Overview

Description

Download the Latest FSP v4.0.0

See All FSP Releases & Patches on GitHub

The Renesas Flexible Software Package (FSP) is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA family of Arm Microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.

FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.

FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, included Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions.

Features

  • Small memory footprint HAL drivers
  • Intuitive configurator and code generator
  • Static and dynamic analysis using industry-standard tools
  • Application support using RTOS and non-RTOS environments
  • Azure RTOS and its middleware stacks with Flexible Software Package
    • Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
  • FreeRTOS support – Includes Kernel and set of software libraries
    • FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
  • Tool configurable RTOS resources (Threads, mutexes, etc.)
  • Middleware stacks from Renesas and third parties.
    • TCP/IP and other connectivity protocol stacks including MQTT
    • USB middleware support for CDC, HID, and MSC
    • Wireless connectivity through Cellular (Cat-M1), Wi-Fi and BLE 5.0 (BLE Mesh)
    • File System support with FreeRTOS+FAT and LittleFS
    • Storage (Block Media) support for SDMMC, SPI and USB.
    • Virtual EEPROM on Flash
    • Capacitive touch middleware to implement widgets like Button, Slider and Wheels.
    • Motor control algorithms
    • Secure Bootloader through MCUboot
    • Sensor Module APIs
  • TrustZone support (for applications on CM33 based MCUs)
    • TrustZone enabled drivers and middleware
    • Easy to use tool support for TrustZone configuration
  • PSA Level 2 Certified
  • AWS qualified for FreeRTOS
  • Easy connectivity options to major cloud providers
  • Secure connections through NetX Duo Secure and Mbed TLS
  • Cryptographic APIs and integrated Hardware Acceleration support
    • Arm PSA Cryptographic APIs
    • Azure RTOS NetX Crypto APIs
    • Ultimate security with FSP Crypto APIs (SCE9 protected mode)
    • TinyCrypt targeting constrained devices
  • Graphics interface support and tools
    • Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
    • Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
  • Secure debugging capabilities
  • Extensive tool support from Renesas and leading third-party solutions
  • Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, tool chain and Segger J-Link drivers)
  • Complete source code available through GitHub

Release Information

See latest FSP release information on GitHub.

Target Devices

Documentation

Title Type Date
PDF34.05 MB
Manual - Software
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Manual - Software
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Application Note
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Application Note
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Application Note
PDF2.44 MB 简体中文
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Certificate
PDF7.24 MB日本語
Manual - Development Tools
PDF33.42 MB
Manual - Software
PDF33.13 MB
Manual - Software
PDF32.29 MB
Manual - Software
PDF28.84 MB
Manual - Software
PDF27.16 MB
Manual - Software
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Manual - Software
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Manual - Software
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Manual - Software
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Manual - Software
PDF16.30 MB
Manual - Software
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Manual - Software
PDF24 KB日本語
Technical Update
PDF1.98 MB
White Paper
White Paper
White Paper
White Paper
White Paper
White Paper

