Bluetooth Low Energy (LE) Lineup

IC Products

Product CPU Core LE Data Length Extension 2Mbps Mode LE Coded PHY Mode Low Power Operation Feature
RX23W RX Supported Supported Supported Low Power Bluetooth Mesh, Touch, Security, USB
RA4W1 Arm® Supported Supported Supported Low Power Touch, Security, USB
RE01B Arm® Supported Supported Supported Ultra-Low Power Energy Harvest Control Circuit
RL78/G1D RL78 Not Supported Not Supported Not Supported Low Power Low Power in the System, Beacon

Module Products

Product CPU Core Module Size Feature
RX23W RX 6.1mm x 9.5 mm Bluetooth Mesh, Touch, Security, USB
RL78/G1D RL78 8.95mm x 13.35mm Low Power in the System, Beacon

RX 32-Bit LE MCU

The RX23W 32-bit LE MCU offers the full functions of Bluetooth 5.0 LE and the built-in security functions essential to IoT devices, as well as rich peripheral features such as touch keys, USB and CAN. As a result, system control for devices and wireless communication can be realized on a single chip. The RX23W also provide a dedicated library that complies with the Bluetooth Mesh Networking specification for multipoint-to-multipoint communication. Renesas also has a lineup of the world's smallest module products with built-in antennas and oscillators.

RA 32-Bit LE MCU

The RA4W1 32-bit MCU incorporate Bluetooth 5.0 LE, a secure crypto engine and low power functionality essential for any IoT application. The RA4W1 also features a rich set of peripheral features such as a capacitive touch sensing unit (CTSU) and a segment LCD controller (SLCDC), making it ideal for wireless applications that use a human machine interface (HMI).

RE 32-Bit LE MCU

The RE01B 32-bit LE MCU offers the full functions of Bluetooth 5.0 LE, large memory footprint (1.5MB Flash memory/256KB SRAM), an energy harvesting control circuit, ultra-low power consumption 14-bit ADC, and built-in security functions. RE01B is suitable for many different battery-driven IoT applications due to its ultra-low power and high-speed operation. It uses SOTB™ technology, which enables the device to operate at low voltages.

RL78 16-Bit LE MCU

The RL78/G1D low-power 16-bit MCU support Bluetooth LE and enable reliable connections with current consumption levels among the lowest in the industry. We also have a "beacon stack" that pursues low current consumption. We also provide a module that can use the abundant function pins of the RL78/G1D as it is, with a built-in antenna and RF circuit.

RX23W Chip and Module
Chip (RA4W1)
RE01B Chip
Chip (RL78/G1D)

The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by Renesas Electronics is under license.


Bluetooth LE wireless technology


Bluetooth LE wireless technology is designed for very low power operation and is optimized to short burst data transmission. In order to achieve reliable communication in the 2.4GHz frequency band, it employs a robust frequency hopping spread spectrum method that transmits data over 40 channels.

The Bluetooth LE wireless technology provides great flexibility to developers with data rates from 125Kb/s to 2Mb/s, multiple PHY options that support power levels from 1mW to 100mW, and multiple high-level security options required by government agencies.

LE supports multiple network topologies such as "Point-to-Point" used for data transfer, "Broadcast" used for location services, and "Mesh" used for building large-scale device networks.

Bluetooth Logo Medium

Bluetooth Low Energy (LE)

Frequency Band 2.4GHz ISM band (2.402GHz – 2.480GHz utilized)
Channels 40 channels with 2MHz spacing
(3 advertising channels/37 data channels)
Channel Usage Frequency-Hopping Spread Spectrum (FHSS)
Modulation GFSK
Power Consumption ~0.01x to 0.5x of reference
(depending on use case)
Data Rate LE 2M PHY: 2Mb/s
LE 1M PHY: 1Mb/s
LE Coded PHY (S=2): 500Kb/s
LE Coded PHY (S=8): 125Kb/s
Max Tx Power Class 1: 100mW (+20dBm)
Class 1.5: 10mW (+10dbm)
Class 2: 2.5mW (+4dBm)
Class 3: 1mW (0dBm)
Network Topologies Point-to-Point (including piconet)

The benefit of LE is that it can communicate with applications for smartphones or tablets. LE is already used in many applications such as for healthcare and fitness, home electric appliances, home automation, gadgets, accessories, and location systems.

