Overview

Currently, the development for autonomous driving has progressed and the number of connections between the instrument cluster and various sensors, information, and control devices are increasing. This is leading to an increasing amount of information being displayed on the instrument cluster to realize, including information on the vicinity of the car during driving. At the same time, from the point of view of safety, the need for increased visibility is increasing, and it is necessary to render graphics smoothly. Also, due to advances in LCD display technology, the trends towards larger sizes, higher resolution, and lower costs in automotive LCD displays are progressing. As a result, 3D clusters are becoming more widely used in the instrument cluster field, mainly in high-end cars.

Renesas has released the R-Car D3 automotive system SoC to address smooth rendering of high-quality 3D graphics and reduce development steps and costs, which are challenges for the development of entry-class 3D clusters.

Features
  • Using the PowerVR Series8XE 3D graphics cores from Imagination Technologies' latest series, the R-Car D3 achieves approximately six times the rendering performance of the existing R-Car D1
  • System developers creates 3D clusters using low-cost 4-layer printed circuit boards and reduce the number of parts, that enables reduced system bill of materials (BOM) costs and achieves system costs as low as current 2D cluster systems
  • Renesas is working together with industry-leading partners in the instrument cluster field to provide solutions that will reduce development steps and costs
System Block Diagram

R-Car D3 System Block Diagram

Specification
Item R-Car D3 Specifications
Product No. R-Car D3 (R8A77995)
Power supply voltage 3.3/1.8 V(IO), 2.5V(Ether), 1.5V(DDR3)/1.35V(DDR3L), 1.03V(core)
CPU core Arm®Cortex®-A53
Cache memory L1 Instruction cache:32KB
L1 Operand cache:32KB
L2 cache:128KB
External memory DDR3/DDR3L-SDRAM
・Approved standards:DDR3-1866/DDR3L-1866
・Data bus width:16bit x 1ch
Graphics 3D Graphics Processing Unit
IMG PowerVR Series8XE GE8300
2D Graphics Processing Unit
Video Display Out x 2ch (LVDS x 2 or LVDS + Digital RGB)
Video Input x 1ch (Digital RGB)
Up and down scaling, color conversion, rotate, dithering, sharpness
Distortion compensation module (IMR-LSX4)
Video output check Display Output Compare Unit (DISCOM)
Video-Output-Checker (VOC)
Audio Sampling rate converter x 2ch
Serial sound interface x 2ch
Storage interfaces USB 2.0 host/function interface x 1 port (wPHY)
Multimedia card interface x 1ch
Raw NAND Flash memory interface x 1ch
In car network and
automotive peripherals
Media local bus (MLB) Interface x 1ch (3-pin interface)
Controller area network (CAN-FD support) Interface x 2ch
Ethernet AVB 1.0-compatible MAC built in
Interface: RGMII
Ethernet AVB (802.1BA)
・IEEE802.1BA
・IEEE802.1AS
・IEEE802.1Qav
・IEEE1722
Security Crypto engine (AES, DES, Hash, RSA)
SystemRAM
Other peripherals SYS-DMAC x 24ch, Realtime-DMAC x 8ch
Audio-DMAC x 16ch, Audio(peripheral)-DMAC x 4ch
32bit timer x 26ch
PWM timer x 4ch
I2C bus interface x 4ch
Serial communication interface (SCIF) x 11ch
SPI Multi I/O Bus Controller (RPC) x 2ch (HyperFlash x 1ch support)
Clock-synchronized serial interface (MSIOF) x 4ch (SPI/IIS)
Low power mode Module standby mode
DDR-SDRAM power supply backup mode
Package 401-pin FCBGA 0.8mm pitch (19mm x 19mm)
Development environment ICE for Arm CPU available from tool vendors
Evaluation board A user system development reference platform with the following features is also available to enable the users to carry out efficient system development.
(1) Incorporates car information system-oriented peripheral circuits, providing users with an actual device verification environment.
(2) Can be used as a software development tool for application software, etc.
(3) Allows easy implementation of custom user functions.
Software Platform Support OS: Linux, QNX® Neutrino® RTOS, Integrity® etc.

 

(Remarks) Arm and Cortex are registered trademarks of Arm Limited PowerVR is a trademark of Imagination Technologies Limited. HyperFlash is a trademark of Cypress Semiconductor Corporation. QNX, neutrino and Blackberry are trademarks from BlackBerry Limited, and are used with permission from QNX Software System Limited. Green Hills Software and INTEGRITY are trademarks or registered trademarks of Green Hills Software, Inc. in the U.S. and/or internationally. All names of other products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

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