| Title | Information |
|---|---|
| Pkg. Name Name used to describe Renesas packages.
|
M20.3 |
| Pkg. Previous Code Package code maintained as part of the Renesas and Intersil merger.
|
MDR |
| Package Description Descriptive text for this package.
|
Custom 20ld SOIC Module w/ Offset Crystal & Ground Plane |
| Package Status | Active |
| Package Type | SOICW |
| Class | PLASTIC |
| Package Code The unique identifier of this package.
|
MDR |
| Category | PLASTIC |
| Lead Count | 20 |
| Pb (Lead) Free | Yes |
| Length | 12.8mm |
| Width | 7.49mm |
| Thickness Seated height or Package height
(Please check the outline drawing) |
0mm |
| Pitch | 1.27mm |
| Pkg. Dimensions (mm) Package Dimensions. Example: 5 x 7 x 0.5
|
12.80 x 7.49 x 0.00 |
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