Learn more about Renesas' packaging technology

Renesas Electronics' package technology makes its semiconductor products more functional, faster, and smaller, which enables multi-functional, high-speed solutions as well as compact, high-density mounting for space limited applications.

Basics

Explanation of basic functions and variations:

Technical Information

Reference for designers and process engineers in electronic equipment:

Package and Packing Outline

Documentation

The mounting manuals describe mounting and handling methods for semiconductor devices with the aim of enabling you to execute skillful mounting while maintaining the high reliability of the products.

Title Type Date
LGA Mounting Manual
PDF1.02 MB日本語
Manual - Hardware
Semiconductor Package Mount Manual
PDF10.28 MB日本語, 简体中文
Other
QFN Mounting Manual
PDF3.19 MB日本語, 简体中文
Other