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RA Flexible Software Package (FSP)

Software Package

Renesas Flexible Software Package (FSP) v6.1.0 User's ManualRenesas Flexible Software Package (FSP) User's Manual (Web Version - HTML)

Overview

The Renesas Flexible Software Package (FSP) is an enhanced software package designed to deliver user-friendly, scalable, high-quality software for embedded system designs using the Renesas RA family of Arm Microcontrollers, ensuring software compatibility across the RA family, from entry-level to high-performance microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.

download Download Latest FSP (v6.1.0):

FSP Platform Installer (Includes e² studio IDE, toolchain, and FSP packs):

RA Smart Configurator (RASC) Installer (FSP packages to use with 3rd party IDEs with IAR Embedded Workbench, Arm Keil MDK):

FSP Standalone Installer (FSP packs for the users who only update the FSP and no e² studio update):

  • Download from the Assets section of the GitHub

The installation instructions can be found here. All the FSP Releases and Patches can be found on GitHub.

FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease the implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.

FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, including Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions. FSP and e² studio can be used free of charge on any Renesas device.

RA Flexible Software Package (FSP)
RA Flexible Software Package (FSP)
  • Multi-Core and Single Core support of Arm® Cortex®- M-based RA MCUs
  • Small memory footprint HAL drivers
  • Intuitive configurator and code generator
  • Static and dynamic analysis using industry-standard tools
  • Application support using RTOS and non-RTOS environments
  • Azure RTOS and its middleware stacks with Flexible Software Package
    • Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
  • FreeRTOS support – Includes Kernel and set of software libraries
    • FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
  • Tool configurable RTOS resources (Threads, mutexes, etc.)
  • Middleware stacks from Renesas and third parties
    • Ethos-U55 support for CM85 based MCUs for efficient AI/ML integration
    • TCP/IP and other connectivity protocol stacks including MQTT
    • USB middleware support for CDC, HID, and MSC
    • Wireless connectivity through Cellular (Cat-M1), Wi-Fi, and Bluetooth Low Energy LE 5.0 (BLE Mesh)
    • File System support with FreeRTOS+FAT and LittleFS
    • Storage (Block Media) support for SDMMC, SPI, and USB.
    • Virtual EEPROM on Flash
    • Capacitive touch middleware to implement widgets like Button, Slider, and Wheels.
    • Motor control algorithms
    • Secure Bootloader through MCUboot
    • Sensor Module APIs
  • TrustZone support (for applications on CM33-based MCUs)
    • TrustZone enabled drivers and middleware
    • Easy-to-use tool support for TrustZone configuration
  • PSA Level 2 Certified
  • AWS qualified for FreeRTOS
  • Easy connectivity options to major cloud providers
  • Secure connections through NetX Duo Secure and Mbed TLS
  • Cryptographic APIs and integrated Hardware Acceleration support
    • Arm PSA Cryptographic APIs
    • Azure RTOS NetX Crypto APIs
    • Ultimate security with FSP Crypto APIs (SCE9 protected mode)
    • Oberon Ocrypto targeting low end RA2E1 devices
    • TinyCrypt targeting constrained devices
  • Graphics interface support and tools
    • LVGL integration support for RA devices
    • Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
    • Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
  • Secure debugging capabilities
  • Extensive tool support from Renesas and leading third-party solutions
  • Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, toolchain, and Segger J-Link drivers)
  • Complete source code available through GitHub

For additional information and links, go to GitHub.

v6.1.0

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 6.1.0

Minimum e2 studio version for FSP 6.1.0 is e2 studio 2025-07

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator (RASC) for this release.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

New Features

  • Added support for RA8T2 devices
    • Includes MCK-RA8T2 board support
  • Added support for RA0L1 devices
    • Includes FPB-RA0L1 board support
    • Includes RSSK-RA0L1 board support
  • Added GPT polarity inversion control for GTIOCnA/B pins (feature exclusive to RA8P1/RA8T2 hardware)
  • Added IPC Semaphore module for multicore RA8 devices
  • Platform installer updated to include e2 studio 2025-07
  • Support USB PAUD for BareMetal and FreeRTOS
  • Added KDF-SHA 256/384 feature for RSIP-E51A and RSIP-E50D PM driver
  • Added AES-CCM, HMAC, EdDSA features for RSIP-E31A PM driver
  • Added Brainpool curve support for ECDH feature on RSIP-E31A and RSIP-E11A PM driver
  • Added Brainpool and Koblitz curve support to ECDSA feature for RSIP-E11A PM driver
  • Added support for Post Quantum Crypto (PQC) ML-KEM-512 and ML-KEM-768 key generation, encapsulation, and decapsulation
  • Added new BGA100, BGA64 part numbers to RA4L1
  • Added low-power and wake-up/stand-by features to the NFC Reader PTX driver
  • Added FSP Solution template for Multicore Flat projects
  • Add support for configuring DCDC soft start delay time when waking from Deep Software Standby
  • Added support for multiple Ethernet interfaces when using FreeRTOS-Plus-TCP
  • Added MP3 decode support for RA devices using the minimp3 library
    • Includes Helium (MVE) acceleration when used on RA8 devices
  • Added rm_comms_socket generic comms module for socket-based connections
  • Added credit-based shaper (CBS) support for RA8P1 and RA8T2 Ethernet TSN
  • Added DMAC support for r_sci_b_spi
  • Supports single-class hub for BareMetal and FreeRTOS
    • Properties for enabling USB host hub single-class have been added to the HCDC, HHID, and HMSC stacks
  • Added FW update for FSBL feature for RSIP-E50D PM driver
  • Added ChaCha20 feature for RSIP-E50D PM driver
  • Added HMAC-SHA 512/224 and 512/256 key support for RSIP-E31A CM Key Injection
  • Released CAVP-certified module for RSIP-E11A Protected Mode driver
  • Added support for r_sci_lin slave auto synchronization
  • Added gPTP support for RA8P1 and RA8T2 devices

