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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation)
QDRII/DDRII/ QDRII+/DDRII+ SRAM

パッケージ情報

Pkg. Type:LBGA
Pkg. Code:pkg_6857
Lead Count (#):165
Pkg. Dimensions (mm):15 x 13 x 1.4
Pitch (mm):1

環境及び輸出分類情報

RoHS (R1QLA7218ABB-25IB0)英語日本語
Pb (Lead) Free
Moisture Sensitivity Level (MSL)
ECCN (US)
HTS (US)

製品スペック

Pkg. TypeLBGA
Carrier TypeTray
ArchitectureDDR-II+ CIO with ODT
Burst Length (Words)2
Data Width (bits)18000
Density (Kb)72000
Frequency (Max) (MHz)400
Lead CompliantYes
Lead Count (#)165
Length (mm)15
MIN Frequency (MHz)250
Pkg. Dimensions (mm)15 x 13 x 1.4
Read Latency (Clock)2
Tape & ReelNo
Thickness (mm)1.4
Width (mm)13

説明

Support is limited to customers who have already adopted these products.