HS-26C32RH

特長

Electrically Screened to SMD # 5962-95689
QML qualified per MIL-PRF-38535 requirements
1.2 micron radiation hardened CMOS
Total dose: 300 krad(Si) (max)
Latch-up free
EIA RS-422 compatible inputs
CMOS compatible outputs
Input fail safe circuitry
High impedance inputs when disabled or powered down
Low power dissipation 138mW standby (max)
Single 5V supply
Full -55°C to +125°C military temperature range

HS-26C32xH_HS-26C32RH-T Functional Diagram

説明

The Intersil HS-26C32RH, HS-26C32EH are differential line receivers designed for digital data transmission over balanced lines and meets the requirements of EIA Standard RS-422. Radiation hardened CMOS processing assures low power consumption, High-Speed, and reliable operation in the most severe radiation environments. The HS-26C32RH, HS-26C32EH have an input sensitivity typically of 200mV over the common mode input voltage range of ±7V. The receivers are also equipped with input fail safe circuitry, which causes the outputs to go to a logic “1” when the inputs are open. Enable and Disable functions are common to all four receivers. Specifications for Rad Hard QML devices are controlled by the Defense Logistics Agency Land and Maritime (DLA). The SMD numbers listed in the “Ordering Information” table must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-95689.

パラメータ

属性	値
Rating	Space
Input High Voltage Range	VDD to 0.7 VDD
Input Low Voltage Range	0 to 0.3 VDD Max
Output High Voltage (V)	4.1
Output Low Voltage (V)	0.4
Supply Voltage (min) (V)	4.5 - 4.5
Supply Voltage (max) (V)	5.5 - 5.5
Temp. Range (°C)	-40 to +85°C, -55 to +125°C
TID HDR (krad(Si))	300
DSEE (MeV·cm2/mg)	100
Flow	RH Hermetic
Qualification Level	Class Q, Class V, EM
Die Sale Availability?	Yes
PROTO Availability?	Yes

パッケージオプション

Pkg. Type	Pkg. Dimensions (mm)	Lead Count (#)	Pitch (mm)
CFP	10.4 x 6.9 x 0.00	16	1.3
DIE	—	—	—
SBDIP	20.3 x 7.5 x 2.41	16	2.5

アプリケーション

Line Receiver for MIL-STD-1553 Serial Data Bus

Part Number	Status	Samples	Stock	RoHS	Package	Lead Count (#)	Carrier Type	Moisture Sensitivity Level (MSL)	TID HDR (krad(Si))	Pitch (mm)	Pkg. Dimensions (mm)	Qualification Level	DLA SMD	Pb (Lead) Free	Pb Free Category	MOQ	Temp. Range (°C)	CAGE code
HS0-26C32RH-Q	Active	N/A	Out of Stock	RoHS:EN RoHS:JA	DIE				300			Class V	5962F9568901V9A	No		100	-55 to +125°C	34371
HS0-26C32RH/SAMPLE	Active	N/A	Out of Stock	Contact	DIE				300			EM		No		5	-40 to +85°C	34371
HS1-26C32RH-8	Active	N/A	Out of Stock	Contact	SBDIP	16#	Tube	Not Applicable	300	2.5mm	20.3 x 7.5 x 2.41	Class Q	5962F9568901QEC	Exempt	Gold Plate over compliant Undercoat-e4	25	-55 to +125°C	34371
HS1-26C32RH-Q	Active	N/A	Out of Stock	Contact	SBDIP	16#	Tube	Not Applicable	300	2.5mm	20.3 x 7.5 x 2.41	Class V	5962F9568901VEC	Exempt	Gold Plate over compliant Undercoat-e4	25	-55 to +125°C	34371
HS1-26C32RH/PROTO	Active	Available	Out of Stock	Contact	SBDIP	16#	Tube	Not Applicable	300	2.5mm	20.3 x 7.5 x 2.41	EM		Exempt	Gold Plate over compliant Undercoat-e4	1	-55 to +125°C	34371
HS9-26C32RH-8	Active	N/A	Out of Stock	Contact	CFP	16#	Tray	Not Applicable	300	1.3mm	10.4 x 6.9 x 0.00	Class Q	5962F9568901QXC	Exempt	Gold Plate over compliant Undercoat-e4	25	-55 to +125°C	34371
HS9-26C32RH-Q	Active	N/A	In Stock	Contact	CFP	16#	Tray	Not Applicable	300	1.3mm	10.4 x 6.9 x 0.00	Class V	5962F9568901VXC	Exempt	Gold Plate over compliant Undercoat-e4	25	-55 to +125°C	34371
HS9-26C32RH/PROTO	Active	Available	In Stock	Contact	CFP	16#	Tray	Not Applicable	300	1.3mm	10.4 x 6.9 x 0.00	EM		Exempt	Gold Plate over compliant Undercoat-e4	1	-55 to +125°C	34371
HS9G-26C32RH-Q	Active	N/A	In Stock	Contact	CFP	16#	Tray	Not Applicable	300	1.3mm	10.4 x 6.9 x 0.00	Class V	5962F9568901VYC	Exempt	Gold Plate over compliant Undercoat-e4	25	-55 to +125°C	34371
HS9G-26C32RH/PROTO	Active	Available	Out of Stock	Contact	CFP	16#	Tray	Not Applicable	300	1.3mm	10.4 x 6.9 x 0.00	EM		Exempt	Gold Plate over compliant Undercoat-e4	1	-55 to +125°C	34371

