The Renesas Flexible Software Package (FSP) is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using the Renesas RA Family of Arm Microcontrollers. With the support of new Arm® TrustZone® and other advanced security features, FSP provides a quick and versatile way to build secure, connected IoT devices using production-ready drivers, FreeRTOS™, and other middleware stacks.

FSP includes best-in-class HAL drivers with high performance and low memory footprint. Middleware stacks with FreeRTOS integration are included to ease the implementation of complex modules like communication and security. The e² studio IDE provides support with intuitive configurators and intelligent code generation to make programming and debugging easier and faster.

FSP uses an open software ecosystem and provides flexibility in using bare-metal programming, included FreeRTOS, your preferred RTOS, legacy code, and third-party ecosystem solutions.

Download the Latest FSP v2.3.0

See All FSP Releases & Patches on GitHub

Features

  • Small memory footprint HAL drivers
  • Intuitive configurator and code generator
  • Static and dynamic analysis using industry standard tools
  • Application support using RTOS and non-RTOS environments
  • FreeRTOS support - latest version integrated with Flexible Software Package
  • Tool configurable RTOS resources (Threads, mutexes, etc.)
  • Middleware stacks from Renesas and third parties.
    • TCP/IP and other connectivity protocol stacks including MQTT
    • USB middleware support for CDC, HID, and MSC
    • Wireless connectivity through Wi-Fi and BLE 5.0
    • File System support with FreeRTOS+FAT and LittleFS 
    • Storage (Block Media) support for SDMMC and USB. 
    • Virtual EEPROM on Flash
    • Capacitive touch middleware to implement widgets like Button, Slider and Wheels.
    • Motor control algorithms
  • TrustZone support (for applications on CM33 based MCUs)
    • TrustZone enabled drivers and middleware
    • Easy to use tool support for TrustZone configuration
  • PSA Level 2 Certified
  • AWS qualified for FreeRTOS
  • Easy connectivity options to major cloud providers
  • Secure connections through Mbed TLS 3.0
  • Arm PSA Cryptographic APIs and integrated Hardware Acceleration support
  • Graphics interface tools using Segger emWin (RA customers can use Segger emWin graphic tools and libraries for free from Downloads below)
  • Secure debugging capabilities
  • Extensive tool support from Renesas and leading third-party solutions
  • Integrated package with all required components for easy setup and starting development (single installer with e2 studio, CMSIS packs, tool chain and Segger J-Link drivers) 
  • Complete source code available through GitHub