Design & Development

Sample Code

Sample Code

Title Type Date
[Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v3.6.0] [Board=EK-RA2A1]
ZIP5.65 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
[Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v3.6.0] [Board=EK-RA2E1]
ZIP3.70 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
ZIP4.23 MB
Sample Code
[Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v3.6.0] [Board=EK-RA2L1]
ZIP6.17 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
ZIP6.30 MB
Sample Code
ZIP16.78 MB
Sample Code
ZIP16.33 MB
Sample Code
ZIP4.62 MB
Sample Code
ZIP10.07 MB
Sample Code
ZIP10.02 MB
Sample Code
The Example Projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M3 kit. [Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v1.0.0] [Board=EK-RA6M3]
ZIP28.25 MB
Compiler: GNU Arm Embedded
IDE: e2 studio, Keil
Sample Code
The Example Projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M3G kit.
ZIP8.82 MB
Compiler: GNU ARM Embedded
IDE: e2 studio, Keil, IAR EWARM
Sample Code
[Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v3.6.0] [Board=EK-RA6M4 ]
ZIP27.92 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
ZIP30.09 MB
Sample Code
ZIP4.69 MB
Sample Code
[Toolchains=GCC Arm Embedded|9.3.1.20200408] [Software=RA FSP|v3.6.0] [Board=FPB-RA6E1]
ZIP6.35 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
ZIP4.48 MB
Sample Code
ZIP4.49 MB
Sample Code
ZIP1.55 MB
Sample Code
ZIP745 KB
Sample Code
This application project discusses the considerations for securing Data at Rest in an embedded system and provides guidelines on how to use the Security MPU hardware feature of the RA Family MCUs to implement a secure Data at Rest solution.
ZIP3.45 MB
Compiler: ARMCC
IDE: e2 studio
Sample Code
ZIP947 KB
Sample Code
This application project is built with the integrated “Azure IoT SDK for Embedded C” package which allows small embedded (IoT) devices like Renesas RA family of MCUs RA6M3, RA6M4, and RA6M5 to communicate with Azure services.
ZIP9.71 MB
IDE: e2 studio
Sample Code
[Toolchains=GCC Arm Embedded|10.3.1.20210824] [Software=RA FSP|v3.7.0] [Board=FPB-RA2E1;FPB-RA2E2]
ZIP2.89 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
ZIP3.84 MB日本語
Application: Consumer Electronics, Industrial
Compiler: GNU ARM Embedded
Function: Communication Interface
IDE: e2 studio
Sample Code
ZIP4.62 MB
Sample Code
The application project uses the Flexible Software Package (FSP) of the RA family|| the GNU GCC compiler|| and the integrated development environment e2 studio IDE to demonstrate an exception handling flow for multiple possible faults.
ZIP2.69 MB
Compiler: GNU ARM Embedded
IDE: e2 studio, Keil
Sample Code
The application example provided in the package uses AWS IoT Core. The detailed steps in this document show first-time AWS IoT Core users how to configure the AWS IoT Core platform to run this application example.
ZIP4.89 MB
IDE: e2 studio
Sample Code
ZIP14.02 MB
Sample Code
Some typical applications for PWM with nanosecond delays are power supply control, motor control, inverter control, battery charging, digital lightning control, and power factor correction (PFC).
ZIP801 KB
IDE: e2 studio
Sample Code
MCUboot is a secure bootloader for 32-bit MCUs. It defines a common infrastructure for the bootloader, defines system flash layout on microcontroller systems, and provides a secure bootloader that enables easy software update [Toolchains=GCC Arm Embedded|9.3.1.20200408] [Software=RA FSP|v3.5.0] [Board=EK-RA6M3;EK-RA6M4]
ZIP22.71 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
[Toolchains=GCC Arm Embedded|9.3.1.20200408] [Software=RA FSP|v3.4.0] [Board=EK-RA2E1]
ZIP5.60 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
ZIP4.16 MB
Sample Code
ZIP4.01 MB
Sample Code
The Renesas Flexible Software Package includes Azure RTOS ThreadX® real-time operating system, the Azure RTOS GUIX library and hardware drivers unified under a single robust software package. [Toolchains=GCC Arm Embedded|9.3.1.20200408] [Software=RA FSP|v3.1.0] [Board=EK-RA6M3G]
ZIP4.97 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
ZIP8.18 MB
Sample Code
ZIP9.12 MB
Sample Code
ZIP3.14 MB
Sample Code
The application example provided in this package uses the Secure Crypto Engine 9 (SCE9) module based on RA6M4 to generate a pair of ECC keys and uses a local CA to generate the device certificate based on the ECC public key.
ZIP8.80 MB
IDE: e2 studio
Sample Code
ZIP3.11 MB
Sample Code
ZIP2.01 MB
Sample Code
The driver for the new module is developed while referencing the existing Wi-Fi driver provided by FSP as a starting point.
ZIP929 KB
IDE: e2 studio
Sample Code
ZIP881 KB
IDE: e2 studio
Sample Code
ZIP2.66 MB
IDE: e2 studio
Sample Code
The application example provided in this package uses the Secure Crypto Engine (SCE) module based on RA6M3 to generate a device identity unique to each device which is securely stored in the internal flash using the Security Memory Protection Unit (MPU) and the Flash Access Window (FAW) hardware features of the MCU.
ZIP16.23 MB
Compiler: ARMCC
IDE: e2 studio
Sample Code
[Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v1.0.0] [Board=EK-RA2A1 ]
ZIP2.28 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
ZIP2.34 MB
Sample Code
ZIP2.30 MB
Sample Code
ZIP2.30 MB
Sample Code
[Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v1.0.0] [Board=EK-RA6M3]
ZIP3.00 MB
Compiler: GNU Arm Embedded
IDE: e2 studio
Sample Code
The Example Projects contained within the bundle show how to write code for the various Renesas Flexible Software Package (FSP) modules supported by the EK-RA6M3G kit.
ZIP2.96 MB
Compiler: GNU ARM Embedded
IDE: e2 studio, Keil
Sample Code

Boards & Kits

Boards & Kits

Videos & Training

e² studio Tips - How to Import Example Project in e² studio for RA

This video shows how to import the Renesas RA Flat project and TrustZone project in e² studio.

e² studio Tips - How to Import Example Project in e² studio for RA
0:00:00 Opening
0:00:14 Flat Project and TrustZone Project
0:00:34 Set up IDE
0:00:54 Download Example Project
0:01:07 Import Flat Project
0:02:44 Import TrustZone Project
0:04:30 e² studio User Guide

Additional Details

Components

  • CMSIS compliant pack files for e2 studio integrated development environment
  • BSPs for RA MCUs and boards
  • HAL drivers to access peripherals
  • Real Time Operating Systems (RTOS)
  • Middleware stacks and protocols
  • Module configurators and code generators
  • Source files to integrate with any development environment and third-party tools

Supported Toolchains

Software components in the FSP support following toolchains:

  • e2 studio Integrated Development Environment, default toolchain is GCC Arm Embedded.
  • IAR Embedded Workbench
  • Arm Keil MDK

Software Installation Instructions

Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions

e2 studio Integrated Development Environment

The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.

e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:

BSP configuration

Configure or change MCU and board-specific parameters from the initial project selection.

Clock Configuration

Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.

Pin Configuration

The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.

Module Configuration

The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.

Interrupt Configuration

Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.

Components Configuration

The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.

QE Tools

QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.

The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.

Other Tool Features

  • Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
  • Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
  • Smart Manual that provides driver and device documentation in the form of tooltips right in the code
  • Edit Hover feature to show detailed descriptions of code elements while editing
  • Welcome Window with links to example projects, application notes and a variety of other self-help support resources
  • Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.

Third Party Tool Support

In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.