Fixes and Improvements

  • Updated usage notes for rm_netxduo_wifi noting that use of the NetX Duo FTP addon with the Silex WiFi module is not recommended
  • Added constraint to POEG ensures a callback function is defined when an interrupt is enabled
  • Fix issue with Cellular GM where calling TCP_Sockets_Connect with receiveTimeoutMs less than portMAX_DELAY can cause a NULL pointer dereference
  • Fixed r_ble_gtl build issue due to unneeded r_flash_hp.h include
  • Disabled Cortex-M85 cache lookups while changing voltage scaling
  • The user can now set 'Timer Thread Priority' as '0' in Azure ThreadX
  • Fixed RM_BLOCK_MEDIA_RAM FAT table size calculation
  • The following OFS Register property names are updated to align with the hardware manual:
    • OFS1_SEL (OFS1 Register Select) Settings
    • OFS3_SEL (OFS3 Register Select) Settings
    • BPS_SEL (BPS Register Select) Settings
    • BANKSEL_SEL (Banksel Register Select) Settings
    • Bank Swap Switch under BANKSEL (Bank Select Register) Settings
  • Removed options for hidden property 'Data cache forced write-through' under RA8X Family → Cache settings
  • rm_mqtt_onchip_da16xxx: Resolved IAR build warnings when none of the TLS Cipher Suites are selected
  • rm_at_transport_da16xxx_uart: Added module constraint to add the dependent UART peripheral module
  • Fixed a potential race condition in r_cac that could cause the measurement end interrupt to retrigger erroneously if the measurement was stopped from the CAC interrupt callback and the measurement interval was shorter than the ISR duration
  • Update Modbus TCP server to support multi client
  • Duplicated MIPI CSI property name changed from 'Frequency Clock Rate Adjust' to 'Data Lane Skew Adjustment'
  • Added extern declarations for r_vin, r_mipi_csi, and r_mipi_dsi driver instances
  • Fixed a minor formatting issue causing C++11 build warnings in ThreadX Port assembly code
  • Updated all board URLs to the new format
  • R_GPT_InfoGet now returns the correct frequency when the GPT is configured to use GPTCLK
  • Updated usage notes for rm_block_media_ram to add basic example of the RAM block media implementation in an application
  • Added support for SCI LIN operation mode in pin configuration for RA4M2, RA4M3, RA6M4, and RA6M5
  • R_BSP_WarmStart has been moved to src/hal_warmstart.c in new projects
  • The Minimal template for RTOS projects now creates a single thread by default
  • Fixed two R_VIN property display strings that were swapped, 'Cb to G Coefficient' and 'Cb to B Coefficient'
  • Update Ocrypto to v3.9.2
  • Fixed rm_littlefs_flash build failure when using r_mram
  • Fixed AES-GCM Tag issue in TC3 GCM specification
  • Updated PCLKB tooltip for multiple devices to align with specifications in the Hardware Manual
  • Added missing GPTE feature support on RA2T1 devices
  • Added support for separated frames in lwIP
  • Updated display of USBCLK for RA4M1 MCU
  • Removed the unsupported USBCLK source for the RA6T1 MCU
  • Updated tooltip of ICLK, PCLKA, PCLKD, GPTCLK for RA8T2 and RA8P1 devices
  • Updated tooltip of PCLKB, PCLKE for RA8E2 MCU
  • Corrected the XTAL and SUBCLK mapping for CECCLK on the RA6M5 MCU where it was previously interchanged
  • Updated FreeRTOS-Plus-TCP version to v4.3.3
  • Fixed ECDSA signature generation result that was always the same (no random number component was included) for RSIP-E51A and RSIP-E50D PM drivers
  • UART sleep support enabled in the DA1453x image
  • Stabilization wait time updates for RA4L1:
    • The stabilization time for LOCO, LVD MONITOR1, and LVD MONITOR2 was changed to the value specified in version 1.10 of the RA4L1 User's Manual
    • Changes to OPCCR must only occur when HOCO is stopped or stable
  • Added CTSU IP to MCU mapping information in CTSU usage notes
  • Register Write Protection:
    • Fix issue where PRCR value was not being restored in R_BSP_OctaclkUpdate
    • Add support for new PRCR field on RA8x2 devices (PRC5: protection for reset registers)
  • Fixed issue where DTC1 module stop bit was not being updated in secondary core applications when calling R_BSP_MODULE_START
  • Fixed issue where OSPI and ETHERC security attribution was not automatically set in TrustZone secure projects
  • Fixed invalid ADC_D constraint shown for some combinations of Upper and Lower Bound settings
  • SEGGER JLink version updated to v8.58
  • E2 and E2 Lite versions updated to 2.6.2

