Semiconductor & Embedded System Solutions

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Get Higher Performance with Low-Voltage GaN

Broad 100V REXGaN® portfolio delivers efficiency, increased power density and greater design flexibility for AI data centers, robotics and industrial systems.

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High-Voltage GaN in Smaller, Cooler Packages

Dual-side cooled 8x8 mm 650V GaN maximizes power density in AI data centers through superior performance and efficient cooling.

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Industry’s Smallest Multi-Time Programmable GreenPAK™

Maximize design flexibility in ultra-compact applications with a tiny, cost-efficient programmable IC that can be updated even after deployment.

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Homepage banner for Renesas RZ/G3L and RZ/G3SE low power microprocessors, showing MPU chips with a modern technology-themed background, highlighting Renesas RZ/G3L and RZ/G3SE low power MPUs for industrial and IoT edge devices.

The 1mW Breakthrough: Low-Power Standby MPUs Ideal for HMI and IoT Edge

Seamlessly scale your product portfolio with pin-compatible RZ/G3L and RZ/G3SE MPUs. Reduce development efforts with reusable design assets.

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Featured Products

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3D illustration featuring top and bottom views of DFN chip package with 8 lead count.

RH4Z2502

Single-Channel IO-Link Physical Layer Master/Device Transceiver with Enhanced Protection and Embedded Stack License

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3D illustration featuring top and bottom of TSSOP IC chip package with 16 lead count

RAA2P4524

Inductive Position Sensor with Dual-Coil Sensing Element Featuring SPC Interface

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3D illustration featuring top and bottom views of FCLGA IC chip package with 8 lead count.

RTP100E2P6G1FL

100V 2.6mΩ E-Mode GaN FET in 5 × 6mm FCLGA Package

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3D illustration featuring top and bottom views of LFBGA IC chip package with 368 lead count.

RZ/G3L

Power-Efficient, Multi-Core Architecture Microprocessor with 3D Graphics Accelerator for HMI

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3D illustration featuring top and bottom views of VFQFPN IC chip package with 28 lead count.

RG3M89B12

I3C Hub 2:8 Intelligent Switch with VIOM and VIOS LDOs Enabled

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3D illustration featuring top and bottom views of SCQFN chip package with 72 lead count.

RAA278831

ASIL B Video Display and Diagnostics OpenLDI Bridge IC for Automotive HUD Systems

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3D illustration featuring top and bottom views of STQFN IC chip package with 44 lead count.

PTX205R

Flexible NFC Controller with Reader and Card Emulation for IoT

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3D illustration featuring top and bottom views of SOIC chip package with 14 lead count.

iW3701

Digital Two-Stage Combo Boost PFC and High-Voltage Buck Controller for High PF, Low THD Dimmable Lighting Solutions in Industrial Applications to 250W

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Winning Combinations

Delivering comprehensive solutions with analog, power, embedded processing, and connectivity products.

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Humanoid robot hand holding battery indicating the robot's battery management system capabilities.

Humanoid Battery Management System

Integrated humanoid robot BMS enabling safe, real-time power management, protection, and battery-state control.

Gardener holding electric weed trimmer to trim grass in his garden.

Smart Cordless Brushless String Trimmer

Next-gen cordless brushless string trimmer with GaN motor control, AI/ML adaptive cutting, and Bluetooth LE connectivity for smart, efficient operation.

Automotive On-Board Charger (OBC) attached to an indoor garage wall with white electric car in the background.

6.6kW Single-Stage Onboard Charger (OBC)

Single-stage GaN-based bidirectional onboard charger with DAB topology, delivering high efficiency, compact size, and enhanced reliability.

News & Updates

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Oct 6, 2026Press Release	Renesas Expands GaN Portfolio with First Low-Voltage GaN FETs for AI Data Centers and Robotics
Oct 2, 2026Press Release	UPDATE: Renesas Announces Establishment of New Subsidiary and Changes as Specified Subsidiary
Oct 1, 2026Blog	How to Achieve More Power in Less Space with GaN
Sep 30, 2026Press Release	Renesas Unveils Industry's First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers
Sep 24, 2026Press Release	Renesas Introduces Smallest Configurable GreenPAK IC with Multi-Time Programmability in Ultra-Compact WLCSP and STQFN Packages