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128K x 18 / 256K x 9 SuperSync II FIFO, 3.3V

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PN80
Lead Count (#):80
Pkg. Dimensions (mm):14.0 x 14.0 x 1.4
Pitch (mm):0.65

環境及び輸出分類情報

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

製品スペック

Lead Count (#)80
Pb (Lead) FreeNo
Carrier TypeReel
Moisture Sensitivity Level (MSL)3
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)2048
Family NameSuperSync II
FunctionBus Matching, JTAG
I/O Frequency (MHz)66 - 66
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)14
MOQ750
Organization128K x 18, 256K x 9
Package Area (mm²)196
Pb Free Categorye0
Pitch (mm)0.65
Pkg. Dimensions (mm)14.0 x 14.0 x 1.4
Pkg. TypeTQFP
Qty. per Carrier (#)0
Qty. per Reel (#)750
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelYes
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)14
掲載No

説明

The 72V2103 256K x 9/128K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.