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Arm Cortex-A55 & Dual Cortex-M33 MPU OSM SoM

Overview

Description

This system-on-module (SoM) highlights an industrial gateway based on the RZ/G3S MPU, consisting of a versatile OSM carrier board and a compatible OSM module. Unlike a single board computer (SBC) design, an SoM serves a special function, simplifying baseboard development, reducing costs, and minimizing design risks.

Due to the SoM vendor’s experience in high-speed embedded designs, end customers can focus on their baseboard development, lowering the risk and reducing time to market. Also, using a different OSM module can help to scale/upgrade system performance while not changing the baseboard (choosing an OSM module based on performance requirements). For a growing number of IoT applications, the OSM standard helps to combine the advantages of modular embedded computing with increasing requirements regarding costs, space, interfaces, and reliability (due to soldered connection).

System Benefits:

  • 1.1 GHz Arm® Cortex®-A55 and Dual 250MHz Arm® Cortex®-M33 CPU
  • Ideal for smart gateway applications
  • Enhanced security with tamper detection
  • Expandable connectivity through M.2 Connector (with PCIe)

Comparison

Applications

Block Diagram

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4:3 ratioSheet.458Sheet.420Carrier BoardCarrier BoardCarrier BoardSOMSOMSOMSheet.1Sheet.2Sheet.3Sheet.4EU193EU193EU193Sheet.126Sheet.128Sheet.206Sheet.207Sheet.208Sheet.209Sheet.210Sheet.211Sheet.212Sheet.215Connector 1.154Sheet.244Sheet.247Sheet.248Sheet.250Sheet.251Sheet.252Sheet.275Sheet.276Sheet.277Sheet.279Sheet.280Sheet.284Sheet.285Sheet.396Sheet.397Sheet.399Sheet.400Sheet.402Sheet.403Sheet.405Ref Clock (PCIe)Ref Clock (PCIe)Ref Clock (PCIe) Ref Clock (PCIe)Ref Clock (PCIe)Ref Clock (PCIe)Sheet.408G2, G5:0.9VG2, G5:0.9VG2, G5:0.9VG3, G7, G9, G10: 1.8V, 1.1VG3, G7, G9, G10: 1.8V, 1.1VG3, G7, G9, G10: 1.8V, 1.1VG6: 1.8VG6: 1.8VG6: 1.8VG8: 3:3VG8: 3:3VG8: 3:3VG4: 1.8VG4: 1.8VG4: 1.8VSheet.414Sheet.419Sheet.421Sheet.422Sheet.423Sheet.424Sheet.425Sheet.426Sheet.427Sheet.429Connector 1.154.430Connector 1.154.431Sheet.432Connector 1.154.433Sheet.434Sheet.435Sheet.436InputInput.438Input.439Input.440Input.441 µ USB, 5VµUSB, 5VµUSB, 5V 5-20V5-20V5-20VSheet.446Sheet.447Connector 1.154.448Connector 1.154.449 5V5V5V1.2V1.2V1.2V 1.8V1.8V1.8V 3.3V3.3V3.3VUSB-A, 5VUSB-A, 5VUSB-A, 5V µ SD, 3.3VµSD, 3.3VµSD, 3.3V Sheet.456Sheet.457Sheet.384OMS 1.1 Pin Grid Array, Size “S” 30 x 30 mm2OMS 1.1 Pin Grid Array, Size “S” 30 x 30 mm2OMS 1.1 Pin Grid Array, Size “S” 30 x 30 mm2Sheet.391OMS 1.1 Pin Grid Array, Size “S” 30 x 30 mm2OMS 1.1 Pin Grid Array, Size “S” 30 x 30 mm2OMS 1.1 Pin Grid Array, Size “S” 30 x 30 mm2Sheet.459Sheet.460Power Switch 2Power SwitchPower SwitchPower Switch 3Power SwitchPower SwitchPower Switch 4Power SwitchPower SwitchDC/DC Buck 1DC/DC BuckDC/DC BuckDC/DC Buck 2DC/DC BuckDC/DC BuckDC/DC Buck 3DC/DC BuckDC/DC BuckBi-directional Buck-BoostBi-directional Buck-BoostBi-directional Buck-BoostµSD ConnectorµSD ConnectorµSD ConnectorGPIO HeaderGPIO HeaderGPIO HeaderJTAG ConnectorJTAG ConnectorJTAG ConnectorRJ45 ConnectorRJ-45 ConnectorRJ-45 ConnectorRJ-45 ConnectorRJ-45 ConnectorRJ-45 ConnectorUSB-A ConnectorUSB-A ConnectorUSB-A Connectorµ USB ConnectorµUSB ConnectorµUSB ConnectorµUSB ConnectorµUSB ConnectorµUSB ConnectorUSB-C ConnectorUSB-C ConnectorUSB-C ConnectorM.2 ConnectorM.2 ConnectorM.2 ConnectorEthernet PHYEthernet PHYEthernet PHYEthernet-PHYEthernet PHYEthernet PHYeMMceMMceMMcLPDDR4LPDDR4LPDDR4NOR FlashNOR FlashNOR FlashVersaClockVersaClockVersaClockPMICPMICPMICPower Switch 1Power SwitchPower SwitchMCUMPUMPUMPU UARTUARTUART PCIePCIePCIe QSPIQSPIQSPI USB x2USB x2USB x2 RGMII x2RGMII x2RGMII x2JTAGJTAGJTAG SDIOSDIOSDIOUART CAN 12C, SPI, 12S, PWM, ADCUART CAN 12C, SPI, 12S, PWM, ADCUART CAN 12C, SPI, 12S, PWM, ADC LPDDR4LPDDR4LPDDR4 eMMCeMMCeMMC
Exiting Interactive Block Diagram

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The MSRZG3S is a System-in-Package based on the Renesas RZ/G3S Family architecture, featuring high-performance Arm Cortex-A55 & dual Arm Cortex-M33 cores in an OSM-standard form factor. It combines a compact design with a wide range of services, delivering low power consumption, thermal efficiency, and cost-effectiveness to embedded systems.

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