close

The EK-RA6M3 evaluation kit enables users to seamlessly evaluate the features of the RA6M3 MCU Group and develop embedded systems applications using the Flexible Software Package (FSP) and e2studio IDE. Utilize rich on-board features along with your choice of popular ecosystem add-ons to bring your big ideas to life.

Getting Started

Running the Quick Start Example Project

  1. The EK-RA6M3 comes pre-programmed with a Quick Start example project (Provided with the example projects bundle).
  2. Power up the EK-RA6M3 board through the debug USB port (J10) using the micro USB device cable connected to a 5V power source. The white power LED will light up.
  3. The Quick Start example project will begin to execute blinking the red, green and blue user LEDs.
  4. Refer to the EK-RA6M3 – Quick Start Guide (PDF) to explore additional functionality of the Quick Start example project.

Developing Embedded Applications

  1. Modifying the Quick Start example project – Refer to the EK-RA6M3 Quick Start Guide for instructions on importing, modifying and building the Quick Start example project
  2. Start with one of the many other example projects (Provided in the example projects bundle) – Choose from many example projects to learn about different peripherals of the RA6M3 MCU Group. These example projects can serve as excellent starting points for you to develop your custom applications.

Building a Custom Hardware

  1. Start by building a functional prototype – Utilize the EK-RA6M3 board with your choice of hundreds of popular ecosystem add-ons.
  2. Build custom hardware – Develop custom hardware by referring to the design and manufacturing information provided in the EK-RA6M3v1 - Design Package (ZIP | English, 日本語)

Certifications

The EK-RA6M3 meets the following certifications/standards. Refer to the EK-RA6M3 user manual for the disclaimer, precautions and more details on the certifications.

EMC/EMI Standards

  • FCC Notice (Class A) – Part 15
  • Innovation, Science and Economic Development Canada ICES-003 Compliance:  CAN ICES-3 (A)/NMB-3(A)
  • CE Class A (EMC Directive 2004/108/EEC)
  • Taiwan Chinese National Standard 13438, C6357 compliance, Class A limits
  • Australia/New Zealand AS/NZS CISPR 32:2015, Class A

Material Selection, Waste, Recycling, and Disposal Standards 

  • EU RoHS
  • China SJ/T 113642014, 10-year environmental protection use period.

Safety Standards

  • UL 94V-0

Features

  • Kit Contents: EK-RA6M3 board, Micro USB device cable (type-A male to micro-B male), Micro USB host cable (type-A male to micro-B male), Ethernet patch cable
  • Special Feature Access
    • Ethernet (RMII and PHY)
    • USB High Speed host and device
    • 32MB External QSPI Flash
  • MCU Native Pin Access
    • R7FA6M3AH3CFC MCU
    • 120MHz, Arm Cortex®-M4 core
    • 2MB Code Flash, 640kB SRAM
    • 176 pins, LQFP package
    • Native pin access through 4x 40-pin male headers
    • MCU and USB current measurement points
  • Ecosystem & System Control Access
    • USB Full Speed host and device
    • Multiple 5V input sources
      • USB (Debug, Full Speed, High Speed)
      • External power supply
    • Debug modes
      • Debug on-board (SWD)
      • Debug In (ETM, SWD & JTAG)
      • Debug Out (SWD)
    • User LEDs and buttons
      • Three user LEDs (red, blue, green)
      • Power LED (white) indicating availability of regulated power
      • Debug LED (yellow) indicating the debug connection
      • Two user buttons
      • One reset button
    • Four most popular ecosystem expansions
    • MCU boot configuration jumper

