Title Information
Pkg. Name
Name used to describe Renesas packages.
 W4X4.16C
Pkg. Previous Code
Package code maintained as part of the Renesas and Intersil merger.
 WDA
Package Description
Descriptive text for this package.
 16 Ball WLCSP, 4x4 ARRAY, 0.5mm Pitch-(ASE), Chung-Li, Taiwan
Package Status
 Active
Package Type
 WLCSP-TCURDL
Class
 PLASTIC
Package Code
The unique identifier of this package.
 WDA
Category
 PLASTIC
Lead Count
 16
Pb (Lead) Free
 Yes
Length
 2.16mm
Width
 2.16mm
Thickness
Seated height or Package height
(Please check the outline drawing)
 0.6mm
Pitch
 0.5mm
Pkg. Dimensions (mm)
Package Dimensions. Example: 5 x 7 x 0.5
 2.16 x 2.16 x 0.60

Documentation
Type Title Date
Package Outline Drawing
W4X4.16C: 4x4 Array 16 Ball Wafer Level Chip Scale Package (WLCSP)
PDF 68 KB
1 item