Overview
Description
Download the Latest FSP v4.6.0
See All FSP Releases & Patches on GitHub
The Renesas Flexible Software Package (FSP) is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA family of Arm Microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.
FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.
FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, including Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions. FSP and e² studio can be used free of charge on any Renesas device.
Features
- Small memory footprint HAL drivers
- Intuitive configurator and code generator
- Static and dynamic analysis using industry-standard tools
- Application support using RTOS and non-RTOS environments
- Azure RTOS and its middleware stacks with Flexible Software Package
- Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
- FreeRTOS support – Includes Kernel and set of software libraries
- FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
- Tool configurable RTOS resources (Threads, mutexes, etc.)
- Middleware stacks from Renesas and third parties.
- TCP/IP and other connectivity protocol stacks including MQTT
- USB middleware support for CDC, HID, and MSC
- Wireless connectivity through Cellular (Cat-M1), Wi-Fi and BLE 5.0 (BLE Mesh)
- File System support with FreeRTOS+FAT and LittleFS
- Storage (Block Media) support for SDMMC, SPI and USB.
- Virtual EEPROM on Flash
- Capacitive touch middleware to implement widgets like Button, Slider and Wheels.
- Motor control algorithms
- Secure Bootloader through MCUboot
- Sensor Module APIs
- TrustZone support (for applications on CM33 based MCUs)
- TrustZone enabled drivers and middleware
- Easy to use tool support for TrustZone configuration
- PSA Level 2 Certified
- AWS qualified for FreeRTOS
- Easy connectivity options to major cloud providers
- Secure connections through NetX Duo Secure and Mbed TLS
- Cryptographic APIs and integrated Hardware Acceleration support
- Arm PSA Cryptographic APIs
- Azure RTOS NetX Crypto APIs
- Ultimate security with FSP Crypto APIs (SCE9 protected mode)
- TinyCrypt targeting constrained devices
- Graphics interface support and tools
- Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
- Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
- Secure debugging capabilities
- Extensive tool support from Renesas and leading third-party solutions
- Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, tool chain and Segger J-Link drivers)
- Complete source code available through GitHub
Release Information
For additional information and links go to GitHub.
v4.6.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.6.0.
Minimum e2 studio version for FSP 4.6.0 is e2 studio 2023-07
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_6_0_e2s_v2023-07.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_6_0_e2s_v2023-07.AppImage, from here.
Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_6_0_rasc_v2023-07.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Known Issues
Visit GitHub Issues for this project.
Features Added
- DA16600 Wi-Fi support
Fixes and Improvements
- Platform installer updated to include e2 studio 2023-07
- SEGGER emWin version updated to 6.34
- E2 and E2 Lite version updated to 1.13.2
- Arm® compiler updated to 6.19
- GCC compiler updated to 12.2
- Segger J-Link version updated to 7.88n
- MCUboot updated to 1.10
- Memory optimizations for using on-chip MQTT drivers for DA16XXX modules
- Fixed invalid default clocks on CK-RA6M5
- Added TFM support for RA6M5
- Added CANFD transmit FIFO support (Common FIFOs)
- Improved motor driver support when using two motors
- Fixed issue with filter function in ADC_B Hybrid mode
- Fixed issue with configuring QSPI pins on RA4E1 48-pin devices
Target Devices
Downloads
| Software title | Software type Type | Date Date |
|---|---|---|
| ZIP 74.81 MB | Library | |
| ZIP 265 KB | Library | |
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Synergy Download
Documentation
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Date Date | |
