パッケージ情報
| CADモデル: | View CAD Model |
| Pkg. Type: | TQFP |
| Pkg. Code: | PKG100 |
| Lead Count (#): | 100 |
| Pkg. Dimensions (mm): | 20.0 x 14.0 x 1.4 |
| Pitch (mm): | 0.65 |
環境及び輸出分類情報
| Pb (Lead) Free | Yes |
| ECCN (US) | 3A991.b.2.a |
| HTS (US) | 8542.32.0041 |
| Moisture Sensitivity Level (MSL) | 3 |
製品スペック
| Lead Count (#) | 100 |
| Pb (Lead) Free | Yes |
| Carrier Type | Tray |
| Architecture | Synch Burst |
| Bus Width (bits) | 32 |
| Core Voltage (V) | 3.3 |
| Density (Kb) | 2048 |
| I/O Voltage (V) | 3.3 - 3.3 |
| Length (mm) | 20 |
| MOQ | 576 |
| Moisture Sensitivity Level (MSL) | 3 |
| Organization | 64K x 32 |
| Output Type | Pipelined |
| Package Area (mm²) | 280 |
| Pb Free Category | e3 Sn |
| Pitch (mm) | 0.65 |
| Pkg. Dimensions (mm) | 20.0 x 14.0 x 1.4 |
| Pkg. Type | TQFP |
| Price (USD) | $6.02495 |
| Qty. per Carrier (#) | 72 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Temp. Range (°C) | -40 to 85°C |
| Thickness (mm) | 1.4 |
| Width (mm) | 14 |
71V632 に関するリソース
説明
The 71V632 3.3V CMOS SRAM is organized as 64K x 32. The pipelined burst architecture provides cost-effective 3-1-1-1 secondary cache performance for processors up to 117MHz. The 71V632 SRAM contains write, data, address, and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.