Features
- Specifications per DSCC VID V62/08603-01XB
- Full Mil-Temp Electrical Performance from -55 °C to +125 °C
- Controlled Baseline with One Wafer Fabrication Site and One Assembly/Test Site
- Full Homogeneous Lot Processing in Wafer Fab
- No Combination of Wafer Fabrication Lots in Assembly
- Full Traceability Through Assembly and Test by Date/Trace Code Assignment
- Enhanced Process Change Notification
- Enhanced Obsolescence Management
- Eliminates Need for Up-Screening a COTS Component
- 128 Resistor Taps
- I2C Serial Interface
- Two Address Pins, Up To Four Devices/Bus
- Non-volatile Storage of Wiper Position
- Wiper Resistance: 70Ω Typical at 3.3V
- Shutdown Mode
- Shutdown Current 5µA Max
- Power Supply: 2.7V to 5.5V
- 10kΩ Total Resistance
- High Reliability
- Endurance: 1,000,000 Data Changes Per Bit Per Register
- Register Data Retention:
- 10 years at T ≤ +125 °C
- 15 years at T ≤ +90 °C
- 50 years at T ≤ +55 °C
- 10 Ld MSOP
Description
The ISL22316WMUEP integrates a single digitally controlled potentiometer (DCP) and non-volatile memory on a monolithic CMOS integrated circuit. The digitally controlled potentiometer is implemented with a combination of resistor elements and CMOS switches. The position of the wipers is controlled by the user through the I2C bus interface. The potentiometer has an associated volatile wiper register (WR) and a non-volatile initial value register (IVR) that can be directly written to and read by the user. The contents of the WR control the position of the wiper. At power-up, the device recalls the contents of the DCP's IVR to the WR. The DCP can be used as a three-terminal potentiometer or as a two-terminal variable resistor in a wide variety of applications including control, parameter adjustments, and signal processing. Device Information The specifications for an enhanced product (EP) device are defined in a vendor item drawing (VID), which is controlled by the Defense Supply Center in Columbus (DSCC). Hot links to the applicable VID and other supporting application information are provided on our website.
| Part Number | Status | Samples | Stock | Package | Lead Count (#) | Carrier Type | Moisture Sensitivity Level (MSL) | Pb (Lead) Free | Pb Free Category | MOQ | Temp. Range (°C) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ISL22316WMUEP | Obsolete | N/A | Out of Stock | MSOP | 10# | Tube | 1 | No | Solder Plate | 1500 | -55 to +125°C |
| ISL22316WMUEP-TK | Obsolete | N/A | Out of Stock | MSOP | 10# | Reel | 1 | No | Solder Plate | 2000 | -55 to +125°C |
Filters
Applied Filters
- Manual - Development ToolsPDF 2.16 MB AN1555 Sep 17, 2025
- Product Change NoticePDF 117 KB PCN11059 Jun 17, 2011
- Application NotePDF 251 KB an1699 Jan 19, 2004AI-generated Summary: This document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design, disclaims liability for damages, and prohibits unauthorized modifications or reverse engineering. Products are categorized by quality grades with specific application recommendations. Users must comply with safety, environmental, and export regulations. Renesas disclaims warranties and liability for improper use or noncompliance. Contact information for global sales offices is provided.
- Application NotePDF 338 KB an9867 Nov 10, 1999AI-generated Summary: Electrical parameters are monitored during life testing to detect drift and failures, defined by exceeding datasheet limits. New products require less than 1% failure during burn-in, with failure analysis and corrective actions if exceeded. Sampling plans ensure defect rates below 3%. Life tests last 1000-3000 hours at 125°C depending on process maturity. Failure mechanisms include electromigration, ionic contamination, hot carrier injection, and dielectric rupture. Product sign-off requires all parties' approval after reliability confirmation. Space products undergo burn-in and quality conformance inspections with strict failure limits. Derating is unnecessary as datasheet limits are set at 6-sigma from characterization data, ensuring reliability.
- Application NotePDF 503 KB an9675 Aug 13, 1999AI-generated Summary: Effective Number of Bits (ENOB) depends critically on precise coherence in A/D sampling, with small frequency shifts significantly impacting accuracy. Unwrapping reconstructs coherently sampled sine waves, while windowing controls spectral leakage by shaping the acquisition window. Resampling and interpolation adjust sample sets to avoid leakage in FFT analysis. Different window functions balance side lobe levels and bandwidth, affecting spectral resolution and leakage reduction.
- Application NotePDF 287 KB an9705 Feb 21, 1997AI-generated Summary: Coherent sampling requires the ratio of signal frequency to sampling frequency to be a rational number, expressed as ko/N. When this condition is not met, frequency smearing occurs across bins. Data Acquisition Systems (DAS) can mitigate this by windowing, fixing sampling frequency and tuning input frequency, or fixing input frequency and tuning sampling frequency. The latter two methods are practical for most systems. Pseudo-code illustrates the frequency response for non-integer ko values.
Recommended Documents (1)
Datasheets (1)
- Manual - Development ToolsPDF 2.16 MB AN1555 Sep 17, 2025
Manuals & Guides (1)
- Application NotePDF 251 KB an1699 Jan 19, 2004AI-generated Summary: This document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design, disclaims liability for damages, and prohibits unauthorized modifications or reverse engineering. Products are categorized by quality grades with specific application recommendations. Users must comply with safety, environmental, and export regulations. Renesas disclaims warranties and liability for improper use or noncompliance. Contact information for global sales offices is provided.
- Application NotePDF 338 KB an9867 Nov 10, 1999AI-generated Summary: Electrical parameters are monitored during life testing to detect drift and failures, defined by exceeding datasheet limits. New products require less than 1% failure during burn-in, with failure analysis and corrective actions if exceeded. Sampling plans ensure defect rates below 3%. Life tests last 1000-3000 hours at 125°C depending on process maturity. Failure mechanisms include electromigration, ionic contamination, hot carrier injection, and dielectric rupture. Product sign-off requires all parties' approval after reliability confirmation. Space products undergo burn-in and quality conformance inspections with strict failure limits. Derating is unnecessary as datasheet limits are set at 6-sigma from characterization data, ensuring reliability.
- Application NotePDF 503 KB an9675 Aug 13, 1999AI-generated Summary: Effective Number of Bits (ENOB) depends critically on precise coherence in A/D sampling, with small frequency shifts significantly impacting accuracy. Unwrapping reconstructs coherently sampled sine waves, while windowing controls spectral leakage by shaping the acquisition window. Resampling and interpolation adjust sample sets to avoid leakage in FFT analysis. Different window functions balance side lobe levels and bandwidth, affecting spectral resolution and leakage reduction.
- Application NotePDF 287 KB an9705 Feb 21, 1997AI-generated Summary: Coherent sampling requires the ratio of signal frequency to sampling frequency to be a rational number, expressed as ko/N. When this condition is not met, frequency smearing occurs across bins. Data Acquisition Systems (DAS) can mitigate this by windowing, fixing sampling frequency and tuning input frequency, or fixing input frequency and tuning sampling frequency. The latter two methods are practical for most systems. Pseudo-code illustrates the frequency response for non-integer ko values.
Application Notes & White Papers (4)
- Product Change NoticePDF 117 KB PCN11059 Jun 17, 2011
Product Notices (PCN, EOL, etc) (2)
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