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| PDF 35.80 MB | Manual - Software | ||
| Manual - Software | |||
| PDF 1.86 MB 日本語 | Application Note | ||
| PDF 1.62 MB | Application Note | ||
| PDF 2.75 MB | Application Note | ||
| PDF 172 KB | Application Note | ||
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| PDF 178 KB | Application Note | ||
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| PDF 159 KB | Application Note | ||
| PDF 165 KB | Application Note | ||
| PDF 2.07 MB | Application Note | ||
| PDF 1.96 MB | Application Note | ||
| PDF 1.93 MB 日本語 | Application Note | ||
| PDF 252 KB | Application Note | ||
| PDF 4.02 MB | Application Note | ||
| PDF 3.45 MB | Application Note | ||
| PDF 5.21 MB | Application Note | ||
| PDF 1.92 MB | Application Note | ||
| PDF 4.03 MB | Application Note | ||
| PDF 4.22 MB 日本語 | Application Note | ||
| PDF 181 KB 日本語 | Application Note | ||
| PDF 1.04 MB | Application Note | ||
| PDF 1.21 MB | Application Note | ||
| PDF 2.02 MB | Application Note | ||
| PDF 2.98 MB 日本語 | Application Note | ||
| PDF 1.12 MB | Application Note | ||
| PDF 2.15 MB | Application Note | ||
| PDF 3.82 MB | Application Note | ||
| PDF 3.50 MB | Application Note | ||
| PDF 1.61 MB | Application Note | ||
| PDF 793 KB | Application Note | ||
| PDF 1.74 MB | Application Note | ||
| PDF 2.44 MB 简体中文 | Application Note | ||
| PDF 995 KB | Application Note | ||
| PDF 1.64 MB | Application Note | ||
| PDF 3.00 MB | Application Note | ||
| PDF 2.53 MB | Application Note | ||
| PDF 1.82 MB | Application Note | ||
| PDF 4.37 MB 日本語 | Application Note | ||
| PDF 5.08 MB | Application Note | ||
| PDF 2.24 MB | Application Note | ||
| PDF 2.78 MB | Application Note | ||
| PDF 1.64 MB | Application Note | ||
| PDF 891 KB | Application Note | ||
| PDF 1.78 MB | Application Note | ||
| PDF 1.11 MB | Application Note | ||
| PDF 645 KB | Application Note | ||
| PDF 7.24 MB 日本語 | Manual - Development Tools | ||
| PDF 35.71 MB | Manual - Software | ||
| PDF 35.50 MB | Manual - Software | ||
| PDF 35.19 MB | Manual - Software | ||
| PDF 34.41 MB | Manual - Software | ||
| PDF 34.12 MB | Manual - Software | ||
| PDF 34.05 MB | Manual - Software | ||
| PDF 33.42 MB | Manual - Software | ||
| PDF 33.13 MB | Manual - Software | ||
| PDF 32.29 MB | Manual - Software | ||
| PDF 28.84 MB | Manual - Software | ||
| PDF 27.16 MB | Manual - Software | ||
| PDF 26.47 MB | Manual - Software | ||
| PDF 24.72 MB | Manual - Software | ||
| PDF 24.57 MB | Manual - Software | ||
| PDF 23.77 MB | Manual - Software | ||
| PDF 21.96 MB | Manual - Software | ||
| PDF 21.60 MB | Manual - Software | ||
| PDF 21.64 MB | Manual - Software | ||
| PDF 21.26 MB | Manual - Software | ||
| PDF 20.22 MB | Manual - Software | ||
| PDF 18.60 MB | Manual - Software | ||
| PDF 18.36 MB | Manual - Software | ||
| PDF 17.26 MB | Manual - Software | ||
| PDF 16.30 MB | Manual - Software | ||
| PDF 9.72 MB | Manual - Software | ||
| PDF 1.17 MB 日本語 | Quick Start Guide | ||
| PDF 1.98 MB | White Paper | ||
| PDF 1.38 MB 日本語 , 简体中文 | White Paper | ||
| PDF 196 KB 日本語 , 简体中文 | White Paper | ||
| PDF 178 KB 日本語 , 简体中文 | White Paper | ||
| PDF 169 KB 日本語 , 简体中文 | White Paper | ||
| PDF 660 KB 日本語 , 简体中文 | White Paper | ||
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97 items
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Design & Development
Sample Code
Sample Code
Filters
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|---|---|---|---|
| Title | Type | Date Date | |
| ZIP 3.36 MB | Sample Code | ||
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Some typical applications for PWM with nanosecond delays are power supply control, motor control, inverter
control, battery charging, digital lightning control, and power factor correction (PFC).
ZIP
2.43 MB
IDE:
e2 studio
|
Sample Code | ||
|
The application example provided in this package uses the Secure Crypto Engine 9 (SCE9) module based on RA6M4 to generate a pair of ECC keys and uses a local CA to generate the device certificate based on the ECC public key.
