download Download Latest FSP (v5.4.0):

FSP Windows Platform Installer
FSP Linux Platform Installer
FSP macOS Platform Installer
FSP RASC Windows Installer
FSP RASC Linux Installer
FSP RASC macOS Installer

See All FSP Releases & Patches on GitHub

The Renesas Flexible Software Package (FSP) is an enhanced software package designed to deliver user-friendly, scalable, high-quality software for embedded system designs using the Renesas RA family of Arm Microcontrollers, ensuring software compatibility across the RA family, from entry-level to high-performance microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure® RTOS, FreeRTOS™, and other middleware stacks.

FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with Azure RTOS and FreeRTOS integration are included to ease the implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.

FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, including Azure RTOS or FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions. FSP and e² studio can be used free of charge on any Renesas device.


  • Small memory footprint HAL drivers
  • Intuitive configurator and code generator
  • Static and dynamic analysis using industry-standard tools
  • Application support using RTOS and non-RTOS environments
  • Azure RTOS and its middleware stacks with Flexible Software Package
    • Azure RTOS ThreadX, NetX Duo & Add-ons, USBX, GUIX & GUIX Studio, FileX, TraceX, exFAT, LevelX, NetX Duo Secure & NetX Crypto (HW acceleration)
  • FreeRTOS support – Includes Kernel and set of software libraries
    • FreeRTOS Kernel, FreeRTOS-Plus-TCP, Core MQTT, Core HTTP/HTTPS, Task pool, Secure Sockets, Cellular Interface
  • Tool configurable RTOS resources (Threads, mutexes, etc.)
  • Middleware stacks from Renesas and third parties.
    • TCP/IP and other connectivity protocol stacks including MQTT
    • USB middleware support for CDC, HID, and MSC
    • Wireless connectivity through Cellular (Cat-M1), Wi-Fi, and Bluetooth Low Energy LE 5.0 (BLE Mesh)
    • File System support with FreeRTOS+FAT and LittleFS
    • Storage (Block Media) support for SDMMC, SPI, and USB.
    • Virtual EEPROM on Flash
    • Capacitive touch middleware to implement widgets like Button, Slider, and Wheels.
    • Motor control algorithms
    • Secure Bootloader through MCUboot
    • Sensor Module APIs
  • TrustZone support (for applications on CM33-based MCUs)
    • TrustZone enabled drivers and middleware
    • Easy-to-use tool support for TrustZone configuration
  • PSA Level 2 Certified
  • AWS qualified for FreeRTOS
  • Easy connectivity options to major cloud providers
  • Secure connections through NetX Duo Secure and Mbed TLS
  • Cryptographic APIs and integrated Hardware Acceleration support
    • Arm PSA Cryptographic APIs
    • Azure RTOS NetX Crypto APIs
    • Ultimate security with FSP Crypto APIs (SCE9 protected mode)
    • TinyCrypt targeting constrained devices
  • Graphics interface support and tools
    • Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
    • Azure RTOS GUIX and GUIX Studio (available free on Microsoft Apps Store)
  • Secure debugging capabilities
  • Extensive tool support from Renesas and leading third-party solutions
  • Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, toolchain, and Segger J-Link drivers)
  • Complete source code available through GitHub

Release Information

For additional information and links go to GitHub.


Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.4.0.

Minimum e2 studio version for FSP 5.4.0 is e2 studio 2024-04

Download the FSP with e2 studio Windows installer for this release: FSP Windows Platform Installer

Download the FSP with e2 studio Linux AppImage for this release: FSP Linux Platform Installer
Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio MacOS installer for this release: FSP MacOS Platform Installer

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release,
FSP RASC Windows Installer
FSP RASC Linux Installer
FSP RASC macOS Installer

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Features Added

  • Support MacOS RASC build for FSP
  • LLVM updated to version 18.1.3 in platform installer
  • Support for new development kits:
    • FPB-RA4T1
    • FPB-RA6T3
  • Added support for SDRAM as part of BSP
  • Added SMBus support via I2C
  • Added OSPI support to MCUboot for RA8 devices
  • Added support for HDR-DDR mode in I3C for RA8 devices
  • Added option to Fill Flash Gap on RA2 parts (requires -Oz optimization setting)-
  • Added new Renesas CM85 caching documentation (link pending)
  • Bluetooth® Low Energy (LE) module support for DA14535 Bluetooth LE SoC
  • Added custom bitrate support for I2C peripherals
  • PSA Crypto support ED25519 key generation
  • HMAC-SHA 384/512 support for RSIP-E51A Protected Mode
  • DA16xxx improvements:
    • Support for SAU UART peripheral
    • Support for MQTT simultaneous publish/subscribe

