Features
- Complete switch mode power supply in one package
- Wide input voltage range: 10V to 80V
- Output current 4A
- Programmable soft-start
- Compliant with EN 55022 Class B (see AN1907)
- SYNC and adjustable frequency 200kHz to 600kHz
- Single resistor sets VOUT +2.5V up to +30V
- Setpoint accuracy ±1.5%
- Programmable overcurrent protection
- RoHS compliant with exemption
- Small footprint, low profile (15mm×15mm×3.6mm)
Description
The ISL8216M is a simple and easy to use, high voltage DC/DC module and is ideal for a wide variety of applications. It eliminates design and manufacturing risks while dramatically improving time to market. The simplicity is in the Off-The-Shelf unassisted implementation. All you need is the ISL8216M, input and output capacitors, and one resistor to program the output voltage and you have a complete high voltage power design ready for the market. The ISL8216M is packaged in a thermally enhanced, compact (15mm×15mm×3. 6mm) over-molded High-Density Array (HDA) Package, which permits full load operation without heat sink or fans. The package is suitable for automated assembly by standard surface mount equipment. The small amount of external components reduce the PCB to a component layer and a simple ground layer.
Applications
- Servers
- 48V telecom and datacom applications
- 12V and 42V automotive and industrial equipment
- Distributed power converters and point-of-load (POL)
- regulation
- General purpose step-down DC/DC
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|
| ISL8216MIRZ | Obsolete | N/A | Out of Stock | Module | 22# | Tray | 3 | _none | Nickel/Palladium/Gold-e4 | -40 to +85°C |
| ISL8216MIRZ-T | Obsolete | N/A | Out of Stock | Module | 22# | Reel | 3 | Exempt | Nickel/Palladium/Gold-e4 | -40 to +85°C |
Filters
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- Product Change NoticePDF 119 KB Jun 17, 2021
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- DocumentPDF 1.22 MB tb498 Nov 03, 2016
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (2)
- Product Change NoticePDF 119 KB Jun 17, 2021
Product Notices (PCN, EOL, etc) (2)
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