Learn more about Renesas' packaging technology

Renesas Electronics' package technology makes its semiconductor products more functional, faster, and smaller, which enables multi-functional, high-speed solutions as well as compact, high-density mounting for space limited applications.

Basics

Explanation of basic functions and variations:

Technical Information

Reference for designers and process engineers in electronic equipment:

Semiconductor Package Mount Manual

This online manual describes mounting and handling methods for semiconductor devices with the aim of enabling you to execute skillful mounting while maintaining the high reliability of the products.

Semiconductor Package Mount Manual (PDF | English, 日本語)

QFN Mounting Manual (PDF | English, 日本語)

LGA Mounting Manual (PDF | English, 日本語)