読込中

フィルター

推奨ドキュメント (1)

データシート
英語
HS-26C32RH, HS-26C32EH Datasheet
RECOMMENDED
PDF 405 KB FN3402 2021年10月22日

データシート (1)

データシート
英語
HS-26C32RH, HS-26C32EH Datasheet
RECOMMENDED
PDF 405 KB FN3402 2021年10月22日

アプリケーションノート、ホワイトペーパー (5)

アプリケーションノート
英語
AN9520: Using the HS-26C(T)32RH Radiation Hardened RS-422 Line Receiver
PDF 972 KB an9520 2025年9月03日
アプリケーションノート
英語
R34AN0012EU: Designing an Idle-Bus Failsafe Network for the HS-26Cxx32 Family
PDF 317 KB R34AN0012EU0100 Rev.1.00 2025年6月02日
アプリケーションノート
英語
R15AN0011: FAQs: RS-485 Transceivers
PDF 366 KB R15AN0011EU0100 Rev.1.00 2022年5月17日
AI生成コンテンツ: This document provides detailed guidance on RS-485 transceiver design and application. It covers key topics such as design checklists, interfacing 5V transceivers with 3V controllers, mixing 3.3V and 5V transceivers on the same bus, and using high-speed transceivers at lower data rates. It explains maximum stub lengths, wiring differential inputs to accept single-ended signals, and proper bus termination. The document also discusses transient protection methods and highlights the benefits of specific transceiver models. Practical formulas and diagrams support implementation and troubleshooting in RS-485 networks.
アプリケーションノート
英語
AN9867: End of Life Derating: A Necessity or Overkill
PDF 338 KB an9867 1999年11月10日
AI生成コンテンツ: Electrical parameters are monitored during life testing to detect drift and failures, defined by exceeding datasheet limits. New products require less than 1% failure during burn-in, with failure analysis and corrective actions if exceeded. Sampling plans ensure defect rates below 3%. Life tests last 1000-3000 hours at 125°C depending on process maturity. Failure mechanisms include electromigration, ionic contamination, hot carrier injection, and dielectric rupture. Product sign-off requires all parties' approval after reliability confirmation. Space products undergo burn-in and quality conformance inspections with strict failure limits. Derating is unnecessary as datasheet limits are set at 6-sigma from characterization data, ensuring reliability.
アプリケーションノート
英語
AN9654: Use of Life Tested Parts
PDF 224 KB an9654 1999年5月05日
AI生成コンテンツ: The document explains the reliability and failure mechanisms of semiconductor parts, focusing on life testing and wearout. It discusses how switching states cause transient current pulses and hot carrier injection, which only occur briefly during switching. Life testing at elevated temperatures accelerates aging to remove infant mortality failures, improving reliability. The failure rate follows a bathtub curve with infant mortality, useful life, and wearout phases, modeled by lognormal and exponential distributions. The Arrhenius equation relates failure rates at different temperatures. Burn-in and life tests reduce early failures without harming intrinsic reliability.