Fixes and Improvements

  • Updated Arm® CMSIS to 6.1.0
    • CMSIS-NN updated to 5.0.0
  • Updated MCUboot to 2.0.0
  • Updated Arm Trusted Firmware-M to 2.0
  • Updated Arm Mbed TLS to 3.5.0
  • Updated Azure RTOS to v6.4.0
  • Segger J-Link version updated to 7.96j
  • Common FSP API support updated to v1.6.0
  • RA0/RA2 technical update: RA2A2 Disable RTC register access in BSP startup procedure and Low Power Mode (LPM) to reduce power consumption
  • Code size optimization and new build-time options for the following modules:
    • SAU SPI
    • UARTA
    • TAU PWM
  • Fixed build error in rm_comms_uart
  • Fixed IAR build support for MCUboot projects
  • Fixed build error when r_ioport module name is changed
  • Added property to adjust FreeRTOS configTASK_NOTIFICATION_ARRAY_ENTRIES macro
  • Fixed IAR build warnings in rm_motor_driver
  • Fixed erroneous baud rate constraint message when using SAU UART
  • Fixed devassist for SAU_I2C
  • Fixed compatibility break with CMSIS-DSP in FSP 5.4.0-beta.0
  • SCE/RSIP Changes:
    • Fixed issue related to the DLM state in SCE9 Protected Mode
    • Fixed secp521r1 signature generation corrupts memory in RSIP-E51A Protected Mode
    • Fixed missing 4-byte aligned data in examples for RSIP-E51A Protected Mode
    • Fixed C++ project causes a build error in SCE5 Compatibility Mode
    • Updated RSIP-E51A Protected Mode documentation
  • USB Changes:
    • Fixed callback issue on USBX PHID
    • Fixed connection issue on USB composite (PCDC+PMSC) with FreeRTOS and Bare Metal
    • Fixed build failure when USB_DEBUG_ON option enabled
    • Fixed parameter checking issue on USB Host Composite (CDC and MSC)
    • Removed PLLRESET bit setting in USB initialization process
  • Fixed infinite loop in RPA generation and resolution due to Bluetooth link layer hardware
  • Fixes for Silex Wi-Fi modules:
    • Fixed hard fault when calling Close API
    • Fixed compilation warning when using Azure RTOS and NetXduo
  • Various configuration constraint improvements
  • Fixed DA16XXX issue related to header length check

Known Issues

  • RA0E1:
    • e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
      • Add optimization flags (e.g. `-O0`) manually to "Other optimization flags" to override the `-Oz` setting
    • HS400x, ZMOD4xxx and OB1203 sensors cannot be used on RA0E1
    • FS1015 and FS3000 sensors do not support SAU-I2C driver
  • Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
  • PMSC may not work properly when USBX Composite Device (PCDC+PMSC) is connected to a specific Linux OS (USB Host).


  • RYZ cellular modules are deprecated and will be removed from FSP in a future release

Visit GitHub Issues for this project.

Target Devices


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Design & Development

Sample Code

Related Boards & Kits

Boards & Kits

e² studio Tips - How to Import Example Project in e² studio for RA

This video shows how to import the Renesas RA Flat project and TrustZone project in e² studio.

e² studio Tips - How to Import Example Project in e² studio for RA
0:00:00 Opening
0:00:14 Flat Project and TrustZone Project
0:00:34 Set up IDE
0:00:54 Download Example Project
0:01:07 Import Flat Project
0:02:44 Import TrustZone Project
0:04:30 e² studio User Guide

Additional Details


  • CMSIS compliant pack files for e2 studio integrated development environment
  • BSPs for RA MCUs and boards
  • HAL drivers to access peripherals
  • Real Time Operating Systems (RTOS)
  • Middleware stacks and protocols
  • Module configurators and code generators
  • Source files to integrate with any development environment and third-party tools

Supported Toolchains

Software components in the FSP support following toolchains:

  • e2 studio Integrated Development Environment, with toolchain supports of GCC Arm Embedded and LLVM Embedded Toolchain for Arm
  • IAR Embedded Workbench
  • Arm Keil MDK

Software Installation Instructions

Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions

e2 studio Integrated Development Environment

The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.

e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:

BSP configuration

Configure or change MCU and board-specific parameters from the initial project selection.

Clock Configuration

Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.

Pin Configuration

The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.

Module Configuration

The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.

Interrupt Configuration

Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.

Components Configuration

The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.

QE Tools

QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.

The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.

Other Tool Features

  • Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
  • Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
  • Smart Manual that provides driver and device documentation in the form of tooltips right in the code
  • Edit Hover feature to show detailed descriptions of code elements while editing
  • Welcome Window with links to example projects, application notes and a variety of other self-help support resources
  • Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.

Third Party Tool Support

In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.