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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation) - 6月はプライド月間として、LGBTQ+の権利や文化、コミュニティについて啓発する世界的な活動月間です
Multi-Core Bluetooth 5.2 SoC with System Power Management Unit

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:VFBGA
Pkg. Code:
Lead Count (#):86
Pkg. Dimensions (mm):6 x 6 x 0.82
Pitch (mm):0.55

環境及び輸出分類情報

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
RoHS (DA14691-00000HQ2)ダウンロード
ECCN (US)
HTS (US)

製品スペック

Lead Count (#)86
Carrier TypeTape & Reel
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
Temp. Range (°C)-40 to +85°C
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
2MbpsSupported
ADC10-bit x 8-ch, 14-bit x 8-ch
AoASupported
AoDTX Supported
ApplicationGeneral purpose connectivity MCU, ATLAS, Asset tracking, Connected health, Proximity tags & trackers, Wireless Ranging (WiRa)
Bluetooth® MeshNot Supported
CPUM33F
Clock Rate (MHz)96
Execute from FLASHYes
Extended AdvertisingSupported
External Rails and Load Capacity3x 1.8V @ 50mA each
Flexible System ClockYes
GATT CachingNot Supported
GPIOs (#)44
Hardware Crypto EngineYes
I2C (#)2
Integrated Battery ChargerNo
Integrated DCDCSIMO Buck DC-DC converter
LE Coded PHY (Long Range)Not Supported
LE Data Length ExtensionsSupported
Longevity2034 1月
MCU/MPUM33
MOQ4000
Memory Size (OTP) (KB)4
Operating Freq (Max) (MHz)96
Output Power Range (dBm)-18 - 6
Periodic AdvertisingSupported
Pitch (mm)0.55
Pkg. Dimensions (mm)6 x 6 x 0.82
Pkg. TypeVFBGA
Price (USD)$5.37264
Proprietary 2G4 protocolYes
QSPI Interface (#)1
Qty. per Reel (#)4000
RAM (KB)384KB
ROM (KB)128
Recommended for new DesignsYes
Rx current (mA)1.8
SPI (#)2
Sensitivity (dBm) (dBm)-97
Tx Current (mA)3
UART (#)3
USB Ports (#)1
Vcc (V)2.4-5.75
Wireless StandardBLE 5.2 Core specification + optional features

説明

The SmartBond™ DA1469x family of Bluetooth® Low Energy solutions features advanced multi-core microcontroller units designed for robust wireless connectivity. Building on the success of Renesas' SmartBond line, these units include three additional cores, enhancing processing power, resources, range, and battery life. This expanded capability supports a variety of consumer applications, including high-end fitness trackers, sophisticated smart home devices, and immersive virtual reality game controllers.

Powered by the Arm® Cortex®-M33 processor, the DA1469x products deliver superior processing performance, catering to demanding applications. They also support the latest Bluetooth Low Energy 5.2 protocol and proprietary 2.4GHz deployment, facilitating precise Real-Time Locating Systems (RTLS) and low-latency communications. The inclusion of a Sensor Node Controller (SNC) allows for autonomous sensor data processing, further enhancing device functionality.

The DA1469x family is equipped with a state-of-the-art Power Management Unit (PMU) that optimizes energy efficiency by selectively activating processing cores only when needed. This integration eliminates the requirement for a separate PMIC, thereby reducing system size and enhancing overall performance. It supports complex applications while maintaining extremely low power consumption for energy‑constrained designs. Software‑programmable protocols, rich user experiences, and banking‑level security help future‑proof products while reducing Bill of Materials (BOM) cost and PCB footprint.