Features
- ISL91106 with 3.8A switches
- ISL91106A with 4.2A switches
- Accepts input voltages above or below regulated output voltage
- Automatic and seamless transitions between buck and boost modes
- Input voltage range: 1.8V to 5.5V
- Output current (PVIN = 2.8V, VOUT = 3.3V):
- 2.1A (ISL91106A)
- 2A (ISL91106)
- High efficiency: up to 96%
- 45µA quiescent current maximizes light load efficiency
- 2.5MHz switching frequency minimizes external component size
- Selectable forced PWM mode
- Selectable bypass power saving mode
- Fully protected for over-temperature, overcurrent, and undervoltage
- Small 2.15mmx1.51mm WLCSP
Description
The ISL91106 and ISL91106A are highly integrated buck-boost switching regulators that accept input voltages either above or below the regulated output voltage. Unlike other buck-boost regulators, these regulators automatically transition between operating modes without significant output disturbance. The devices also include a selectable bypass mode for low power consumption in applications that have a sleep or low-power mode.
These devices are capable of delivering up to 2A of output current (PVIN = 2.8V, VOUT = 3.3V) and provide excellent efficiency due to their fully synchronous 4-switch architecture. No load quiescent current of only 45µA also optimizes efficiency under light-load conditions.
The ISL91106 and ISL91106A are designed for standalone applications. They support 3.3V and 3.4V fixed output voltages or variable output voltages with an external resistor divider.
Output voltages as low as 1V or as high as 5.2V are supported using an external resistor divider. The ISL91106 and ISL91106A require only a single inductor and very few external components. Power supply solution size is minimized by a 2.15mmx1.51mm WLCSP and a 2.5MHz switching frequency, which further reduces the size of external components.
Applications
- Smartphones and tablet PCs
- Wireless communication devices
- 2G/3G/4G power amplifiers
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|
| ISL91106IIAZ-T | Obsolete | N/A | Out of Stock | WLCSP-TKCURDL | 15# | Reel | 1 | Yes | Pb-Free Ball Terminal (SAC405)-e1 | -40 to +85°C |
| ISL91106IINZ-T | Obsolete | N/A | Out of Stock | WLCSP-TKCURDL | 15# | Reel | 1 | Yes | Pb-Free Ball Terminal (SAC405)-e1 | -40 to +85°C |
| ISL91106IIQZ-T | Obsolete | N/A | Out of Stock | WLCSP-TKCURDL | 15# | Reel | 1 | Yes | Pb-Free Ball Terminal (SAC405)-e1 | -40 to +85°C |
- White PaperIncreasing mobile device performance—from HD displays to faster processors—has driven higher peak power demands and placed greater electrical and thermal stress on power systems. This paper addresses the challenges of extending battery life and managing heat in smartphones, tablets, and other portable devices. It details how next-generation buck-boost converters can complement PMICs to improve power efficiency, extend Li-ion and Li-polymer battery runtime, and meet strict thermal budgets in advanced mobile designs.
- Application NotePDF 592 KB an9208 Feb 01, 2018AI-generated Summary: The document discusses high frequency power converters, focusing on ZVS-QRC and multi-resonant topologies that reduce switching losses by operating switches at zero voltage. It highlights challenges like EMI and high voltage stress. The SEPIC converter is introduced, explaining its ability to buck or boost voltage without polarity inversion. The document details SEPIC’s operating modes, voltage-current relationships, and the importance of inductor values for continuous or discontinuous conduction modes.
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Recommended Documents (2)
Datasheets (2)
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- White PaperIncreasing mobile device performance—from HD displays to faster processors—has driven higher peak power demands and placed greater electrical and thermal stress on power systems. This paper addresses the challenges of extending battery life and managing heat in smartphones, tablets, and other portable devices. It details how next-generation buck-boost converters can complement PMICs to improve power efficiency, extend Li-ion and Li-polymer battery runtime, and meet strict thermal budgets in advanced mobile designs.
- Application NotePDF 592 KB an9208 Feb 01, 2018AI-generated Summary: The document discusses high frequency power converters, focusing on ZVS-QRC and multi-resonant topologies that reduce switching losses by operating switches at zero voltage. It highlights challenges like EMI and high voltage stress. The SEPIC converter is introduced, explaining its ability to buck or boost voltage without polarity inversion. The document details SEPIC’s operating modes, voltage-current relationships, and the importance of inductor values for continuous or discontinuous conduction modes.
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (4)
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