The Bluetooth wireless technology includes the LE standard and the BR/EDR standard that supports the Basic Rate and Enhanced Data Rate that are the classic standards.

Devices are classified into types that support LE only, BR/EDR only, and both LE and BR/EDR.

Renesas devices (RX23W, RA4W1, RE01B, RL78/G1D) are the types that support only LE.

Renesas Bluetooth Microcontrollers

Applications using Bluetooth LE wireless technology have spread from healthcare devices and continue to expand into a wide variety of fields such as sports and fitness, smart homes, industrial equipment, and beacon applications.

Bluetooth Low Energy Applications

Bluetooth Qualification

The Bluetooth Special Interest Group (SIG) oversees the development of Bluetooth standards and the licensing of the Bluetooth wireless technologies and trademarks to manufacturers.

Refer to the "Bluetooth LE microcomputer / module Bluetooth qualification acquisition Application Note Rev.1.40 (PDF | English, 日本語)" application note for how to register a product using the Qualified Design Identification number (QDID) of our qualified design when selling a device equipped with a Renesas Bluetooth LE microcomputer or module as a Bluetooth product.

iOS/Android Application - GATTBrowser

The GATTBrowser smartphone application can be downloaded from the Apple App Store and Google Play.

The GATTBrowser app is used to check Bluetooth LE behavior. It can scan LE devices which are advertising in the vicinity and can perform GATT-based communication with the connected LE device. You can easily check the sample application behavior. GATTBrowser assists in the development of products that implement the Renesas Bluetooth LE microcomputer and module.

GATTBrowser Application

Smartphone Application: TryBT

TryBT is a smartphone sample application that supports features for communicating with Bluetooth LE products. You can check communication with the firmware preinstalled in Target Board for RX23W. Also, you can use RA4W1 and RE01B, too.
In addition, icon images as well as a project for Android Studio and source code are provided, so you can use this sample application as a base for developing Bluetooth LE communication application in a proof-of-concept phase.

RX23W Group Smartphone Application TryBT for Android Rev.1.00 - Sample Code (ZIP | English, 日本語)

Smartphone App: TryBT

Related Software

MCU Title Part Number
RL78/G1D Bluetooth Low Energy Protocol Stack for RL78 Family RTM5F11A00NBLE0F10RZ
RL78/G1D QE for BLE: Development Assistance Tool for Bluetooth Low Energy -
RX23W Bluetooth Low Energy Protocol Stack for RX family RTM5F523W0NBLE0F22JZ
RX23W QE for BLE: Development Assistance Tool for Bluetooth Low Energy -
RA4W1 Flexible Software Package (FSP) -
RA4W1 QE for BLE: Development Assistance Tool for Bluetooth Low Energy -
RE01B Bluetooth Low Energy Protocol Stack for RE family -
RE01B QE for BLE: Development Assistance Tool for Bluetooth Low Energy -

memoryBoards & Kits

Part Number Title Type Company
RTK0EN0001D01001BZ RL78/G1D Evaluation Board Evaluation Renesas
RX-Family-Target-Board Target Board for RX family Evaluation Renesas
RX23W-Starter-Kit Renesas Solution Starter Kit for RX23W Starter Renesas
EK-RA4W1 Evaluation Kit for RA4W1 MCU Group Evaluation Renesas
RTKYRLG1D0B00000BJ RL78/G1D BLE Module Expansion Board Evaluation Renesas
RTK5RX23W0C00000BJ Target Board for RX23W Evaluation Renesas
RTK5RX23W0C01000BJ Target Board for RX23W Module Evaluation Renesas
EB-RE01B RE01B MCU Bluetooth® Low Energy Evaluation Board Evaluation TESSERA Technology Inc.