descriptionDocumentation

Title language Type Format File Size Date
star EK-RA6M3 – Quick Start Guide Quick Start Guide PDF 822 KB
EK-RA6M3 v1 - Errata 日本語 Manual - Development Tools PDF 789 KB
EK-RA6M3 v1 – User's Manual  日本語 Manual - Development Tools PDF 1.46 MB
EK-RA6M3 Example Project Bundle
Related Files: Sample Code
Application Note PDF 102 KB
Getting Started with Low Power Applications Package for RA6M3 and RA4 Groups Application Project Application Note PDF 1.48 MB
- LPM Application Sample Code ZIP 9.12 MB
Getting Started with Low Power Applications Package Application Project Application Note PDF 138 KB
- LPM Application Sample Code ZIP 9.12 MB
RA AWS MQTT/TLS Cloud Connectivity Solution Application Project
Related Files: Sample Code
Application Note PDF 1.74 MB
Renesas RA Family Tracealyzer® for FreeRTOS Debugging Application Note 日本語 Application Note PDF 1.72 MB
Azure RTOS TraceX for Azure RTOS ThreadX Debugging 日本語 Application Note PDF 757 KB
Using MCUboot with RA Family MCUs
Related Files: Sample Code
Application Note PDF 1.65 MB
RA2L1/RA2E1 Group Example of Low Power Application (Data Logger)
Related Files: Sample Code
Application Note PDF 2.45 MB
Partner RTOS Aware Debugging for RA Application Note PDF 830 KB
Securing Data at Rest Utilizing the Renesas Security MPU
Related Files: Sample Code
Application Note PDF 1.48 MB
RA Azure IoT Cloud Connectivity Solution
Related Files: Sample Code
Application Note PDF 1.78 MB
EK-RA6M3 Example Project Overview
Related Files: Sample Code
Application Note PDF 105 KB
RA6M3 Group Flyer 日本語 Flyer PDF 332 KB
An Introduction to Renesas Advanced (RA) MCU Kits Presentation PPSX 35.87 MB
Deep Dive into EK-RA6M3 and EK-RA6M3G Kits Presentation PPSX 20.26 MB
EK-RA6M3v1 - Design Package 日本語 Schematic ZIP 42.48 MB

file_downloadDownloads

Title language Type Format File Size Date
EK-RA6M3 Example Project Bundle - Sample Code
Related Files: Application Note
Sample Code ZIP 22.31 MB
LPM Application Sample Code ZIP 9.12 MB
- Getting Started with Low Power Applications for RA2L1/RA2E1 Group Application Project Application Note PDF 1.15 MB
- Getting Started with Low Power Applications Package for RA6M3 and RA4 Groups Application Project Application Note PDF 1.48 MB
- Getting Started with Low Power Applications Package Application Project Application Note PDF 138 KB
RA AWS MQTT/TLS Cloud Connectivity Solution Application Project - Sample Code Sample Code ZIP 1.72 MB
- RA AWS MQTT/TLS Cloud Connectivity Solution Application Project Application Note PDF 1.74 MB
Using MCUboot with RA Family MCUs Rev.1.00 - Sample Code Sample Code ZIP 2.31 MB
- Using MCUboot with RA Family MCUs Application Note PDF 1.65 MB
RA2L1/RA2E1 Group Example of Low Power Application (Data Logger) Rev.1.00 - Sample Code Sample Code ZIP 2.44 MB
- RA2L1/RA2E1 Group Example of Low Power Application (Data Logger) Application Note PDF 2.45 MB
RA Azure IoT Cloud Connectivity Solution Rev.1.00 - Sample Code Sample Code ZIP 2.01 MB
- RA Azure IoT Cloud Connectivity Solution Application Note PDF 1.78 MB
Securing Data at Rest Utilizing the Renesas Security MPU Rev.1.30 - Sample Code Sample Code ZIP 1.59 MB
- Securing Data at Rest Utilizing the Renesas Security MPU Application Note PDF 1.48 MB
EK-RA6M3 Example Project Overview Rev.1.00 - Sample Code
Related Files: Application Note
Sample Code ZIP 3.00 MB

select_allSoftware & Tool Pages

Title Type Description Company
e² studio IDE and Coding Tool Eclipse-based Renesas integrated development environment (IDE).
[Support MCU/MPU: RA, RE, RX, RL78, RH850, Renesas Synergy, RZ]
(Note: You need to install compiler separately as an additional software)
(Note: No separate e² studio installation required for RA FSP, this will be installed as part of the FSP with e² studio installer (Platform Installer) on GitHub.)
Renesas
Renesas Flash Programmer (Programming GUI) Programmer (Unit/SW) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78KR, 78K0] Renesas
Flexible Software Package (FSP) Software Package FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain and Segger J-Link drivers required to use this software. No additional installations are required.
Renesas