respectively. The ISL99392R5935 and ISL99392BR5935 offer best-in-class current sense accuracy over line, load, and temperature. When combined with a Renesas digital PWM controller (or doubler), these devices enable precision system level power management and best-in-class transient response for load-line based regulators. In addition to the common master TOUT signal to the DMP, the individual phase Temperature Reporting (TREF) supports thermal management and N+1 redundancy system management. The ISL99392R5935 and ISL99392BR5935 simplify design by eliminating typical DCR sensing networks and associated thermal compensation components. The thermally enhanced 5x6 package enables high density designs.
The ISL99392R5935 features the Renesas tri-state PWM input that works with the Renesas ISL682xx/ISL692xx digital multiphase PWM controllers to provide a robust solution in event of abnormal operating conditions. The ISL99392R5935 and ISL99392BR5935 also improve system performance and reliability with integrated fault protection, including HFET overcurrent, HFET shorted, Smart Reverse Overcurrent (SROCP), Over-Temperature (OTP), and VCC Undervoltage Lockout (UVLO).
Applications
- Accelerators (GPU, ASIC, Artificial Intelligence)
- Core, graphic, and memory VRs for microprocessors
- High density VR for server, networking, and cloud computing
- POL DC/DC converters and video gaming consoles
| Part Number | Status | Samples | Stock | RoHS | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Bias Voltage Range (V) | Pb (Lead) Free | Pb Free Category |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL99392BFRZ-TR5935 | Obsolete | N/A | In Stock | RoHS:EN | VFQFPN | 39# | Reel | 3 | 4.75 - 5.25 | Exempt | Pb-Free 100% Matte Tin Plate w/Anneal-e3 |
| ISL99392FRZ-TR5935 | Obsolete | N/A | Out of Stock | RoHS:EN | VFQFPN | 39# | Reel | 3 | 3.135 - 3.465 | Exempt | Pb-Free 100% Matte Tin Plate w/Anneal-e3 |
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Applied Filters
- Datasheet - Short-FormPDF 119 KB R16DO0031EU0101 Rev.1.01 Nov 28, 2023
- Product AdvisoryPDF 271 KB Nov 14, 2023
- Product Change NoticePDF 202 KB Apr 21, 2022
- Product Change NoticePDF 189 KB Jun 22, 2021
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- Datasheet - Short-FormPDF 119 KB R16DO0031EU0101 Rev.1.01 Nov 28, 2023
Recommended Documents (1)
- Datasheet - Short-FormPDF 119 KB R16DO0031EU0101 Rev.1.01 Nov 28, 2023
Datasheets (1)
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (2)
- Product AdvisoryPDF 271 KB Nov 14, 2023
- Product Change NoticePDF 202 KB Apr 21, 2022
- Product Change NoticePDF 189 KB Jun 22, 2021
Product Notices (PCN, EOL, etc) (3)
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