Overview
Description
This cellular cloud-connected design streamlines the secure linkage of devices to the cloud. It collects sensor data and transmits it through a cellular modem or an Ethernet port. The Flexible Software Package (FSP) provides a versatile platform for building secure, connected IoT devices with production-ready drivers, Azure® RTOS, FreeRTOS™, and additional middleware stacks. This approach facilitates the efficient development of remote sensing applications with strong connectivity and data management capabilities.
System Benefits:
- Facilitates rapid development of cloud-connected devices using MCUs.
- Offers flexible expansion through Pmod and Arduino interfaces.
- Seamlessly integrates with Azure or AWS cloud services using the Flexible Software Package (FSP).
Comparison
Applications
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LDO
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Exiting Interactive Block Diagram
Software
Software & Tool Pages
| Software title | Software type | Company |
|---|---|---|
| RA Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain, and Segger J-Link drivers required to use this software. No additional installations are required. | Software Package | Renesas |
1 item | ||
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