Features
- Core Configuration Flexibility
- Dual Plane, Single-Phase Controllers
- Uniplane, Two-Phase Controller
- Precision Voltage Regulators
- 0.5% System Accuracy Over-temperature
- Voltage Positioning with Adjustable Load Line and Offset
- Internal Gate Drivers with 2A Driving Capability
- Differential Remote CPU Die Voltage Sensing
- Core Differential Current Sensing: DCR or Resistor
- Northbridge Lossless rDS(ON) Current Sensing
- Serial VID Interface
- Two Wire Clock and Data Bus
- Supports High-Speed I2C
- 0.500V to 1.55V in 12.5mV Steps
- Supports PSI_L Power-Saving Mode
- Core Outputs Feature Phase Shedding with PSI_L
- Adjustable Output-Voltage Offset
- Digital Soft-Start of all Outputs
- User Programmable Switching Frequency
- Static and Dynamic Current Sharing (Uniplane Core)
- Overvoltage, Undervoltage, and Overcurrent Protection
- Pb-Free (RoHS compliant)
Description
The ISL6265C is a multi-output controller with embedded gate drivers. A single-phase controller powers the Northbridge (VDDNB) portion of the CPU. The two remaining controller channels can be configured for two-phase or individual single-phase outputs. For uniplane CPU applications, the ISL6265C is configured as a two-phase buck converter. This allows the controller to interleave channels to effectively double the output voltage ripple frequency, and thereby reduce output voltage ripple amplitude with fewer components, lower component cost, reduced power dissipation, and smaller area. For dual-plane processors, the ISL6265C can be configured as independent single-phase controllers powering VDD0 and VDD1. The heart of the ISL6265C is the patented R3 Technology™, Intersil’s Robust Ripple Regulator modulator. Compared with the traditional buck regulator, the R3 Technology™ has a faster transient response. This is due to the R3 modulator commanding variable switching frequency during a load transient. The Serial VID Interface (SVI) allows dynamic adjustment of the Core and Northbridge output voltages independently and in combination from 0. 500V to 1. 55V. Core and Northbridge output voltages achieve a 0. 5% system accuracy over-temperature. A unity-gain differential amplifier is provided for remote CPU die sensing. This allows the voltage on the CPU die to be accurately regulated per AMD mobile CPU specifications. Core output current sensing is realized using lossless inductor DCR sensing. All outputs feature overcurrent, overvoltage and undervoltage protection.
Applications
- AMD Griffin Platform CPU
- Notebook Core/GPU Voltage Regulators
| Part Number | Status | Samples | Stock | RoHS | Package | Budgetary Price (USD) | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | Temp. Range (°C) | Country of Assembly | Country of Wafer Fabrication |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL6265CHRTZ | Obsolete | N/A | In Stock | RoHS:EN | TQFN | 48# | Tube | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -10 to +100°C | |||
| ISL6265CHRTZ-T | Obsolete | N/A | In Stock | RoHS:EN | TQFN | 48# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -10 to +100°C | |||
| ISL6265CIRTZ | Obsolete | N/A | Out of Stock | RoHS:EN | TQFN | 48# | Tube | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C | |||
| ISL6265CIRTZ-T | Obsolete | N/A | Out of Stock | RoHS:EN | TQFN | 1ku | $4.16 | 48# | Reel | 3 | Yes | Pb-Free 100% Matte Tin Plate w/Anneal-e3 | -40 to +85°C | MALAYSIA | UNITED STATES |
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- Product Change NoticePDF 326 KB May 21, 2021
- Product Change NoticePDF 158 KB PCN21005 Jan 25, 2021
- Product Change NoticePDF 294 KB PCN14036 Jul 08, 2014
- Product Change NoticePDF 169 KB PCN11117 Nov 15, 2011
- Product Change NoticePDF 135 KB PCN10120 Nov 19, 2010
- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Recommended Documents (1)
Datasheets (1)
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- Application NotePDF 397 KB an1684 Jan 19, 2004AI-generated Summary: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- Application NotePDF 509 KB an1681 Jan 19, 2004AI-generated Summary: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
Application Notes & White Papers (2)
- Product Change NoticePDF 326 KB May 21, 2021
- Product Change NoticePDF 158 KB PCN21005 Jan 25, 2021
- Product Change NoticePDF 294 KB PCN14036 Jul 08, 2014
- Product Change NoticePDF 169 KB PCN11117 Nov 15, 2011
- Product Change NoticePDF 135 KB PCN10120 Nov 19, 2010
Product Notices (PCN, EOL, etc) (5)
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