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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation)
QDRII/DDRII/ QDRII+/DDRII+ SRAM

パッケージ情報

Pkg. Type:LBGA
Pkg. Code:pkg_6857
Lead Count (#):165
Pkg. Dimensions (mm):15 x 13 x 1.4
Pitch (mm):1

環境及び輸出分類情報

RoHS (R1Q2A3636CBB-40IB0)英語日本語
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

製品スペック

Pkg. TypeLBGA
Carrier TypeTray
ArchitectureQDR-II
Burst Length (Words)2
Data Width (bits)36000
Density (Kb)36000
Frequency (Max) (MHz)250
Lead CompliantNo
Lead Count (#)165
Length (mm)15
MIN Frequency (MHz)120
MOQ1
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
Pkg. Dimensions (mm)15 x 13 x 1.4
Read Latency (Clock)1.5
Replacement ProductRMQS2A3636DGBA-332#AC0
Tape & ReelNo
Thickness (mm)1.4
Width (mm)13

説明

Support is limited to customers who have already adopted these products.