Important notice
WINNING COMBINATIONS
Renesas + Dialog complementary product portfolios of Analog + Power + Embedded Processing + Connectivity work together to deliver comprehensive solutions.
WHAT'S NEW
Twice the performance and more than 30% power efficiency improvement than the existing RX130 group. Deliver improved noise tolerance and sensing accuracy through advanced capacitive touch IP.
Utilize the design support available for RL78/F1x MCU series and RH850/F1Kx MCU series to easily develop highly reliable products.
RZ/G2 MPU enables secure, high-speed and high graphics resolution up to 4K in HMI. Accelerate your development with the readily available boards from RZ/G partners.
QUICK LINKS
NEWS & BLOG
Renesas’ Innovative Automotive Chips Drive Next-Generation Multimedia System for Toyota Lexus
TOKYO, Japan ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that its R-Car H3 and R-Car M3 system-on-chips (SoCs) have
Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth® 5.3 Low Energy Specification
TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it is developing new microcontrollers (MCUs) that will
In this blog, we will explain how Renesas contributes with the new R-Car S4 based chipset to a smarter E/E architecture in the Automotive market.
Chris introduces the RZ/G Free and Open Source Software (FOSS) AI Board Support Package (BSP) that includes popular Open Source AI frameworks and sample benchmarking applications for each framework.
