The ISL6334, ISL6334A control microprocessor core voltage regulation by driving up to 4 interleaved synchronous-rectified buck channels in parallel. This multiphase architecture results in multiplying channel ripple frequency and reducing input and output ripple currents. Lower ripple results in fewer components, lower cost, reduced power dissipation and smaller implementation area. Microprocessor loads can generate load transients with extremely fast edge rates and requires high efficiency at light load. The ISL6334, ISL6334A utilizes Intersil's proprietary Active Pulse Positioning (APP), Adaptive Phase Alignment (APA) modulation scheme, active phase adding and dropping to achieve and maintain the extremely fast transient response with fewer output capacitors and high efficiency from light to full load. The ISL6334, ISL6334A is designed to be completely compliant with Intel VR11. 1 specifications. It accurately reports the load current via IMON pin to the microprocessor, which sends an active low PSI# signal to the controller at low power mode. The controller then enters 1- or 2-phase operation with diode emulation option to reduce magnetic core and switching losses, yielding high efficiency at light load. After the PSI# signal is deasserted, the dropped phase(s) are added back to sustain heavy load transient response and efficiency. Today’s microprocessors require a tightly regulated output voltage position versus load current (droop). The ISL6334, ISL6334A senses the output current continuously by utilizing patented techniques to measure the voltage across the dedicated current sense resistor or the DCR of the output inductor. The sensed current flows out of FB pin to develop the precision voltage drop across the feedback resistor for droop control. Current sensing circuits also provide the needed signals for channel-current balancing, average overcurrent protection and individual phase current limiting. An NTC thermistor’s temperature is sensed via TM pin and internally digitized for thermal monitoring and for integrated thermal compensation of the current sense elements. A unity gain, differential amplifier is provided for remote voltage sensing and completely eliminates any potential difference between remote and local grounds. This improves regulation and protection accuracy. The threshold-sensitive enable input is available to accurately coordinate the start-up of the ISL6334, ISL6334A with any other voltage rail. Dynamic-VID™ technology allows seamless on-the-fly VID changes. The offset pin allows accurate voltage offset settings that are independent of VID setting.

特長

  • Intel VR11.1 compliant
  • Proprietary Active Pulse Positioning (APP) and Adaptive Phase Alignment (APA) modulation scheme
  • Proprietary active phase adding and dropping with diode emulation scheme for high light-load efficiency
  • Precision multiphase core voltage regulation
  • Differential remote voltage sensing
  • ±0.5% Closed-loop system accuracy over load, line and temperature
  • Bi-directional, adjustable reference-voltage offset
  • Precision resistor or DCR differential current sensing
  • Accurate load line (droop) programming
  • Accurate channel-current balancing
  • Accurate load current monitoring via IMON pin
  • Microprocessor voltage identification input
  • Dynamic VID™ technology for VR11.1 requirement
  • 8-Bit VID, VR11 compatible
  • Average overcurrent protection and channel current limit
  • Precision overcurrent protection on IMON pin
  • Thermal monitoring and overvoltage protection
  • Integrated programmable temperature compensation
  • Integrated open sense line protection
  • 1- to 4-phase operation, coupled inductor compatibility
  • Adjustable switching frequency up to 1MHz per phase
  • Package option
  • QFN compliant to JEDEC PUB95 MO-220 QFN (Quad Flat No Leads) package outline
  • Pb-free (RoHS Compliant)

製品選択

製品名 Part Status Pkg. Type Carrier Type MOQ 購入/サンプル
Active QFN Tube 50
Availability
Active QFN Reel 4000
Availability
Active QFN Reel 1000
Availability
Active QFN Tube 50
Availability
Active QFN Reel 4000
Availability

ドキュメント

タイトル language 分類 形式 サイズ 日付
データシート
ISL6334, ISL6334A Datasheet データシート PDF 1.54 MB
ユーザーガイド、マニュアル
ISL6334EVAL1Z User Guide マニュアル PDF 2.35 MB
アプリケーションノート、ホワイトペーパー
AN1620: Speed Up The VR11.1 Design Process With Help From iSIM:PE アプリケーションノート PDF 709 KB
AN1681: Grounding Techniques アプリケーションノート PDF 509 KB
AN1684: Nonideality of Ground アプリケーションノート PDF 397 KB
Five Easy Steps to Create a Multi-Load Power Solution ホワイトペーパー PDF 846 KB
PCN / PDN
PCN20029A - Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products 製品変更通知 PDF 327 KB
PCN16045 - Data Sheet Specification Change for Intersil ISL6334* Listed Products 製品変更通知 PDF 199 KB
PCN15046 - Wafer Fabrication Site Change for Listed Intersil Products - Global Foundry P6 Process transfer to Palm Bay - Phase II 製品変更通知 PDF 398 KB
PCN14036 - Wafer fabrication Site Change for Listed Intersil Products - Palm Bay, Florida 製品変更通知 PDF 294 KB
PCN13063 - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products 製品変更通知 PDF 145 KB
PCN13024B - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products - Canceled for select products 製品変更通知 PDF 243 KB
PCN13024 - Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering - Chung-Li, Taiwan (ASECL 製品変更通知 PDF 183 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump 製品変更通知 PDF 173 KB
PCN11005 - Alternate Manufacturing Site for the Listed Intersil QFN/TQFN Packaged Products - STATS ChipPAC Malaysia 製品変更通知 PDF 153 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia 製品変更通知 PDF 248 KB