Evaluation Kit for RA6M3 MCU Group
The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible...
The EK-RA6M3G evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using Renesas' Flexible Software Package (FSP) and e2 studio IDE. You can utilize rich on-board features along with your choice of popular ecosystem add-ons to bring your big ideas to life.
The EK-RA6M3G kit consists of two boards: the EK-RA6M3 board featuring the RA6M3 MCU with on-chip graphics LCD controller and the graphics expansion board featuring a 4.3-inch TFT color LCD with capacitive touch overlay.
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PDF 566 KB | Quick Start Guide | |
PDF 2.09 MB 日本語 | Manual - Development Tools | |
ZIP 8.73 MB 日本語 | Schematic | |
PPS 40.98 MB | Presentation | |
PPS 18.12 MB | Presentation | |
PDF 70 KB | Application Note | |
PDF 465 KB 日本語 | Flyer | |
PDF 5.21 MB | Application Note | |
PDF 4.03 MB | Application Note | |
PDF 3.75 MB 简体中文 | Application Note | |
PDF 5.08 MB | Application Note | |
PDF 2.24 MB | Application Note | |
12 items
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Software title
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Software type
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Company
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Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required.
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Software Package | Renesas |
Renesas Flash Programmer (Programming GUI) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78KR, 78K0]
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Programmer (Unit/SW) | Renesas |
SEGGER™ J-Link™ Software and Documentation Package Software utilities, firmware updates, and supporting documentation for the J-Link on-board programmer and debugger on the RA MCU kits.
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Software Package | SEGGER |
Quick-Connect IoT Platform Quick-Connect IoT platform enables fast prototyping by providing compatible hardware and software building blocks.
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Other Hardware | Renesas |
4 items
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Title | Type | Date Date |
[Software=RA FSP],[Board=EK-RA6M3G]
ZIP
11.21 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | |
ZIP 7.92 MB | Sample Code | |
[Software=RA FSP | v4.4.0]
ZIP
4.86 MB
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Sample Code | |
ZIP 7.36 MB | Sample Code | |
The Renesas Flexible Software Package includes Azure RTOS ThreadX® real-time operating system, the
Azure RTOS GUIX library and hardware drivers unified under a single robust software package.
[Toolchains=GCC Arm Embedded|9.3.1.20200408] [Software=RA FSP|v3.1.0] [Board=EK-RA6M3G]
ZIP
4.97 MB
Compiler:
GNU Arm Embedded
IDE:
e2 studio
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Sample Code | |
ZIP 3.14 MB | Sample Code | |
6 items
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The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible...
Select an orderable part number:
Orderable Part ID | Sample |
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RTK7EKA6M3S01001BU | Availability |
Kickstart IoT and embedded systems development using Renesas EK-RA6M3, Evaluation Kit for RA6M3 MCU Group. Familiarize yourself with the kit architecture, key features, quick start example project and many useful resources to begin innovating quickly.
Develop Faster Using Example Projects for RA MCU Innovation Kits for IoT | Blog Post | Dec 3, 2021 | |
Quickly Programming RA MCU Innovation Kits for IoT | Blog Post | Dec 3, 2021 | |
Accelerate Debugging Using RA MCU Innovation Kits for IoT Applications | Blog Post | Nov 15, 2021 | |
Beginning to Innovate Has Never Been Easier | Blog Post | Nov 11, 2021 |
The EK-RA6M3G kit meets the following certifications/standards. Refer to the EK-RA6M3G kit’s user manual for the disclaimer, precautions and more details on the certifications.