Documentation & Downloads

Title Other Languages Type Format File Size Date
User Guides & Manuals
Renesas Flexible Software Package (FSP) v2.3.0 User's Manual – Manual PDF 21.60 MB
Renesas Flexible Software Package (FSP) v2.2.0 User's Manual – Manual PDF 21.64 MB
Renesas Flexible Software Package (FSP) v2.1.0 User's Manual – Manual PDF 21.26 MB
Renesas Flexible Software Package (FSP) v2.0.0 User's Manual – Manual PDF 20.22 MB
Renesas Flexible Software Package (FSP) v1.3.0 User's Manual – Manual PDF 18.60 MB
Renesas Flexible Software Package (FSP) v1.2.0 User's Manual – Manual PDF 18.36 MB
Renesas Flexible Software Package (FSP) v1.1.0 User's Manual – Manual PDF 17.26 MB
Renesas Flexible Software Package (FSP) v1.0.0 User's Manual – Manual PDF 16.30 MB
Renesas Flexible Software Package (FSP) v0.8.0 User's Manual – Manual PDF 9.72 MB
Application Notes & White Papers
RA AWS MQTT/TLS Cloud Connectivity Solution – Application Note PDF 2.13 MB
RSSK-RA6T1 Example Project Bundle – Application Note PDF 98 KB
EK-RA6M4 Example Project Bundle – Application Note PDF 115 KB
EK-RA6M3G Example Project Bundle – Application Note PDF 82 KB
EK-RA6M3 Example Project Bundle – Application Note PDF 110 KB
EK-RA6M2 Example Project Bundle – Application Note PDF 79 KB
EK-RA6M1 Example Project Bundle – Application Note PDF 78 KB
EK-RA4W1 Example Project Bundle – Application Note PDF 72 KB
EK-RA4M1 Example Project Bundle – Application Note PDF 78 KB
EK-RA2A1 Example Project Bundle – Application Note PDF 77 KB
EK-RA4M3 Example Project Bundle – Application Note PDF 73 KB
EK-RA4M2 Example Project Bundle – Application Note PDF 74 KB
EK-RA2L1 Example Project Bundle – Application Note PDF 70 KB
EK-RA2E1 Example Project Bundle – Application Note PDF 69 KB
Getting Started with Low Power Applications Package – Application Note PDF 135 KB
Installing and Utilizing the Cryptographic User Keys using SCE9 – Application Note PDF 1.18 MB
Getting Started with the Wi-Fi Modules on FSP – Application Note PDF 891 KB
Securing Data at Rest Utilizing the Renesas Security MPU – Application Note PDF 1.48 MB
Renesas RA Family Device Lifecycle Management Key Installation – Application Note PDF 2.38 MB
Establishing and Protecting Device Identity using SCE9 and Arm® TrustZone® – Application Note PDF 1.07 MB
RA Azure IoT Cloud Connectivity Solution – Application Note PDF 1.78 MB
High-Performance Motor Control Made Quick and Simple with Optimized Arm Microcontroller, Tools, and Code – White Paper PDF 1.98 MB
The Benefits of Using Arm® TrustZone® in Your Design 日本語, 简体中文 White Paper PDF 1.38 MB
RA Arm® TrustZone® Tooling Primer – Application Note PDF 1.11 MB
Migrating Projects to New FSP Version – Application Note PDF 645 KB
Renesas RA Family Establishing and Protecting Device Identity using SCE7 and Security MPU – Application Note PDF 497 KB
Getting Started with the Graphics Application for RA Family – Application Note PDF 2.78 MB
Arm® Secure Boot Solution for RA6M3 MCU Group – Application Note PDF 281 KB
Secure Internet Communication for IoT Applications 日本語, 简体中文 White Paper PDF 196 KB
Securing your IP and Protecting Sensitive Data 日本語, 简体中文 White Paper PDF 178 KB
Security for the Connected World 日本語, 简体中文 White Paper PDF 169 KB
How to Solve the 6 Top Security Challenges of Embedded IoT Design 日本語, 简体中文 White Paper PDF 660 KB
Downloads
- RA AWS MQTT/TLS Cloud Connectivity Solution - Sample Code – Sample Code ZIP 2.34 MB
- RSSK-RA6T1 Example Project Bundle - Sample Code – Sample Code ZIP 3.68 MB
- EK-RA6M4 Example Project Bundle - Sample Code – Sample Code ZIP 6.97 MB
- EK-RA6M3G Example Project Bundle - Sample Code – Sample Code ZIP 6.53 MB
- EK-RA6M3 Example Project Bundle - Sample Code – Sample Code ZIP 6.64 MB
- EK-RA6M2 Example Project Bundle - Sample Code – Sample Code ZIP 4.84 MB
- EK-RA6M1 Example Project Bundle - Sample Code – Sample Code ZIP 4.70 MB
- EK-RA4W1 Example Project Bundle - Sample Code – Sample Code ZIP 3.15 MB
- EK-RA4M1 Example Project Bundle - Sample Code – Sample Code ZIP 4.38 MB
- EK-RA2A1 Example Project Bundle - Sample Code – Sample Code ZIP 4.05 MB
- EK-RA4M3 Example Project Bundle - Sample Code – Sample Code ZIP 5.19 MB
- EK-RA4M2 Example Project Bundle - Sample Code – Sample Code ZIP 5.01 MB
- EK-RA2L1 Example Project Bundle - Sample Code – Sample Code ZIP 3.72 MB
- EK-RA2E1 Example Project Bundle - Sample Code – Sample Code ZIP 3.10 MB
- LPM Application – Sample Code ZIP 2.72 MB
- Installing and Utilizing the Cryptographic User Keys using SCE9 - Sample Code – Sample Code ZIP 1.22 MB
- Getting Started with the Wi-Fi Modules on FSP - Sample Code – Sample Code ZIP 929 KB
- Securing Data at Rest Utilizing the Renesas Security MPU - Sample Code – Sample Code ZIP 1.59 MB
- Renesas RA Family Device Lifecycle Management Key Installation - Sample Code – Sample Code ZIP 2.23 MB
- Establishing and Protecting Device Identity using SCE9 and Arm® TrustZone® - Sample Code – Sample Code ZIP 8.77 MB
- RA Azure IoT Cloud Connectivity Solution - Sample Code – Sample Code ZIP 2.01 MB
- Arm® Secure Boot Solution for RA6M3 MCU Group - Sample Code – Sample Code ZIP 40.83 MB
Other
Segger emWin v614g - Documentation, Tools and Samples – Library ZIP 94.48 MB
Segger emWin v614d - Documentation, Tools and Samples – Library ZIP 82.99 MB
Segger emWin v614a - Documentation, Tools and Samples 日本語 Other ZIP 79.34 MB
Segger emWin v610f - Documentation, Tools and Samples – Library ZIP 94.64 MB
- Renesas Flexible Software Package (FSP) v1.0.0 User's Manual – Software & Tools - Others ZIP 12.55 MB
TES Dave2D Driver Documentation – Library ZIP 265 KB
Segger emWin v550h - Documentation, Tools and Samples – Library ZIP 54.12 MB
info: For device-specific or order-specific documentation, submit a support request.

