The Intersil HCS244MS is a radiation hardened non-inverting octal buffer/line driver, three-state, with two active-low output enables. The HCS244MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of the radiation hardened, high-speed, CMOS/SOS logic family. The HCS244MS is supplied in a 20-lead ceramic flatpack (K suffix) or an SBDIP package (D suffix).

Features

  • 3 micron radiation hardened CMOS SOS
  • Total dose 200K RAD (Si)/s
  • SEP effective LET no upsets: >100 MEV-cm2/mg
  • Single Event Upset (SEU) immunity <2 x 10-9 errors/bit-day (Typ)
  • Dose rate survivability: >1 x 1012 RAD (Si)/s
  • Dose rate upset >1010 RAD (Si)/s 20ns pulse
  • Latch-up free under any conditions
  • Fanout (over temperature range)
  • Bus driver outputs - 15 LSTTL loads
  • Military temperature range: -55 °C to +125 °C
  • Significant power reduction compared to LSTTL ICs
  • DC operating voltage range: 4.5V to 5.5V
  • Input logic levels
  • VIL = 0.3 VCC Max
  • VIH = 0.7 VCC Min
  • Input current levels Ii ≤ 5µA at VOL, VOH

Product Options

Part Number Part Status Pkg. Type Carrier Type DLA SMD Buy Sample
HCS244DMSR
Active SBDIP Tube 5962R9573101VRC
Availability
HCS244KMSR
Active CFP Tray 5962R9573101VXC
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
HCS244MS Datasheet Datasheet PDF 541 KB
Application Notes & White Papers
Wafer by Wafer Low Dose Rate Acceptance White Paper White Paper PDF 533 KB
AN9867: End of Life Derating: A Necessity or Overkill Application Note PDF 338 KB
PCNs & PDNs
PCN10123 - Alternate Die Attach Material for Assembly of Intersil Hermetic Packaged Products - Intersil Palm Bay, FL. (ISP) Product Change Notice PDF 230 KB
Other
Intersil Space Products Brochure Brochure PDF 3.14 MB
PIN19011 - Price Increase for the Listed Renesas Electronics America (REA) Radiation Hardened Space Products Price Increase Notice PDF 360 KB
Standard Microcircuit Drawing 5962-95731 (HCS244MS) Other 0 KB
Intersil Commercial Lab Services Brochure PDF 364 KB
PA11003 - Packing Method Change for Intersil TO-xx Metal Can and Flat Pack Packaged Products Product Advisory PDF 499 KB

News & Additional Resources