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ルネサス エレクトロニクス株式会社 (Renesas Electronics Corporation)
CMOS Quad 3 State R/S Latch

パッケージ情報

CADモデル:View CAD Model
Pkg. Type:CFP
Pkg. Code:KBG
Lead Count (#):16
Pkg. Dimensions (mm):10.4 x 6.9 x 0.00
Pitch (mm):1.3

環境及び輸出分類情報

Moisture Sensitivity Level (MSL)Not Applicable
Pb (Lead) FreeExempt
ECCN (US)
HTS (US)

製品スペック

Pkg. TypeCFP
Lead Count (#)16
Carrier TypeTray
Moisture Sensitivity Level (MSL)Not Applicable
Pitch (mm)1.3
Pkg. Dimensions (mm)10.4 x 6.9 x 0.00
DLA SMD5962R9663401VXC
Pb (Lead) FreeExempt
Pb Free CategoryGold Plate over compliant Undercoat-e4
MOQ25
Temp. Range (°C)-55 to +125°C
DSEE (MeV·cm2/mg)75
Length (mm)10.4
Qualification LevelQML Class V (space)
RatingSpace
TID HDR (krad(Si))100
TID LDR (krad(Si))ELDRS free
Width (mm)6.9

説明

The CD4043BMS devices are quad cross-coupled 3-state CMOS NOR latches and the CD4044BMS devices are quad cross-coupled 3-state CMOS NAND latches. Each latch has a separate Q output and individual Set and Reset inputs. The Q outputs are controlled by a common Enable input. A logic 1 or high on the Enable input connects the latch states to the Q outputs. A logic 0 or low on the Enable input disconnects the latch states from the Q outputs; this results in an open circuit feature allowing for common busing of the outputs. The CD4043BMS and CD4044BMS are supplied in these 16- lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1C (CD4043BMS) and HIE (CD4044BMS), and Ceramic Flatpack H3X (CD4043BMS) and H6W (CD4044BMS).