Learn more about Renesas' packaging technology

Renesas Electronics' package technology makes its semiconductor products more functional, faster, and smaller, which enables multi-functional, high-speed solutions as well as compact, high-density mounting for space limited applications.


Explanation of basic functions and variations:

Technical Information

Reference for designers and process engineers in electronic equipment:


The mounting manuals describe mounting and handling methods for semiconductor devices with the aim of enabling you to execute skillful mounting while maintaining the high reliability of the products.

Type Date
PDF 10.28 MB 日本語 , 简体中文 Other
PDF 1.02 MB 日本語 Other
PDF 3.19 MB 日本語 , 简体中文 Other
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