Known Issues

  • RA0E1:
    • e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
    • Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
    • HS400x and ZMOD4xxx sensors cannot be used on RA0E1
    • FS3000 sensor does not support SAU-I2C driver
  • Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
  • PMSC may not work properly when a USBX Composite Device (PCDC+PMSC) is connected to a specific Linux OS (USB Host).
  • EWARM version 9.70.1 does not contain support for RA0L1, RA2T1, RA4C1, RA8P1 and RA8T2. To develop with IAR for these devices, it is necessary to install a support patch file for which can be downloaded by EWARM v9.70.1 users from the IAR MyPages system
    • RA0L1 (arm_Renesas_RA0L1_20250305_1.zip)
    • RA2T1 (arm_Renesas_RA2T1_20250714_1.zip)
    • RA4C1 (arm_Renesas_RA4C1_20250213_1.zip)
    • RA8P1 (arm_Renesas_RA8P1_20250530_1.zip)
    • RA8T2 (arm_Renesas_RA8T2_20250530_1.zip)
  • Due to limitations in RASC, Projects fail to build if there are files with the same name in a build group. To fix this issue, create files with the same name in different build groups. For known issues in the tools, please refer to the respective tool's release notes, e2 studio RN

Deprecations

  • rm_zmod4xxx and rm_rrh46410 modules have been deprecated as the devices are now EOL

Visit GitHub Issues for this project.

Downloads

Type Title Date
Software & Tools - Software
VK-RA8M1 Voice Combo (APF, NLU, VAS, CNSV) Project
ZIP 11.59 MB
Related Files:
Software & Tools - Software
FSP Linux Platform Installer
简体中文
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FSP RASC Linux Installer
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FSP RASC Windows Installer
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Software & Tools - Software
FSP RASC macOS Installer
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Software & Tools - Software
FSP Windows Platform Installer
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FSP macOS Platform Installer
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7 items

Documentation

Design & Development

Note: Separate installation of e² studio is not required for FSP, as the FSP Platform Installer installs e² studio and all other tools required to use FSP.

 

Support

Support Communities

Support Communities

Get quick technical support online from Renesas Engineering Community technical staff.
Get Support
Browse FAQs

FAQs

Browse our knowledge base of common questions and answers.
Browse FAQs
Submit a Ticket

Submit a Ticket

Need to ask a technical question or share confidential information?
Submit Ticket

Resources

Videos & Training

This video shows how to import the Renesas RA Flat project and TrustZone project in e² studio.

e² studio Tips - How to Import Example Project in e² studio for RA
0:00:00 Opening
0:00:14 Flat Project and TrustZone Project
0:00:34 Set up IDE
0:00:54 Download Example Project
0:01:07 Import Flat Project
0:02:44 Import TrustZone Project
0:04:30 e² studio User Guide

Events & Webinars

News & Blog Posts

Blog Post
Nov 15, 2022
Three Reasons You'll Want to Use Our Flexible Software Package for Your IoT Designs
Blog Post
Apr 28, 2022
Arm Cortex-M85 Is Here, Is Your IoT Design Ready?
Blog Post
Jan 28, 2022
The RA MCU Family is Made to Help Solve Your Design Challenges
Blog Post
Jan 28, 2022
Get Where You’re Going with the Official Renesas RA Family Guide
News
Jun 15, 2021
Renesas Extends Support for Microsoft Azure RTOS Across 32-bit MCU Families with Simple Licensing for Secure Embedded IoT Development

Additional Details

Components

  • CMSIS compliant pack files for e2 studio integrated development environment
  • BSPs for RA MCUs and boards
  • HAL drivers to access peripherals
  • Real Time Operating Systems (RTOS)
  • Middleware stacks and protocols
  • Module configurators and code generators
  • Source files to integrate with any development environment and third-party tools

Supported Toolchains

Software components in the FSP support following toolchains:

  • e2 studio Integrated Development Environment, with toolchain supports of GCC Arm Embedded and LLVM Embedded Toolchain for Arm
  • IAR Embedded Workbench
  • Arm Keil MDK

Software Installation Instructions

Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions

e2 studio Integrated Development Environment

The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.

e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:

BSP configuration

Configure or change MCU and board-specific parameters from the initial project selection.

Clock Configuration

Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.

Pin Configuration

The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.

Module Configuration

The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.

Interrupt Configuration

Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.

Components Configuration

The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.

QE Tools

QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.

The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.

Other Tool Features

  • Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
  • Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
  • Smart Manual that provides driver and device documentation in the form of tooltips right in the code
  • Edit Hover feature to show detailed descriptions of code elements while editing
  • Welcome Window with links to example projects, application notes and a variety of other self-help support resources
  • Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.

Third Party Tool Support

In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.