Software & Tools

Title Type Description Company
e² studio IDE and Coding Tool Eclipse-based Renesas integrated development environment (IDE). (Note: You need to install compiler separately as an additional software) Renesas
QE for BLE: Development Assistance Tool for Bluetooth® Low Energy Solution Toolkit Debugging support tool that specializes in Bluetooth® low energy system development [Plugin for Renesas IDE "e2 studio"] [Support MCU/MPU: RA, RX, RL78] Renesas
QE for Capacitive Touch: Development Assistance Tool for Capacitive Touch Sensors Solution Toolkit In developing embedded system using the capacitive touch sensor of RA family and RX family MCUs, you can easily setup initial configurations of the touch interface as well as process the tuning of sensors, and reduce development time. [Plugin for Renesas IDE "e2 studio"]
 Renesas

Components

  • CMSIS compliant pack files for e2 studio integrated development environment
  • BSPs for RA MCUs and boards
  • HAL drivers to access peripherals
  • Middleware stacks and protocols
  • Module configurators and code generators
  • Source files to integrate with any development environment and third-party tools

Supported Toolchains

Software components in the FSP support following toolchains:

  • e2 studio Integrated Development Environment, default toolchain is GCC Arm Embedded.
  • IAR Embedded Workbench
  • Arm Keil MDK

Software Installation Instructions

Refer to the FSP GitHub page for installation and usage instructions: FSP GitHub Instructions

e2 studio Integrated Development Environment

The FSP provides a host of efficiency-enhancing tools for developing projects targeting the Renesas RA series of MCU devices. The e2 studio Integrated Development Environment provides a familiar development cockpit from which the key steps of project creation, module selection and configuration, code development, code generation, and debugging are all managed. FSP uses a Graphical User Interface (GUI) to simplify the selection, configuration, code generation and code development of high level modules and their associated Application Program Interfaces (APIs) to dramatically accelerate the development process.

e2 studio is equipped with set of options to configure various aspects of your application project. Some of these options include:

BSP configuration

Configure or change MCU and board-specific parameters from the initial project selection.

Clock Configuration

Configure the MCU clock settings for your project. The Clock Configuration presents a graphical view of the MCU's clock tree, allowing the various clock dividers and sources to be modified.

Pin Configuration

The Pin Configuration provides flexible configuration of the MCU's pins. This configures the electrical characteristics and functions of each port pin. As many pins are able to provide multiple functions, the pin configurator makes it easy to configure the pins on a peripheral basis. The Pin Configuration tool simplifies the configuration of large packages with highly multiplexed pins by highlighting errors and presenting the options for each pin or for each peripheral.

Module Configuration

The Module Configuration provides options to add FSP modules (HAL drivers, Middleware stacks and RTOS) for RTOS and non-RTOS based applications and configure various parameters of the modules. For each module selected, the Properties window provides access to the configuration parameters, interrupt priorities, pin selections etc.

Interrupt Configuration

Interrupt Configuration allows to add new user interrupts or events and set interrupt priorities. This will also allow the user to bypass a peripheral interrupt and have user-defined ISRs for the peripheral interrupts.

Components Configuration

The Components configuration enables the individual modules required by the application to be included or excluded. All modules that are necessary for the modules added to the application are included automatically. You can easily include or exclude additional modules by ticking the box next to the required component.

QE Tools

QE for Capacitive Touch is an assistance tool for applications which operate under the e2 studio. For the development of embedded systems that work with capacitive touch sensors, this tool simplifies the initial settings of the touch user interface and the tuning of the sensitivity, thus shortening developing times.

The QE for BLE is a dedicated tool for developing embedded software in systems which support the Bluetooth®low energy protocol stack. This solution toolkit runs in the e2 studio integrated development environment. The combination of the e2 studio and QE for BLE makes it easy to test the communications features of Bluetooth®low energy.

Other Tool Features

  • Context-sensitive Autocomplete feature that provides intelligent options for completing a programming element
  • Developer Assistance tool for selection of and drag and drop placement of API functions directly in application code
  • Smart Manual that provides driver and device documentation in the form of tooltips right in the code
  • Edit Hover feature to show detailed descriptions of code elements while editing
  • Welcome Window with links to example projects, application notes and a variety of other self-help support resources
  • Information Icon for each module is provided in the graphic configuration viewer that links to specific design resources for that module in the user manual.

Third Party Tool Support

In addition to the Renesas e2 studio IDE, FSP supports third party tools and IDEs as well. This support is provided through RA Smart configurators (RASC) application. The Renesas RA Smart Configurator is a desktop application that allows you to configure the software system (BSP, drivers, RTOS and middleware) for a Renesas RA microcontroller when using a 3rd-party IDE and toolchain. The RA Smart Configurator can currently be used with IAR Embedded Workbench, Keil MDK and the Arm compiler 6 toolchains.

Evaluation Kits

EK-RA2A1, RTK0EG0022S01001BJ, EK-RA2L1, EK-RA4M1, EK-RA4M3, EK-RA4W1, EK-RA6M1, EK-RA6M2, RTK0EG0021S01001BJ, EK-RA6M3, EK-RA6M3G, EK-RA6M4, RTK0EMA170S00020BJ, EK-RA2E1, EK-RA4M2