ZIP
10.59 MB
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA2A1]
ZIP
5.21 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA2E1]
ZIP
3.56 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA2E2]
ZIP
3.29 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA2L1]
ZIP
5.00 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
|
Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA4E2]
ZIP
11.70 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA4M1]
ZIP
6.98 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA4M2]
ZIP
17.46 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA4M3]
ZIP
18.36 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA4W1]
ZIP
8.40 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA6E2]
ZIP
12.19 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA6M1]
ZIP
12.94 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA6M2]
ZIP
12.31 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA6M3]
ZIP
30.32 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA6M3G]
ZIP
11.49 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP],[Board=EK-RA6M4]
ZIP
29.85 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=EK-RA6M5]
ZIP
32.34 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=FPB-RA4E1]
ZIP
6.48 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=FPB-RA6E1]
ZIP
8.26 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=MCK-RA4T1]
ZIP
8.88 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=MCK-RA6T2]
ZIP
5.78 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=MCK-RA6T3]
ZIP
8.57 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
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[Software=RA FSP | v4.5.0],[Board=RSSK-RA6T1]
ZIP
5.91 MB
IDE:
e2 studio/GCC/AC6, IAR, Keil MDK
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Sample Code | ||
| ZIP 1.93 MB | Sample Code | ||
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[Software=FSP | v4.4.0]
ZIP
4.40 MB
日本語
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Sample Code | ||
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[Software=FSP|v3.5.0],[Toolchains=GNU Arm Embedded|10.3.1.20210824]
ZIP
5.84 MB
日本語
Application:
Consumer Electronics
IDE:
e2 studio
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Sample Code | ||
| ZIP 17.69 MB | Sample Code | ||
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[Software=FSP|v4.4.0],[Toolchain: GCC ARM Embedded | 10.3.1.20210824]
ZIP
1.87 MB
Compiler:
GNUARM-NONE
IDE:
e2 studio
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Sample Code | ||
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[Software=RA FSP | v4.4.0]
ZIP
4.86 MB
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Sample Code | ||
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[Software=RX Driver Package|V1.37;RA Flexible Software Package|v4.4],[Toolchains=CC-RX|V3.05;GNU Arm Embedded|10.3.1.20210824;GNURX|8.3.0.202202;GNURL|4.9.2.202201]
ZIP
396.01 MB
日本語
Application:
Industrial
Compiler:
CC-RX, GNU ARM Embedded, GNURL78
Function:
Application Example, Communication Interface, Evaluation Kit, Protocol, Software Package
IDE:
e2 studio
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Sample Code | ||
| ZIP 25.33 MB | Sample Code | ||
| ZIP 1.55 MB | Sample Code | ||
| ZIP 745 KB | Sample Code | ||
| ZIP 947 KB | Sample Code | ||
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36 items
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play_circle_filledVideos & Training
e² studio Tips - How to Import Example Project in e² studio for RA
This video shows how to import the Renesas RA Flat project and TrustZone project in e² studio.
e² studio Tips - How to Import Example Project in e² studio for RA
0:00:00 Opening
0:00:14 Flat Project and TrustZone Project
0:00:34 Set up IDE
0:00:54 Download Example Project
0:01:07 Import Flat Project
0:02:44 Import TrustZone Project
0:04:30 e² studio User Guide
Video List
Events & Webinars
News & Blog Posts
| Three Reasons You'll Want to Use Our Flexible Software Package for Your IoT Designs | Blog Post | Nov 15, 2022 | |
| Arm Cortex-M85 Is Here, Is Your IoT Design Ready? | Blog Post | Apr 28, 2022 | |
| The RA MCU Family is Made to Help Solve Your Design Challenges | Blog Post | Sep 25, 2021 | |
| Get Where You’re Going with the Official Renesas RA Family Guide | Blog Post | Jun 29, 2021 | |
| Renesas Extends Support for Microsoft Azure RTOS Across 32-bit MCU Families with Simple Licensing for Secure Embedded IoT Development | News | Jun 15, 2021 |
Additional Details
Components
- CMSIS compliant pack files for e2 studio integrated development environment
- BSPs for RA MCUs and boards
- HAL drivers to access peripherals
- Real Time Operating Systems (RTOS)
- Middleware stacks and protocols
- Module configurators and code generators
- Source files to integrate with any development environment and third-party tools
Supported Toolchains
Software components in the FSP support following toolchains:
- e2 studio Integrated Development Environment, default toolchain is GCC Arm Embedded.
- IAR Embedded Workbench
- Arm Keil MDK
Software Installation Instructions
Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions
e2 studio Integrated Development Environment
The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.
e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:
BSP configuration
Configure or change MCU and board-specific parameters from the initial project selection.
Clock Configuration
Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.
Pin Configuration
The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.
Module Configuration
The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.
Interrupt Configuration
Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.
Components Configuration
The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.
QE Tools
QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.
The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.
Other Tool Features
- Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
- Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
- Smart Manual that provides driver and device documentation in the form of tooltips right in the code
- Edit Hover feature to show detailed descriptions of code elements while editing
- Welcome Window with links to example projects, application notes and a variety of other self-help support resources
- Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.
Third Party Tool Support
In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.